SLAS677G September   2010  – May 2020 MSP430F5304 , MSP430F5308 , MSP430F5309 , MSP430F5310

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagrams
  2. 2Revision History
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagrams
    2. 4.2 Signal Descriptions
      1. Table 4-1 Signal Descriptions
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Active Mode Supply Current Into VCC Excluding External Current
    5. 5.5  Low-Power Mode Supply Currents (Into VCC) Excluding External Current
    6. 5.6  Thermal Resistance Characteristics
    7. 5.7  Schmitt-Trigger Inputs – General-Purpose I/O (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.4, P4.0 to P4.7) (P5.0 to P5.5, P6.0 to P6.7, PJ.0 to PJ.3, RST/NMI)
    8. 5.8  Inputs – Ports P1 and P2 (P1.0 to P1.7, P2.0 to P2.7)
    9. 5.9  Leakage Current – General-Purpose I/O (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.4, P4.0 to P4.7) (P5.0 to P5.5, P6.0 to P6.7, PJ.0 to PJ.3, RST/NMI)
    10. 5.10 Outputs – General-Purpose I/O (Full Drive Strength) (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.4, P4.0 to P4.7, P5.0 to P5.5, P6.0 to P6.7, PJ.0 to PJ.3)
    11. 5.11 Outputs – General-Purpose I/O (Reduced Drive Strength) (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.4, P4.0 to P4.7, P5.0 to P5.5, P6.0 to P6.7, PJ.0 to PJ.3)
    12. 5.12 Output Frequency – General-Purpose I/O (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.4, P4.0 to P4.7, P5.0 to P5.5, P6.0 to P6.7, PJ.0 to PJ.3)
    13. 5.13 Typical Characteristics – Outputs, Reduced Drive Strength (PxDS.y = 0)
    14. 5.14 Crystal Oscillator, XT1, Low-Frequency Mode
    15. 5.15 Crystal Oscillator, XT2
    16. 5.16 Internal Very-Low-Power Low-Frequency Oscillator (VLO)
    17. 5.17 Internal Reference, Low-Frequency Oscillator (REFO)
    18. 5.18 DCO Frequency
    19. 5.19 PMM, Brownout Reset (BOR)
    20. 5.20 PMM, Core Voltage
    21. 5.21 PMM, SVS High Side
    22. 5.22 PMM, SVM High Side
    23. 5.23 PMM, SVS Low Side
    24. 5.24 PMM, SVM Low Side
    25. 5.25 Wake-up Times From Low-Power Modes and Reset
    26. 5.26 Timer_A
    27. 5.27 Timer_B
    28. 5.28 USCI (UART Mode) Clock Frequency
    29. 5.29 USCI (UART Mode)
    30. 5.30 USCI (SPI Master Mode) Clock Frequency
    31. 5.31 USCI (SPI Master Mode)
    32. 5.32 USCI (SPI Slave Mode)
    33. 5.33 USCI (I2C Mode)
    34. 5.34 10-Bit ADC, Power Supply and Input Range Conditions
    35. 5.35 10-Bit ADC, Timing Parameters
    36. 5.36 10-Bit ADC, Linearity Parameters
    37. 5.37 REF, External Reference
    38. 5.38 REF, Built-In Reference
    39. 5.39 Comparator_B
    40. 5.40 Ports PU.0 and PU.1
    41. 5.41 LDO-PWR (LDO Power System)
    42. 5.42 Flash Memory
    43. 5.43 JTAG and Spy-Bi-Wire Interface
  6. 6Detailed Description
    1. 6.1  CPU (Link to User's Guide)
    2. 6.2  Operating Modes
    3. 6.3  Interrupt Vector Addresses
    4. 6.4  Memory Organization
    5. 6.5  Bootloader (BSL)
    6. 6.6  JTAG Operation
      1. 6.6.1 JTAG Standard Interface
      2. 6.6.2 Spy-Bi-Wire Interface
    7. 6.7  Flash Memory (Link to User's Guide)
    8. 6.8  RAM (Link to User's Guide)
    9. 6.9  Peripherals
      1. 6.9.1  Digital I/O (Link to User's Guide)
      2. 6.9.2  Port Mapping Controller (Link to User's Guide)
      3. 6.9.3  Oscillator and System Clock (Link to User's Guide)
      4. 6.9.4  Power-Management Module (PMM) (Link to User's Guide)
      5. 6.9.5  Hardware Multiplier (Link to User's Guide)
      6. 6.9.6  Real-Time Clock (RTC_A) (Link to User's Guide)
      7. 6.9.7  Watchdog Timer (WDT_A) (Link to User's Guide)
      8. 6.9.8  System Module (SYS) (Link to User's Guide)
      9. 6.9.9  DMA Controller (Link to User's Guide)
      10. 6.9.10 Universal Serial Communication Interface (USCI) (Links to User's Guide: UART Mode, SPI Mode, I2C Mode)
      11. 6.9.11 TA0 (Link to User's Guide)
      12. 6.9.12 TA1 (Link to User's Guide)
      13. 6.9.13 TA2 (Link to User's Guide)
      14. 6.9.14 TB0 (Link to User's Guide)
      15. 6.9.15 Comparator_B (Link to User's Guide)
      16. 6.9.16 ADC10_A (Link to User's Guide)
      17. 6.9.17 CRC16 (Link to User's Guide)
      18. 6.9.18 Reference (REF) Module Voltage Reference (Link to User's Guide)
      19. 6.9.19 LDO and Port U
      20. 6.9.20 Embedded Emulation Module (EEM) (S Version) (Link to User's Guide)
    10. 6.10 Peripheral File Map
    11. 6.11 Input/Output Diagrams
      1. 6.11.1  Port P1 (P1.0 to P1.7) Input/Output With Schmitt Trigger
      2. 6.11.2  Port P2 (P2.0 to P2.7) Input/Output With Schmitt Trigger
      3. 6.11.3  Port P3 (P3.0 to P3.4) Input/Output With Schmitt Trigger
      4. 6.11.4  Port P4 (P4.0 to P4.7) Input/Output With Schmitt Trigger
      5. 6.11.5  Port P5 (P5.0 and P5.1) Input/Output With Schmitt Trigger
      6. 6.11.6  Port P5 (P5.2) Input/Output With Schmitt Trigger
      7. 6.11.7  Port P5 (P5.3) Input/Output With Schmitt Trigger
      8. 6.11.8  Port P5 (P5.4 and P5.5) Input/Output With Schmitt Trigger
      9. 6.11.9  Port P6 (P6.0 to P6.7) Input/Output With Schmitt Trigger
      10. 6.11.10 Port U (PU.0 and PU.1) Input/Output
      11. 6.11.11 Port J (PJ.0) JTAG Pin TDO, Input/Output With Schmitt Trigger or Output
      12. 6.11.12 Port J (PJ.1 to PJ.3) JTAG Pins TMS, TCK, TDI/TCLK, Input/Output With Schmitt Trigger or Output
    12. 6.12 Device Descriptors
  7. 7Device and Documentation Support
    1. 7.1 Getting Started and Next Steps
    2. 7.2 Device Nomenclature
    3. 7.3 Tools and Software
    4. 7.4 Documentation Support
    5. 7.5 Related Links
    6. 7.6 Community Resources
    7. 7.7 Trademarks
    8. 7.8 Electrostatic Discharge Caution
    9. 7.9 Glossary
  8. 8Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4.1 Pin Diagrams

