SLVSH53 December   2023 MCT8315Z

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Revision History
  6. Device Comparison Table
  7. Pin Configuration and Functions
  8. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 SPI Timing Requirements
    7. 7.7 SPI Secondary Device Mode Timings
    8. 7.8 Typical Characteristics
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Output Stage
      2. 8.3.2  PWM Control Mode (1x PWM Mode)
        1. 8.3.2.1 Analog Hall Input Configuration
        2. 8.3.2.2 Digital Hall Input Configuration
        3. 8.3.2.3 Asynchronous Modulation
        4. 8.3.2.4 Synchronous Modulation
        5. 8.3.2.5 Motor Operation
      3. 8.3.3  Device Interface Modes
        1. 8.3.3.1 Serial Peripheral Interface (SPI)
        2. 8.3.3.2 Hardware Interface
      4. 8.3.4  Step-Down Mixed-Mode Buck Regulator
        1. 8.3.4.1 Buck in Inductor Mode
        2. 8.3.4.2 Buck in Resistor mode
        3. 8.3.4.3 Buck Regulator with External LDO
        4. 8.3.4.4 AVDD Power Sequencing on Buck Regulator
        5. 8.3.4.5 Mixed mode Buck Operation and Control
      5. 8.3.5  AVDD Linear Voltage Regulator
      6. 8.3.6  Charge Pump
      7. 8.3.7  Slew Rate Control
      8. 8.3.8  Cross Conduction (Dead Time)
      9. 8.3.9  Propagation Delay
        1. 8.3.9.1 Driver Delay Compensation
      10. 8.3.10 Pin Diagrams
        1. 8.3.10.1 Logic Level Input Pin (Internal Pulldown)
        2. 8.3.10.2 Logic Level Input Pin (Internal Pullup)
        3. 8.3.10.3 Open Drain Pin
        4. 8.3.10.4 Push Pull Pin
        5. 8.3.10.5 Four Level Input Pin
        6. 8.3.10.6 Seven Level Input Pin
      11. 8.3.11 Active Demagnetization
        1. 8.3.11.1 Automatic Synchronous Rectification Mode (ASR Mode)
          1. 8.3.11.1.1 Automatic Synchronous Rectification in Commutation
          2. 8.3.11.1.2 Automatic Synchronous Rectification in PWM Mode
        2. 8.3.11.2 Automatic Asynchronous Rectification Mode (AAR Mode)
      12. 8.3.12 Cycle-by-Cycle Current Limit
        1. 8.3.12.1 Cycle by Cycle Current Limit with 100% Duty Cycle Input
      13. 8.3.13 Hall Comparators (Analog Hall Inputs)
      14. 8.3.14 Advance Angle
      15. 8.3.15 FGOUT Signal
      16. 8.3.16 Protections
        1. 8.3.16.1  VM Supply Undervoltage Lockout (NPOR)
        2. 8.3.16.2  AVDD Undervoltage Lockout (AVDD_UV)
        3. 8.3.16.3  Buck Undervoltage Lockout (BUCK_UV)
        4. 8.3.16.4  VCP Charge Pump Undervoltage Lockout (CPUV)
        5. 8.3.16.5  Overvoltage Protection (OVP)
        6. 8.3.16.6  Overcurrent Protection (OCP)
          1. 8.3.16.6.1 OCP Latched Shutdown (OCP_MODE = 00b)
          2. 8.3.16.6.2 OCP Automatic Retry (OCP_MODE = 01b)
        7. 8.3.16.7  Buck Overcurrent Protection
        8. 8.3.16.8  Motor Lock (MTR_LOCK)
          1. 8.3.16.8.1 MTR_LOCK Latched Shutdown (MTR_LOCK_MODE = 00b)
          2. 8.3.16.8.2 MTR_LOCK Automatic Retry (MTR_LOCK_MODE = 01b)
          3. 8.3.16.8.3 MTR_LOCK Report Only (MTR_LOCK_MODE= 10b)
          4. 8.3.16.8.4 MTR_LOCK Disabled (MTR_LOCK_MODE = 11b)
          5. 8.3.16.8.5 75
        9. 8.3.16.9  Thermal Warning (OTW)
        10. 8.3.16.10 Thermal Shutdown (OTSD)
          1. 8.3.16.10.1 OTSD FET
          2. 8.3.16.10.2 OTSD (Non-FET)
    4. 8.4 Device Functional Modes
      1. 8.4.1 Functional Modes
        1. 8.4.1.1 Sleep Mode
        2. 8.4.1.2 Operating Mode
        3. 8.4.1.3 Fault Reset (CLR_FLT or nSLEEP Reset Pulse)
      2. 8.4.2 DRVOFF
    5. 8.5 SPI Communication
      1. 8.5.1 Programming
        1. 8.5.1.1 SPI Format
    6. 8.6 Register Map
      1. 8.6.1 STATUS Registers
      2. 8.6.2 CONTROL Registers
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Hall Sensor Configuration and Connection
      1. 9.2.1 Typical Configuration
      2. 9.2.2 Open Drain Configuration
      3. 9.2.3 Series Configuration
      4. 9.2.4 Parallel Configuration
    3. 9.3 Typical Applications
      1. 9.3.1 Three-Phase Brushless-DC Motor Control With Current Limit
        1. 9.3.1.1 Detailed Design Procedure
          1. 9.3.1.1.1 Motor Voltage
          2. 9.3.1.1.2 Using Active Demagnetization
          3. 9.3.1.1.3 Using Delay Compensation
          4. 9.3.1.1.4 Using the Buck Regulator
          5. 9.3.1.1.5 Power Dissipation and Junction Temperature Losses
        2. 9.3.1.2 Application Curves
  11. 10Power Supply Recommendations
    1. 10.1 Bulk Capacitance
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations
      1. 11.3.1 Power Dissipation
  13. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Programming

On MCT8315Z SPI devices, an SPI bus is used to set device configurations, operating parameters, and read out diagnostic information. The SPI operates in secondary mode and connects to a controller. The SPI input data (SDI) word consists of a 16-bit word, with a 6-bit address and 8 bits of data. The SPI output consists of 16 bit word, with a 8 bits of status information (STAT register) and 8-bit register data.

A valid frame must meet the following conditions:

  • The SCLK pin should be low when the nSCS pin transitions from high to low and from low to high.
  • The nSCS pin should be pulled high for at least 400 ns between words.
  • When the nSCS pin is pulled high, any signals at the SCLK and SDI pins are ignored and the SDO pin is placed in the Hi-Z state.
  • Data is captured on the falling edge of the SCLK pin and data is propagated on the rising edge of the SCLK pin.
  • The most significant bit (MSB) is shifted in and out first.
  • A full 16 SCLK cycles must occur for transaction to be valid.
  • If the data word sent to the SDI pin is less than or more than 16 bits, a frame error occurs and the data word is ignored.
  • For a write command, the existing data in the register being written to is shifted out on the SDO pin following the 8-bit status data.

The SPI registers are reset to the default settings on power up and when the device is enters sleep mode