SLLSFQ7 November   2023 MCF8329A

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Revision History
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings Comm
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information 1pkg
    5. 6.5 Electrical Characteristics
    6. 6.6 Characteristics of the SDA and SCL bus for Standard and Fast mode
    7. 6.7 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Three Phase BLDC Gate Drivers
      2. 7.3.2  Gate Drive Architecture
        1. 7.3.2.1 Dead time and Cross Conduction Prevention
      3. 7.3.3  AVDD Linear Voltage Regulator
      4. 7.3.4  DVDD Voltage Regulator
        1. 7.3.4.1 AVDD Powered VREG
        2. 7.3.4.2 External Supply for VREG
        3. 7.3.4.3 External MOSFET for VREG Supply
      5. 7.3.5  Low-Side Current Sense Amplifier
      6. 7.3.6  Device Interface Modes
        1. 7.3.6.1 Interface - Control and Monitoring
        2. 7.3.6.2 I2C Interface
      7. 7.3.7  Motor Control Input Options
        1. 7.3.7.1 Analog-Mode Motor Control
        2. 7.3.7.2 PWM-Mode Motor Control
        3. 7.3.7.3 Frequency-Mode Motor Control
        4. 7.3.7.4 I2C based Motor Control
        5. 7.3.7.5 Input Control Reference Profiles
          1. 7.3.7.5.1 Linear Control Profiles
          2. 7.3.7.5.2 Staircase Control Profiles
          3. 7.3.7.5.3 Forward-Reverse Profiles
        6. 7.3.7.6 Control Input Transfer Function without Profiler
      8. 7.3.8  Bootstrap Capacitor Initial Charging
      9. 7.3.9  Starting the Motor Under Different Initial Conditions
        1. 7.3.9.1 Case 1 – Motor is Stationary
        2. 7.3.9.2 Case 2 – Motor is Spinning in the Forward Direction
        3. 7.3.9.3 Case 3 – Motor is Spinning in the Reverse Direction
      10. 7.3.10 Motor Start Sequence (MSS)
        1. 7.3.10.1 Initial Speed Detect (ISD)
        2. 7.3.10.2 Motor Resynchronization
        3. 7.3.10.3 Reverse Drive
          1. 7.3.10.3.1 Reverse Drive Tuning
        4. 7.3.10.4 Motor Start-up
          1. 7.3.10.4.1 Align
          2. 7.3.10.4.2 Double Align
          3. 7.3.10.4.3 Initial Position Detection (IPD)
            1. 7.3.10.4.3.1 IPD Operation
            2. 7.3.10.4.3.2 IPD Release
            3. 7.3.10.4.3.3 IPD Advance Angle
          4. 7.3.10.4.4 Slow First Cycle Startup
          5. 7.3.10.4.5 Open loop
          6. 7.3.10.4.6 Transition from Open to Closed Loop
      11. 7.3.11 Closed Loop Operation
        1. 7.3.11.1 Closed loop accelerate
        2. 7.3.11.2 Speed PI Control
        3. 7.3.11.3 Current PI Control
        4. 7.3.11.4 Power Loop
        5. 7.3.11.5 Modulation Index Control
      12. 7.3.12 Maximum Torque Per Ampere (MTPA) Control
      13. 7.3.13 Flux Weakening Control
      14. 7.3.14 Motor Parameters
        1. 7.3.14.1 Motor Resistance
        2. 7.3.14.2 Motor Inductance
        3. 7.3.14.3 Motor Back-EMF constant
      15. 7.3.15 Motor Parameter Extraction Tool (MPET)
      16. 7.3.16 Anti-Voltage Surge (AVS)
      17. 7.3.17 Output PWM Switching Frequency
      18. 7.3.18 Active Braking
      19. 7.3.19 Dead Time Compensation
      20. 7.3.20 Voltage Sense Scaling
      21. 7.3.21 Motor Stop Options
        1. 7.3.21.1 Coast (Hi-Z) Mode
        2. 7.3.21.2 Recirculation Mode
        3. 7.3.21.3 Low-Side Braking
        4. 7.3.21.4 Active Spin-Down
      22. 7.3.22 FG Configuration
        1. 7.3.22.1 FG Output Frequency
        2. 7.3.22.2 FG in Open-Loop
        3. 7.3.22.3 FG During Motor Stop
        4. 7.3.22.4 FG Behaviour During Fault
      23. 7.3.23 DC Bus Current Limit
      24. 7.3.24 Protections
        1. 7.3.24.1  PVDD Supply Undervoltage Lockout (PVDD_UV)
        2. 7.3.24.2  AVDD Power on Reset (AVDD_POR)
        3. 7.3.24.3  GVDD Undervoltage Lockout (GVDD_UV)
        4. 7.3.24.4  BST Undervoltage Lockout (BST_UV)
        5. 7.3.24.5  MOSFET VDS Overcurrent Protection (VDS_OCP)
