4 Revision History
Changes from C Revision (January 2019) to D Revision
- Added SOT-23 (8) (DDF) package to data sheetGo
Changes from B Revision (April 2018) to C Revision
- Deleted SOT-23 package preview notation in Device Information tableGo
- Added SC70 package to Device Information tableGo
- Added DCK package information to Device Comparison TableGo
- Deleted DBV package preview notation from Pin Configuration and Functions sectionGo
- Added DCK package drawing and pin functions to Pin Configuration and Functions sectionGo
- Added DBV (SOT-23) and DCK (SC70) thermal informationGo
Changes from A Revision (October 2017) to B Revision
- Added DGK package to Thermal Information table Go
Changes from * Revision (July 2017) to A Revision
- Deleted MCP6291 SC70, SOT-553, and SOIC packages from Device Information tableGo
- Deleted MCP6292 WSON and VSSOP (10) packages from Device Information tableGo
- Changed MCP6294 14-pin SOIC package from preview to production data in Device Information table Go
- Deleted DCK, DRL, DSG, RTE and 8-pin D packages from Device Comparison table Go
- Deleted DRL (SOT-533) package from MCP6291 pinout image and table in Pin Configuration and Functions section Go
- Deleted MCP6291 DCK (SC70) and D (SOIC) package pinout drawings and pin information from Pin Configuration and Functions sectionGo
- Deleted MCP6292 DSG (WSON) and DGS (VSSOP) package pinout drawings and pin table information in Pin Configuration and Functions section Go
- Deleted package preview note from MCP6294 pinout drawing in Pin Configuration and Functions section Go
- Added MCP6294 Thermal Information table Go