Figure 4-1 shows the pinout for the MSP430F5310, MSP430F5309, and MSP430F5308 devices in the 64-pin RGC package.

MSP430F5310 MSP430F5309 MSP430F5308 MSP430F5304 slas677_pinning64.gif
A.

NOTE:

TI recommends connection of exposed thermal pad to VSS.
Figure 4-1 64-Pin RGC Package (Top View)

Figure 4-2 shows the pinout for the MSP430F5310, MSP430F5309, and MSP430F5308 devices in the 80-pin ZXH or ZQE package.

MSP430F5310 MSP430F5309 MSP430F5308 MSP430F5304 slas645_zqe80.gifFigure 4-2 80-Pin ZXH or ZQE Package (Top View)

Figure 4-3 shows the pinout for the MSP430F5310, MSP430F5309, and MSP430F5308 devices in the 48-pin RGZ and PT packages.

MSP430F5310 MSP430F5309 MSP430F5308 MSP430F5304 slas677_pinning48rgz.gif
A.

NOTE:

For the RGZ package, TI recommends connection of exposed thermal pad to VSS.
Figure 4-3 48-Pin RGZ or PT Package (Top View) – MSP430F5310, MSP430F5309, MSP430F5308

Figure 4-4 shows the pinout for the MSP430F5304 device in the 48-pin RGZ and PT packages.

MSP430F5310 MSP430F5309 MSP430F5308 MSP430F5304 slas677_pinning48rgz5304.gif
A.

NOTE:

For the RGZ package, TI recommends connection of exposed thermal pad to VSS.
Figure 4-4 48-Pin RGZ or RT Package (Top View) – MSP430F5304