        6. 7.3.24.6  VSENSE Overcurrent Protection (SEN_OCP)
        7. 7.3.24.7  Thermal Shutdown (OTSD)
        8. 7.3.24.8  Hardware Lock Detection Current Limit (HW_LOCK_ILIMIT)
          1. 7.3.24.8.1 HW_LOCK_ILIMIT Latched Shutdown (HW_LOCK_ILIMIT_MODE = 00xxb)
          2. 7.3.24.8.2 HW_LOCK_ILIMIT Automatic recovery (HW_LOCK_ILIMIT_MODE = 01xxb)
          3. 7.3.24.8.3 HW_LOCK_ILIMIT Report Only (HW_LOCK_ILIMIT_MODE = 1000b)
          4. 7.3.24.8.4 HW_LOCK_ILIMIT Disabled (HW_LOCK_ILIMIT_MODE= 1001b to 1111b)
        9. 7.3.24.9  Lock Detection Current Limit (LOCK_ILIMIT)
          1. 7.3.24.9.1 LOCK_ILIMIT Latched Shutdown (LOCK_ILIMIT_MODE = 00xxb)
          2. 7.3.24.9.2 LOCK_ILIMIT Automatic Recovery (LOCK_ILIMIT_MODE = 01xxb)
          3. 7.3.24.9.3 LOCK_ILIMIT Report Only (LOCK_ILIMIT_MODE = 1000b)
          4. 7.3.24.9.4 LOCK_ILIMIT Disabled (LOCK_ILIMIT_MODE = 1xx1b)
        10. 7.3.24.10 Motor Lock (MTR_LCK)
          1. 7.3.24.10.1 MTR_LCK Latched Shutdown (MTR_LCK_MODE = 00xxb)
          2. 7.3.24.10.2 MTR_LCK Automatic Recovery (MTR_LCK_MODE= 01xxb)
          3. 7.3.24.10.3 MTR_LCK Report Only (MTR_LCK_MODE = 1000b)
          4. 7.3.24.10.4 MTR_LCK Disabled (MTR_LCK_MODE = 1xx1b)
        11. 7.3.24.11 Motor Lock Detection
          1. 7.3.24.11.1 Lock 1: Abnormal Speed (ABN_SPEED)
          2. 7.3.24.11.2 Lock 2: Abnormal BEMF (ABN_BEMF)
          3. 7.3.24.11.3 Lock3: No-Motor Fault (NO_MTR)
        12. 7.3.24.12 MPET Faults
        13. 7.3.24.13 IPD Faults
    4. 7.4 Device Functional Modes
      1. 7.4.1 Functional Modes
        1. 7.4.1.1 Sleep Mode
        2. 7.4.1.2 Standby Mode
        3. 7.4.1.3 Fault Reset (CLR_FLT)
    5. 7.5 External Interface
      1. 7.5.1 DRVOFF - Gate Driver Shutdown Functionality
      2. 7.5.2 DAC outputs
      3. 7.5.3 Current Sense Amplifier Output
      4. 7.5.4 Oscillator Source
        1. 7.5.4.1 External Clock Source
    6. 7.6 EEPROM access and I2C interface
      1. 7.6.1 EEPROM Access
        1. 7.6.1.1 EEPROM Write
        2. 7.6.1.2 EEPROM Read
      2. 7.6.2 I2C Serial Interface
        1. 7.6.2.1 I2C Data Word
        2. 7.6.2.2 I2C Write Operation
        3. 7.6.2.3 I2C Read Operation
        4. 7.6.2.4 Examples of I2C Communication Protocol Packets
        5. 7.6.2.5 Internal Buffers
        6. 7.6.2.6 CRC Byte Calculation
    7. 7.7 EEPROM (Non-Volatile) Register Map
      1. 7.7.1 Algorithm_Configuration Registers
      2. 7.7.2 Internal_Algorithm_Configuration Registers
      3. 7.7.3 Hardware_Configuration Registers
      4. 7.7.4 Fault_Configuration Registers
    8. 7.8 RAM (Volatile) Register Map
      1. 7.8.1 Fault_Status Registers
      2. 7.8.2 Algorithm_Control Registers
      3. 7.8.3 System_Status Registers
      4. 7.8.4 Device_Control Registers
      5. 7.8.5 Algorithm_Variables Registers
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1.      Detailed Design Procedure
      2.      Bootstrap Capacitor and GVDD Capacitor Selection
      3. 8.2.1 Selection of External MOSFET for VREG Power Supply
      4.      Gate Drive Current
      5.      Gate Resistor Selection
      6.      System Considerations in High Power Designs
      7.      Capacitor Voltage Ratings
      8.      External Power Stage Components
      9. 8.2.2 Application curves
        1. 8.2.2.1 Motor startup
        2.       High speed (1.8 kHz) operation
        3.       Active Braking for faster deceleration
        4. 8.2.2.2 Dead Time compensation
  10. Power Supply Recommendations
    1. 9.1 Bulk Capacitance
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
      1. 10.3.1 Power Dissipation
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Characteristics of the SDA and SCL bus for Standard and Fast mode

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN NOM MAX UNIT
Standard-mode
fSCL SCL clock frequency 0 100 kHz
tHD_STA Hold time (repeated) START condition After this period, the first clock pulse is generated 4 µs
