SLLS657E April   2005  – October 2022 MAX3243E

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  ESD Ratings - IEC Specifications
    4. 7.4  Recommended Operating Conditions
    5. 7.5  Thermal Information
    6. 7.6  Electrical Characteristics
    7. 7.7  Driver Electrical Characteristics
    8. 7.8  Receiver, Electrical Characteristics
    9. 7.9  Auto-Powerdown Electrical Characteristics
    10. 7.10 Driver Switching Characteristics
    11. 7.11 Receiver Switching Characteristics
    12. 7.12 Auto-Powerdown Switching Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 ESD Protection
          1. 10.2.2.1.1 ESD Test Conditions
          2. 10.2.2.1.2 Human Body Model (HBM)
          3. 10.2.2.1.3 IEC61000-4-2 (Formerly Known as IEC1000-4-2)
          4. 10.2.2.1.4 Machine Model
    3. 10.3 Power Supply Recommendations
    4. 10.4 Layout
      1. 10.4.1 Layout Example
        1.       Device and Documentation Support
          1. 11.1 Receiving Notification of Documentation Updates
          2. 11.2 Support Resources
          3. 11.3 Trademarks
          4. 11.4 Electrostatic Discharge Caution
          5. 11.5 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.5 Thermal Information

THERMAL METRIC(1){DB} (SSOP){DW} (SOIC){PW} (TSSOP){RHB} (VQFN) UNIT
28 PINS28 PINS28 PINS32 PINS
RθJAJunction-to-ambient thermal resistance76.159.070.334.1°C/W
RθJC(top)Junction-to-case (top) thermal resistance35.828.821.025.9°C/W
RθJBJunction-to-board thermal resistance37.430.329.214.6°C/W
ψJTJunction-to-top characterization parameter7.47.81.30.5°C/W
ψJBJunction-to-board characterization parameter37.030.028.814.6°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistanceN/AN/AN/A5.1°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.