2 Revision History
Changes from D Revision (October 2013) to E Revision
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Added Specifications section, ESD Ratings table, Thermal Information table, Detailed Description section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo
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Changed ORDERING INFORMATION table to Device Information tableGo
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Added 64-pin KGD deviceGo
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Added new bond pad coordinates table for 80-pin KGD deviceGo
Changes from C Revision (April 2013) to D Revision
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Added bullet under Supports Extreme Temperature ApplicationsGo
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Deleted Ordering Information table note (2) referencing package informationGo
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Changed Bare Die Information sectionGo