SLLSFV6A January 2024 – May 2024 MCF8315C-Q1
PRODUCTION DATA
THERMAL METRIC(1) | MCF8315C-Q1 | MCF8315C-Q1 | MCF8315C-Q1 | UNIT | |
---|---|---|---|---|---|
RGF (VQFN) | RRY (WQFN) | HTSSOP | |||
40 Pins | 32 Pins | 24 Pins | |||
RθJA | Junction-to-ambient thermal resistance | 28 | 30.7 | 30.5 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 16.7 | 18.6 | 23.7 | °C/W |
RθJB | Junction-to-board thermal resistance | 8.9 | 9.6 | 10.1 | °C/W |
ΨJT | Junction-to-top characterization parameter | 1.8 | 1.6 | 3.8 | °C/W |
ΨJB | Junction-to-board characterization parameter | 8.9 | 9.6 | 10 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 3.5 | 3.4 | 4.8 | °C/W |