SLAS701B November   2010  – June 2018 MSP430AFE221 , MSP430AFE222 , MSP430AFE223 , MSP430AFE231 , MSP430AFE232 , MSP430AFE233 , MSP430AFE251 , MSP430AFE252 , MSP430AFE253

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagrams
    2. 4.2 Signal Descriptions
      1. Table 4-1 Terminal Functions
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Resistance Characteristics for PW-24 Package
    5. 5.5  Active Mode Supply Current (Into DVCC and AVCC) Excluding External Current
    6. 5.6  Typical Characteristics – Active-Mode Supply Current (Into DVCC and AVCC)
    7. 5.7  Low-Power-Mode Supply Currents (Into VCC) Excluding External Current
    8. 5.8  Typical Characteristics – LPM4 Current
    9. 5.9  Schmitt-Trigger Inputs (Ports Px and RST/NMI)
    10. 5.10 Leakage Current (Ports Px)
    11. 5.11 Outputs (Ports Px)
    12. 5.12 Output Frequency (Ports Px)
    13. 5.13 Typical Characteristics – Outputs
    14. 5.14 POR, BOR
    15. 5.15 Typical Characteristics – POR, BOR
    16. 5.16 Supply Voltage Supervisor (SVS), Supply Voltage Monitor (SVM)
    17. 5.17 Main DCO Characteristics
    18. 5.18 DCO Frequency
    19. 5.19 Calibrated DCO Frequencies – Tolerance
    20. 5.20 Wake-up Times From Lower-Power Modes (LPM3, LPM4)
    21. 5.21 Typical Characteristics – DCO Clock Wake-up Time
    22. 5.22 Internal Very-Low-Power Low-Frequency Oscillator (VLO)
    23. 5.23 Crystal Oscillator (XT2)
    24. 5.24 Typical Characteristics – XT2 Oscillator
    25. 5.25 SD24_A, Power Supply
    26. 5.26 SD24_A, Input Range
    27. 5.27 SD24_A, Performance
    28. 5.28 SD24_A, Temperature Sensor and Built-In VCC Sense
    29. 5.29 SD24_A, Built-In Voltage Reference
    30. 5.30 SD24_A, Reference Output Buffer
    31. 5.31 SD24_A, External Reference Input
    32. 5.32 USART0
    33. 5.33 Timer_A3
    34. 5.34 Flash Memory
    35. 5.35 RAM
    36. 5.36 JTAG and Spy-Bi-Wire Interface
    37. 5.37 JTAG Fuse
  6. 6Detailed Description
    1. 6.1  CPU
    2. 6.2  Instruction Set
    3. 6.3  Operating Modes
    4. 6.4  Interrupt Vector Addresses
    5. 6.5  Special Function Registers
      1. Table 6-4 Interrupt Enable Register 1 Field Descriptions
      2. Table 6-5 Interrupt Flag Register 1 Field Descriptions
      3. Table 6-6 Module Enable Register 1 Field Descriptions
    6. 6.6  Memory Organization
    7. 6.7  Flash Memory
    8. 6.8  Peripherals
    9. 6.9  Oscillator and System Clock
    10. 6.10 Brownout, Supply Voltage Supervisor
    11. 6.11 Digital I/O
    12. 6.12 Watchdog Timer (WDT+)
    13. 6.13 Timer_A3
    14. 6.14 USART0
    15. 6.15 Hardware Multiplier
    16. 6.16 SD24_A
    17. 6.17 Peripheral File Map
    18. 6.18 I/O Port Schematics
      1. 6.18.1 Port P1 Pin Schematic: P1.0 Input/Output With Schmitt Trigger
      2. 6.18.2 Port P1 Pin Schematic: P1.1 and P1.2 Input/Output With Schmitt Trigger
      3. 6.18.3 Port P1 Pin Schematic: P1.3 Input/Output With Schmitt Trigger
      4. 6.18.4 Port P1 Pin Schematic: P1.4 Input/Output With Schmitt Trigger
      5. 6.18.5 Port P1 Pin Schematic: P1.5 to P1.7 Input/Output With Schmitt Trigger
