SLAS718H November   2012  – September 2018 MSP430F5212 , MSP430F5214 , MSP430F5217 , MSP430F5219 , MSP430F5222 , MSP430F5224 , MSP430F5229

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagrams
  2. 2Revision History
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagrams
    2. 4.2 Signal Descriptions
      1. Table 4-1 Terminal Functions
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Active Mode Supply Current Into VCC Excluding External Current
    5. 5.5  Low-Power Mode Supply Currents (Into VCC) Excluding External Current
    6. 5.6  Thermal Resistance Characteristics
    7. 5.7  Schmitt-Trigger Inputs – General-Purpose I/O DVCC Domain (P1.0 to P1.3, P5.0 to P5.5, P6.0 to P6.7, PJ.0 to PJ.3, RSTDVCC)
    8. 5.8  Schmitt-Trigger Inputs – General-Purpose I/O DVIO Domain (P1.4 to P1.7, P2.0 to P2.7, P3.0 to P3.4, P4.0 to P4.7, P7.0 to P7.5, RST/NMI, BSLEN)
    9. 5.9  Inputs – Interrupts DVCC Domain Port P1 (P1.0 to P1.3)
    10. 5.10 Inputs – Interrupts DVIO Domain Ports P1 and P2 (P1.4 to P1.7, P2.0 to P2.7)
    11. 5.11 Leakage Current – General-Purpose I/O DVCC Domain (P1.0 to P1.3, P5.0 to P5.5, P6.0 to P6.7, PJ.0 to PJ.3)
    12. 5.12 Leakage Current – General-Purpose I/O DVIO Domain (P1.4 to P1.7, P2.0 to P2.7, P3.0 to P3.4, P4.0 to P4.7, P7.0 to P7.5)
    13. 5.13 Outputs – General-Purpose I/O DVCC Domain (Full Drive Strength) (P1.0 to P1.3, P5.0 to P5.5, P6.0 to P6.7, PJ.0 to PJ.3)
    14. 5.14 Outputs – General-Purpose I/O DVCC Domain (Reduced Drive Strength) (P1.0 to P1.3, P5.0 to P5.5, P6.0 to P6.7, PJ.0 to PJ.3)
    15. 5.15 Outputs – General-Purpose I/O DVIO Domain (Full Drive Strength) (P1.4 to P1.7, P2.0 to P2.7, P3.0 to P3.4, P4.0 to P4.7, P7.0 to P7.5)
    16. 5.16 Outputs – General-Purpose I/O DVIO Domain (Reduced Drive Strength) (P1.4 to P1.7, P2.0 to P2.7, P3.0 to P3.4, P4.0 to P4.7, P7.0 to P7.5)
    17. 5.17 Output Frequency – General-Purpose I/O DVCC Domain (P1.0 to P1.3, P5.0 to P5.5, P6.0 to P6.7, PJ.0 to PJ.3)
    18. 5.18 Output Frequency – General-Purpose I/O DVIO Domain (P1.4 to P1.7, P2.0 to P2.7, P3.0 to P3.4, P4.0 to P4.7, P7.0 to P7.5)
    19. 5.19 Typical Characteristics – Outputs, Reduced Drive Strength (PxDS.y = 0)
    20. 5.20 Typical Characteristics – Outputs, Full Drive Strength (PxDS.y = 1)
    21. 5.21 Crystal Oscillator, XT1, Low-Frequency Mode
    22. 5.22 Crystal Oscillator, XT2
    23. 5.23 Internal Very-Low-Power Low-Frequency Oscillator (VLO)
    24. 5.24 Internal Reference, Low-Frequency Oscillator (REFO)
    25. 5.25 DCO Frequency
    26. 5.26 PMM, Brownout Reset (BOR)
    27. 5.27 PMM, Core Voltage
    28. 5.28 PMM, SVS High Side
    29. 5.29 PMM, SVM High Side
    30. 5.30 PMM, SVS Low Side
    31. 5.31 PMM, SVM Low Side
    32. 5.32 Wake-up Times From Low-Power Modes and Reset
    33. 5.33 Timer_A
    34. 5.34 Timer_B
    35. 5.35 USCI (UART Mode), Recommended Operating Conditions
    36. 5.36 USCI (UART Mode)
    37. 5.37 USCI (SPI Master Mode), Recommended Operating Conditions
    38. 5.38 USCI (SPI Master Mode)
    39. 5.39 USCI (SPI Slave Mode)
    40. 5.40 USCI (I2C Mode)
