SLVSIA0 November   2024 MMBZ30VCL

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings—JEDEC Specification
    3. 5.3 ESD Ratings—IEC Specification
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Thermal Information
    6. 5.6 Electrical Characteristics
    7. 5.7 Typical Characteristics
  7. 6Device and Documentation Support
    1. 6.1 Documentation Support
      1. 6.1.1 Related Documentation
    2. 6.2 Receiving Notification of Documentation Updates
    3. 6.3 Support Resources
    4. 6.4 Trademarks
    5. 6.5 Electrostatic Discharge Caution
    6. 6.6 Glossary
  8. 7Revision History
  9. 8Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.2 ESD Ratings—JEDEC Specification

VALUEUNIT
V(ESD)Electrostatic dischargeHuman body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)± 2500V
Charged device model (CDM), per JEDEC specification JS-002 (2)± 1000
(1) JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard
ESD control process.
(2) JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard
ESD control process.