SLAS718H November 2012 – September 2018 MSP430F5212 , MSP430F5214 , MSP430F5217 , MSP430F5219 , MSP430F5222 , MSP430F5224 , MSP430F5229
PRODUCTION DATA.
Figure 4-1 shows the pinout for the MSP430F5229 and MSP430F5227 devices in the 64-pin RGC package.
Figure 4-2 shows the pinout for the MSP430F5224 and MSP430F5222 devices in the 48-pin RGZ package.
NOTE:
TI recommends connection of exposed thermal pad to VSS.Figure 4-3 shows the pinout for the MSP430F5219 and MSP430F5217 devices in the 64-pin RGC package.
Figure 4-4 shows the pinout for the MSP430F5214 and MSP430F5212 devices in the 48-pin RGZ package.
NOTE:
TI recommends connection of exposed thermal pad to VSS.Figure 4-5 shows the pinout for the MSP430F5229, MSP430F5227, MSP430F5219, and MSP430F5217 devices in the 80-pin ZQE package.
Figure 4-6 shows the pinout for the MSP430F5229, MSP430F5227, MSP430F5219, and MSP430F5217 devices in the 64-pin YFF package.