tLOW LOW period of the SCL clock 4.7 µs
tHIGH HIGH period of the SCL clock 4 µs
tSU_STA Set-up time for a repeated START condition 4.7 µs
tHD_DAT Data hold time (1) I2C bus devices 0 (2) (3) µs
tSU_DAT Data set-up time 250 ns
tr Rise time for both SDA and SCL signals 1000 ns
tf Fall time of both SDA and SCL signals (2)(5)(6)(7) 300 ns
tSU_STO Set-up time for STOP condition 4 µs
tBUF Bus free time between STOP and START condition 4.7 µs
Cb Capacitive load for each bus line (8) 400 pF
tVD_DAT Data valid time (9) 3.45 (3) µs
tVD_ACK Data valid acknowledge time (10) 3.45 (3) µs
VnL Noise margin at the LOW level For each connected device (including hysteresis) 0.1*AVDD V
Vnh Noise margin at the HIGHlevel For each connected device (including hysteresis) 0.2*AVDD V
Fast-mode
fSCL SCL clock frequency 0 400 KHz
tHD_STA Hold time (repeated) START condition After this period, the first clock pulse is generated 0.6 µs
tLOW LOW period of the SCL clock 1.3 µs
tHIGH HIGH period of the SCL clock 0.6 µs
tSU_STA Set-up time for a repeated START condition 0.6 µs
tHD_DAT Data hold time (1) 0 (2) (3) µs
tSU_DAT Data set-up time 100 (4) ns
tr Rise time for both SDA and SCL signals 20 300 ns
tf Fall time of both SDA and SCL signals (2)(5)(6)(7) 20 x (AVDD/5.5V) 300 ns
tSU_STO Set-up time for STOP condition 0.6 µs
tBUF Bus free time between STOP and START condition 1.3 µs
Cb Capacitive load for each bus line (8) 400 pF
tVD_DAT Data valid time (9) 0.9 (3) µs
tVD_ACK Data valid acknowledge time (10) 0.9 (3) µs
VnL Noise margin at the LOW level For each connected device (including hysteresis) 0.1*AVDD V
Vnh Noise margin at the HIGHlevel For each connected device (including hysteresis) 0.2*AVDD V
tHD_DAT is the data hold time that is measured from the falling edge of SCL, applies to data in transmission and the acknowledge.
A device must internally provide a hold time of at least 300 ns for the SDA signal (with respect to the VIH(min) of the SCL signal) to bridge the undefined region of the falling edge of SCL.
The maximum tHD_DAT could be 3.45 µs and .9 µs for Standard-mode and Fast-mode, but must be less than the maximum of tVD_DAT or tVD_ACK by a transition time. This maximum must only be met if the device does not stretch the LOW period (tLOW) of the SCL signal. If the clock stretched the SCL, the data must be valid by the set-up time before it releases the clock.
A Fast-mode I2C-bus device can be used in a Standard-mode I2C-bus system, but the requirement tSU_DAT 250 ns must then be met. This will automatically be the case if the device does not stretch the LOW period of the SCL signal. If such a device does stretch the LOW period of the SCL signal, it must output the next data bit to the SDA line tr(max) + tSU_DAT = 1000 + 250 = 1250 ns (according to the Standard-mode I2C-bus specification) before the SCL line is released. Also the acknowledge timing must meet this set-up time.
If mixed with HS-mode devices, faster fall times according to Table 10 are allowed.
The maximum tf for the SDA and SCL bus lines is specified at 300 ns. The maximum fall time for the SDA output stage tf is specified at 250 ns. This allows series protection resistors to be connected in between the SDA and the SCL pins and the SDA/SCL bus lines without exceeding the maximum specified tf.
In Fast-mode Plus, fall time is specified the same for both output stage and bus timing. If series resistors are used, designers should allow for this when considering bus timing.
The maximum bus capacitance allowable may vary from the value depending on the actual operating voltage and frequency of the application.
tVD_DAT = time for data signal from SCL LOW to SDA output (HIGH or LOW, depending on which one is worse).
tVD_ACK = time for Acknowledgement signal from SCL LOW to SDA output (HIGH or LOW, dependging on which one is worse).