SLLS098D May   1980  – March 2024 MC3487

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Thermal Information
    4. 5.4 Electrical Characteristics
    5. 5.5 Switching Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Device Functional Modes
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • NS|16
  • N|16
  • D|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.3 Thermal Information

THERMAL METRIC(1)D (SOIC)N (PDIP)NS (SOP)UNIT
16-PINS
R θJAJunction-to-ambient thermal resistance 84.660.688.5°C/W
RθJC(top)Junction-to-case (top) thermal resistance43.548.146.2°C/W
R θJBJunction-to-board thermal resistance 43.240.650.7°C/W
ψ JTJunction-to-top characterization parameter 10.427.513.5°C/W
ψ JBJunction-to-board characterization parameter 42.840.350.3°C/W
R θJC(bot)Junction-to-case (bottom) thermal resistance N/AN/AN/A°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.