      6. 6.18.6 Port P2 Pin Schematic: P2.0 Input/Output With Schmitt Trigger
      7. 6.18.7 Port P2 Pin Schematic: P2.6, Input/Output With Schmitt Trigger
      8. 6.18.8 Port P2 Pin Schematic: P2.7, Input/Output With Schmitt Trigger
      9. 6.18.9 JTAG Fuse Check Mode
  7. 7Device and Documentation Support
    1. 7.1 Getting Started
    2. 7.2 Device Nomenclature
    3. 7.3 Tools and Software
    4. 7.4 Documentation Support
    5. 7.5 Related Links
    6. 7.6 Community Resources
    7. 7.7 Trademarks
    8. 7.8 Electrostatic Discharge Caution
    9. 7.9 Glossary
  8. 8Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.23 Crystal Oscillator (XT2)(5)

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER TEST CONDITIONS VCC MIN TYP MAX UNIT
fXT2,HF0 XT2 oscillator crystal frequency,
HF mode 0		 XT2OFF = 0, XT2Sx = 0 1.8 V to 3.6 V 0.4 1 MHz
fXT2,HF1 XT2 oscillator crystal frequency,
HF mode 1		 XT2OFF = 0, XT2Sx = 1 1.8 V to 3.6 V 1 4 MHz
fXT2,HF2 XT2 oscillator crystal frequency,
HF mode 2		 XT2OFF = 0, XT2Sx = 2 1.8 V to 2.2 V 2 10 MHz
2.2 V to 3.0 V 2 12
3.0 V to 3.6 V 2 16
fXT2,HF,logic XT2 oscillator logic-level
square-wave input frequency,
HF mode		 XT2OFF = 0, XT2Sx = 3 1.8 V to 2.2 V 0.4 10 MHz
2.2 V to 3.0 V 0.4 12
3.0 V to 3.6 V 0.4 16
OAHF Oscillation allowance for HF crystals (see Figure 5-15) XT2OFF = 0, XT2Sx = 0
fXT2,HF = 1 MHz, CL,eff = 15 pF		 2700 Ω
XT2OFF = 0, XT2Sx = 1
fXT2,HF = 4 MHz, CL,eff = 15 pF		 800
XT2OFF = 0, XT2Sx = 2
fXT2,HF = 16 MHz, CL,eff = 15 pF		 300
CL,eff Integrated effective load capacitance, HF mode(1) XT2OFF = 0(2) 1 pF
Duty cycle XT2OFF = 0, Measured at
P1.0/SVSIN/TACLK/SMCLK/TA2,
fXT2,HF = 10 MHz		 3 V 40 50 60 %
XT2OFF = 0, Measured at
P1.0/SVSIN/TACLK/SMCLK/TA2,
fXT2,HF = 16 MHz		 40 50 60
fFault,HF Oscillator fault frequency (4) XT2OFF = 0, XT2Sx = 3(3) 3 V 30 300 kHz
(1) Includes parasitic bond and package capacitance (approximately 2 pF per pin). Because the PCB adds additional capacitance, TI recommends verifying the correct load by measuring the ACLK frequency. For a correct setup, the effective load capacitance should always match the specification of the used crystal.
(2) Requires external capacitors at both terminals. Values are specified by crystal manufacturers.
(3) Measured with logic-level input frequency, but also applies to operation with crystals.
(4) Frequencies below the MIN specification set the fault flag, frequencies above the MAX specification do not set the fault flag, and frequencies in between might set the flag.
(5) To improve EMI on the XT2 oscillator, observe the following guidelines:
  • Keep the trace between the device and the crystal as short as possible.
  • Design a good ground plane around the oscillator pins.
  • Prevent crosstalk from other clock or data lines into oscillator pins XT2IN and XT2OUT.
  • Avoid running PCB traces underneath or adjacent to the XT2IN and XT2OUT pins.
  • Use assembly materials and processes that avoid any parasitic load on the oscillator XT2IN and XT2OUT pins.
  • If conformal coating is used, make sure that it does not induce capacitive or resistive leakage between the oscillator pins.