    41. 5.41 10-Bit ADC, Power Supply and Input Range Conditions
    42. 5.42 10-Bit ADC, Timing Parameters
    43. 5.43 10-Bit ADC, Linearity Parameters
    44. 5.44 REF, External Reference
    45. 5.45 REF, Built-In Reference
    46. 5.46 Comparator_B
    47. 5.47 Flash Memory
    48. 5.48 JTAG and Spy-Bi-Wire Interface
    49. 5.49 DVIO BSL Entry
  6. 6Detailed Description
    1. 6.1  CPU (Link to user's guide)
    2. 6.2  Operating Modes
    3. 6.3  Interrupt Vector Addresses
    4. 6.4  Memory Organization
    5. 6.5  Bootloader (BSL)
    6. 6.6  JTAG Operation
      1. 6.6.1 JTAG Standard Interface
      2. 6.6.2 Spy-Bi-Wire Interface
    7. 6.7  Flash Memory (Link to user's guide)
    8. 6.8  RAM (Link to user's guide)
    9. 6.9  Peripherals
      1. 6.9.1  Digital I/O (Link to user's guide)
      2. 6.9.2  Port Mapping Controller (Link to user's guide)
      3. 6.9.3  Oscillator and System Clock (Link to user's guide)
      4. 6.9.4  Power-Management Module (PMM) (Link to user's guide)
      5. 6.9.5  Hardware Multiplier (Link to user's guide)
      6. 6.9.6  Real-Time Clock (RTC_A) (Link to user's guide)
      7. 6.9.7  Watchdog Timer (WDT_A) (Link to user's guide)
      8. 6.9.8  System Module (SYS) (Link to user's guide)
      9. 6.9.9  DMA Controller (Link to user's guide)
      10. 6.9.10 Universal Serial Communication Interface (USCI) (Links to user's guide: UART Mode, SPI Mode, I2C Mode)
      11. 6.9.11 TA0 (Link to user's guide)
      12. 6.9.12 TA1 (Link to user's guide)
      13. 6.9.13 TA2 (Link to user's guide)
      14. 6.9.14 TB0 (Link to user's guide)
      15. 6.9.15 Comparator_B (Link to user's guide)
      16. 6.9.16 ADC10_A (Link to user's guide)
      17. 6.9.17 CRC16 (Link to user's guide)
      18. 6.9.18 REF Voltage Reference (Link to user's guide)
      19. 6.9.19 Embedded Emulation Module (EEM) (S Version) (Link to user's guide)
      20. 6.9.20 Peripheral File Map
    10. 6.10 Input/Output Diagrams
      1. 6.10.1  Port P1 (P1.0 to P1.7) Input/Output With Schmitt Trigger
      2. 6.10.2  Port P2 (P2.0 to P2.7) Input/Output With Schmitt Trigger
      3. 6.10.3  Port P3 (P3.0 to P3.4) Input/Output With Schmitt Trigger
      4. 6.10.4  Port P4 (P4.0 to P4.7) Input/Output With Schmitt Trigger
      5. 6.10.5  Port P5 (P5.0 and P5.1) Input/Output With Schmitt Trigger
      6. 6.10.6  Port P5 (P5.2) Input/Output With Schmitt Trigger
      7. 6.10.7  Port P5 (P5.3) Input/Output With Schmitt Trigger
      8. 6.10.8  Port P5 (P5.4 and P5.5) Input/Output With Schmitt Trigger
      9. 6.10.9  Port P6 (P6.0 to P6.7) Input/Output With Schmitt Trigger
      10. 6.10.10 Port P7 (P7.0 to P7.5) Input/Output With Schmitt Trigger
      11. 6.10.11 Port PJ (PJ.0) JTAG Pin TDO, Input/Output With Schmitt Trigger or Output
      12. 6.10.12 Port PJ (PJ.1 to PJ.3) JTAG Pins TMS, TCK, TDI/TCLK, Input/Output With Schmitt Trigger or Output
    11. 6.11 Device Descriptors
  7. 7Device and Documentation Support
    1. 7.1 Getting Started
    2. 7.2 Device Nomenclature
    3. 7.3 Tools and Software
    4. 7.4 Documentation Support
    5. 7.5 Related Links
    6. 7.6 Community Resources
