SLLSFV1 March   2025 MCF8329A-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings Auto
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Characteristics of the SDA and SCL bus for Standard and Fast mode
    7. 5.7 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Three Phase BLDC Gate Drivers
      2. 6.3.2  Gate Drive Architecture
        1. 6.3.2.1 Dead time and Cross Conduction Prevention
      3. 6.3.3  AVDD Linear Voltage Regulator
      4. 6.3.4  Low-Side Current Sense Amplifier
      5. 6.3.5  Device Interface Modes
        1. 6.3.5.1 Interface - Control and Monitoring
        2. 6.3.5.2 I2C Interface
      6. 6.3.6  Motor Control Input Options
        1. 6.3.6.1 Analog-Mode Motor Control
        2. 6.3.6.2 PWM-Mode Motor Control
        3. 6.3.6.3 Frequency-Mode Motor Control
        4. 6.3.6.4 I2C based Motor Control
        5. 6.3.6.5 Input Control Signal Profiles
          1. 6.3.6.5.1 Linear Control Profiles
          2. 6.3.6.5.2 Staircase Control Profiles
          3. 6.3.6.5.3 Forward-Reverse Profiles
        6. 6.3.6.6 Control Input Transfer Function without Profiler
      7. 6.3.7  Bootstrap Capacitor Initial Charging
      8. 6.3.8  Starting the Motor Under Different Initial Conditions
        1. 6.3.8.1 Case 1 – Motor is Stationary
        2. 6.3.8.2 Case 2 – Motor is Spinning in the Forward Direction
        3. 6.3.8.3 Case 3 – Motor is Spinning in the Reverse Direction
      9. 6.3.9  Motor Start Sequence (MSS)
        1. 6.3.9.1 Initial Speed Detect (ISD)
        2. 6.3.9.2 Motor Resynchronization
        3. 6.3.9.3 Reverse Drive
          1. 6.3.9.3.1 Reverse Drive Tuning
        4. 6.3.9.4 Motor Start-up
          1. 6.3.9.4.1 Align
          2. 6.3.9.4.2 Double Align
          3. 6.3.9.4.3 Initial Position Detection (IPD)
            1. 6.3.9.4.3.1 IPD Operation
            2. 6.3.9.4.3.2 IPD Release
            3. 6.3.9.4.3.3 IPD Advance Angle
          4. 6.3.9.4.4 Slow First Cycle Startup
          5. 6.3.9.4.5 Open loop
          6. 6.3.9.4.6 Transition from Open to Closed Loop
      10. 6.3.10 Closed Loop Operation
        1. 6.3.10.1 Closed loop accelerate
        2. 6.3.10.2 Speed PI Control
        3. 6.3.10.3 Current PI Control
        4. 6.3.10.4 Power Loop
        5. 6.3.10.5 Modulation Index Control
      11. 6.3.11 Maximum Torque Per Ampere (MTPA) Control
      12. 6.3.12 Flux Weakening Control
      13. 6.3.13 Motor Parameters
        1. 6.3.13.1 Motor Resistance
        2. 6.3.13.2 Motor Inductance
        3. 6.3.13.3 Motor Back-EMF constant
      14. 6.3.14 Motor Parameter Extraction Tool (MPET)
      15. 6.3.15 Anti-Voltage Surge (AVS)
      16. 6.3.16 Active Braking
      17. 6.3.17 Output PWM Switching Frequency
      18. 6.3.18 Dead Time Compensation
      19. 6.3.19 Voltage Sense Scaling
      20. 6.3.20 Motor Stop Options
        1. 6.3.20.1 Coast (Hi-Z) Mode
        2. 6.3.20.2 Recirculation Mode
        3. 6.3.20.3 Low-Side Braking
        4. 6.3.20.4 Active Spin-Down
      21. 6.3.21 FG Configuration
        1. 6.3.21.1 FG Output Frequency
        2. 6.3.21.2 FG in Open-Loop
        3. 6.3.21.3 FG During Motor Stop
        4. 6.3.21.4 FG Behavior During Fault
      22. 6.3.22 DC Bus Current Limit
      23. 6.3.23 Protections
        1. 6.3.23.1  PVDD Supply Undervoltage Lockout (PVDD_UV)
        2. 6.3.23.2  AVDD Power on Reset (AVDD_POR)
        3. 6.3.23.3  GVDD Undervoltage Lockout (GVDD_UV)
        4. 6.3.23.4  BST Undervoltage Lockout (BST_UV)
        5. 6.3.23.5  MOSFET VDS Overcurrent Protection (VDS_OCP)
        6. 6.3.23.6  VSENSE Overcurrent Protection (SEN_OCP)
        7. 6.3.23.7  Thermal Shutdown (OTSD)
        8. 6.3.23.8  Hardware Lock Detection Current Limit (HW_LOCK_ILIMIT)
          1. 6.3.23.8.1 HW_LOCK_ILIMIT Latched Shutdown (HW_LOCK_ILIMIT_MODE = 00xxb)
          2. 6.3.23.8.2 HW_LOCK_ILIMIT Automatic recovery (HW_LOCK_ILIMIT_MODE = 01xxb)
          3. 6.3.23.8.3 HW_LOCK_ILIMIT Report Only (HW_LOCK_ILIMIT_MODE = 1000b)
          4. 6.3.23.8.4 HW_LOCK_ILIMIT Disabled (HW_LOCK_ILIMIT_MODE= 1001b to 1111b)
        9. 6.3.23.9  Lock Detection Current Limit (LOCK_ILIMIT)
          1. 6.3.23.9.1 LOCK_ILIMIT Latched Shutdown (LOCK_ILIMIT_MODE = 00xxb)
          2. 6.3.23.9.2 LOCK_ILIMIT Automatic Recovery (LOCK_ILIMIT_MODE = 01xxb)
          3. 6.3.23.9.3 LOCK_ILIMIT Report Only (LOCK_ILIMIT_MODE = 1000b)
          4. 6.3.23.9.4 LOCK_ILIMIT Disabled (LOCK_ILIMIT_MODE = 1xx1b)
        10. 6.3.23.10 Motor Lock (MTR_LCK)
          1. 6.3.23.10.1 MTR_LCK Latched Shutdown (MTR_LCK_MODE = 00xxb)
          2. 6.3.23.10.2 MTR_LCK Automatic Recovery (MTR_LCK_MODE= 01xxb)
          3. 6.3.23.10.3 MTR_LCK Report Only (MTR_LCK_MODE = 1000b)
          4. 6.3.23.10.4 MTR_LCK Disabled (MTR_LCK_MODE = 1xx1b)
        11. 6.3.23.11 Motor Lock Detection
          1. 6.3.23.11.1 Lock 1: Abnormal Speed (ABN_SPEED)
          2. 6.3.23.11.2 Lock 2: Abnormal BEMF (ABN_BEMF)
          3. 6.3.23.11.3 Lock3: No-Motor Fault (NO_MTR)
        12. 6.3.23.12 MPET Faults
        13. 6.3.23.13 IPD Faults
    4. 6.4 Device Functional Modes
      1. 6.4.1 Functional Modes
        1. 6.4.1.1 Sleep Mode
        2. 6.4.1.2 Standby Mode
        3. 6.4.1.3 Fault Reset (CLR_FLT)
    5. 6.5 External Interface
      1. 6.5.1 DRVOFF - Gate Driver Shutdown Functionality
      2. 6.5.2 Oscillator Source
        1. 6.5.2.1 External Clock Source
    6. 6.6 EEPROM access and I2C interface
      1. 6.6.1 EEPROM Access
        1. 6.6.1.1 EEPROM Write
        2. 6.6.1.2 EEPROM Read
      2. 6.6.2 I2C Serial Interface
        1. 6.6.2.1 I2C Data Word
        2. 6.6.2.2 I2C Write Operation
        3. 6.6.2.3 I2C Read Operation
        4. 6.6.2.4 Examples of I2C Communication Protocol Packets
        5. 6.6.2.5 Internal Buffers
        6. 6.6.2.6 CRC Byte Calculation
  8. EEPROM (Non-Volatile) Register Map
    1. 7.1 Algorithm_Configuration Registers
    2. 7.2 Fault_Configuration Registers
    3. 7.3 Hardware_Configuration Registers
    4. 7.4 Internal_Algorithm_Configuration Registers
  9. RAM (Volatile) Register Map
    1. 8.1 Fault_Status Registers
    2. 8.2 Algorithm_Control Registers
    3. 8.3 System_Status Registers
    4. 8.4 Device_Control Registers
    5. 8.5 Algorithm_Variables Registers
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1.      Detailed Design Procedure
      2.      Bootstrap Capacitor and GVDD Capacitor Selection
      3.      Gate Drive Current
      4.      Gate Resistor Selection
      5.      System Considerations in High Power Designs
      6.      Capacitor Voltage Ratings
      7.      External Power Stage Components
    3. 9.3 Power Supply Recommendations
      1. 9.3.1 Bulk Capacitance
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
      3. 9.4.3 Thermal Considerations
        1. 9.4.3.1 Power Dissipation
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

IMPORTANT NOTICE AND DISCLAIMER

TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS.

These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these resources.

TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for TI products.

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 

Copyright © 2024, Texas Instruments Incorporated