    7. 7.7 Trademarks
    8. 7.8 Electrostatic Discharge Caution
    9. 7.9 Glossary
  8. 8Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.45 REF, Built-In Reference

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(1)
PARAMETER TEST CONDITIONS VCC MIN TYP MAX UNIT
VREF+ Positive built-in reference voltage REFVSEL = {2} for 2.5 V, REFON = 1 3 V 2.472 2.51 2.548 V
REFVSEL = {1} for 2.0 V, REFON = 1 3 V 1.96 1.99 2.02
REFVSEL = {0} for 1.5 V, REFON = 1 2.2 V, 3 V 1.472 1.495 1.518
AVCC(min) AVCC minimum voltage, Positive built-in reference active REFVSEL = {0} for 1.5 V 1.8 V
REFVSEL = {1} for 2.0 V 2.2
REFVSEL = {2} for 2.5 V 2.7
IREF+ Operating supply current into AVCC terminal(1) fADC10CLK = 5.0 MHz,
REFON = 1, REFBURST = 0,
REFVSEL = {2} for 2.5 V		 3 V 18 24 µA
fADC10CLK = 5.0 MHz,
REFON = 1, REFBURST = 0,
REFVSEL = {1} for 2.0 V		 3 V 15.5 21
fADC10CLK = 5.0 MHz,
REFON = 1, REFBURST = 0,
REFVSEL = {0} for 1.5 V		 3 V 13.5 21
TCREF+ Temperature coefficient of built-in reference(2) IVREF+ = 0 A,
REFVSEL = (0, 1, 2}, REFON = 1		 30 50 ppm/ °C
ISENSOR Operating supply current into AVCC terminal(4) REFON = 0, INCH = 0Ah,
ADC10ON = N A, TA = 30°C		 2.2 V 20 22 µA
3 V 20 22
VSENSOR See (5) ADC10ON = 1, INCH = 0Ah,
TA = 30°C		 2.2 V 770 mV
3 V 770
VMID AVCC divider at channel 11 ADC10ON = 1, INCH = 0Bh,
VMID ≈ 0.5 × VAVCC 		2.2 V 1.06 1.1 1.14 V
3 V 1.46 1.5 1.54
tSENSOR(sample) Sample time required if channel 10 is selected(6) ADC10ON = 1, INCH = 0Ah,
Error of conversion result ≤ 1 LSB		 30 µs
tVMID(sample) Sample time required if channel 11 is selected(7) ADC10ON = 1, INCH = 0Bh,
Error of conversion result ≤ 1 LSB		 1 µs
PSRR_DC Power supply rejection ratio (DC) AVCC = AVCC(min) to AVCC(max),
TA = 25°C,
REFVSEL = {0, 1, 2}, REFON = 1		 120 µV/V
PSRR_AC Power supply rejection ratio (AC) AVCC = AVCC(min) to AVCC(max),
TA = 25°C, f = 1 kHz, ΔVpp = 100 mV
REFVSEL = {0, 1, 2}, REFON = 1		 6.4 mV/V
tSETTLE Settling time of reference voltage(3) AVCC = AVCC(min) to AVCC(max)
REFVSEL = {0, 1, 2}, REFON = 0 → 1		 75 µs
(1) The internal reference current is supplied from terminal AVCC. Consumption is independent of the ADC10ON control bit, unless a conversion is active. The REFON bit enables to settle the built-in reference before starting an analog-to-digital conversion.
(2) Calculated using the box method: (MAX(–40°C to 85°C) – MIN(–40°C to 85°C)) / MIN(–40°C to 85°C)/(85°C – (–40°C)).
(3) The condition is that the error in a conversion started after tREFON is less than ±0.5 LSB.
(4) The sensor current ISENSOR is consumed if (ADC10ON = 1 and REFON = 1) or (ADC10ON = 1 and INCH = 0Ah and sample signal is high). When REFON = 1, ISENSOR is already included in IREF+.
(5) The temperature sensor offset can be significant. TI recommends a single-point calibration to minimize the offset error of the built-in temperature sensor.
(6) The typical equivalent impedance of the sensor is 51 kΩ. The sample time required includes the sensor-on time tSENSOR(on).
(7) The on-time tVMID(on) is included in the sampling time tVMID(sample); no additional on time is needed.