SLAS612F August   2009  – September 2018 MSP430F5418 , MSP430F5419 , MSP430F5435 , MSP430F5436 , MSP430F5437 , MSP430F5438

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagrams
  2. 2Revision History
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagrams
    2. 4.2 Signal Descriptions
      1. Table 4-1 Signal Descriptions
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Active Mode Supply Current Into VCC Excluding External Current
    5. 5.5  Low-Power Mode Supply Currents (Into VCC) Excluding External Current
    6. 5.6  Thermal Resistance Characteristics
    7. 5.7  Schmitt-Trigger Inputs – General-Purpose I/O
    8. 5.8  Inputs – Ports P1 and P2
    9. 5.9  Leakage Current – General-Purpose I/O
    10. 5.10 Outputs – General-Purpose I/O (Full Drive Strength)
    11. 5.11 Outputs – General-Purpose I/O (Reduced Drive Strength)
    12. 5.12 Output Frequency – General-Purpose I/O
    13. 5.13 Typical Characteristics – Outputs, Reduced Drive Strength (PxDS.y = 0)
    14. 5.14 Typical Characteristics – Outputs, Full Drive Strength (PxDS.y = 1)
    15. 5.15 Crystal Oscillator, XT1, Low-Frequency Mode
    16. 5.16 Crystal Oscillator, XT1, High-Frequency Mode
    17. 5.17 Crystal Oscillator, XT2
    18. 5.18 Internal Very-Low-Power Low-Frequency Oscillator (VLO)
    19. 5.19 Internal Reference, Low-Frequency Oscillator (REFO)
    20. 5.20 DCO Frequency
    21. 5.21 PMM, Brownout Reset (BOR)
    22. 5.22 PMM, Core Voltage
    23. 5.23 PMM, SVS High Side
    24. 5.24 PMM, SVM High Side
    25. 5.25 PMM, SVS Low Side
    26. 5.26 PMM, SVM Low Side
    27. 5.27 Wake-up Times From Low-Power Modes
    28. 5.28 Timer_A
    29. 5.29 Timer_B
    30. 5.30 USCI (UART Mode) Clock Frequency
    31. 5.31 USCI (UART Mode)
    32. 5.32 USCI (SPI Master Mode) Clock Frequency
    33. 5.33 USCI (SPI Master Mode)
    34. 5.34 USCI (SPI Slave Mode)
    35. 5.35 USCI (I2C Mode)
    36. 5.36 12-Bit ADC, Power Supply and Input Range Conditions
    37. 5.37 12-Bit ADC, External Reference
    38. 5.38 12-Bit ADC, Built-In Reference
    39. 5.39 12-Bit ADC, Timing Parameters
    40. 5.40 12-Bit ADC, Linearity Parameters
    41. 5.41 12-Bit ADC, Temperature Sensor and Built-In VMID
    42. 5.42 Flash Memory
    43. 5.43 JTAG and Spy-Bi-Wire Interface
  6. 6Detailed Description
    1. 6.1  CPU
    2. 6.2  Operating Modes
    3. 6.3  Interrupt Vector Addresses
    4. 6.4  Memory Organization
    5. 6.5  Bootloader (BSL)
    6. 6.6  JTAG Operation
      1. 6.6.1 JTAG Standard Interface
      2. 6.6.2 Spy-Bi-Wire Interface
    7. 6.7  Flash Memory (Link to User's Guide)
    8. 6.8  RAM (Link to User's Guide)
    9. 6.9  Peripherals
      1. 6.9.1  Digital I/O (Link to User's Guide)
      2. 6.9.2  Oscillator and System Clock (Link to User's Guide)
      3. 6.9.3  Power-Management Module (PMM) (Link to User's Guide)
      4. 6.9.4  Hardware Multiplier (Link to User's Guide)
      5. 6.9.5  Real-Time Clock (RTC_A) (Link to User's Guide)
      6. 6.9.6  Watchdog Timer (WDT_A) (Link to User's Guide)
      7. 6.9.7  System Module (SYS) (Link to User's Guide)
      8. 6.9.8  DMA Controller (Link to User's Guide)
      9. 6.9.9  Universal Serial Communication Interface (USCI) (Links to User's Guide: UART Mode, SPI Mode, I2C Mode)
      10. 6.9.10 TA0 (Link to User's Guide)
      11. 6.9.11 TA1 (Link to User's Guide)
      12. 6.9.12 TB0 (Link to User's Guide)
      13. 6.9.13 ADC12_A (Link to User's Guide)
      14. 6.9.14 CRC16 (Link to User's Guide)
      15. 6.9.15 Embedded Emulation Module (EEM) (L Version) (Link to User's Guide)
      16. 6.9.16 Peripheral File Map
    10. 6.10 Input/Output Diagrams
      1. 6.10.1  Port P1, P1.0 to P1.7, Input/Output With Schmitt Trigger
      2. 6.10.2  Port P2, P2.0 to P2.7, Input/Output With Schmitt Trigger
      3. 6.10.3  Port P3, P3.0 to P3.7, Input/Output With Schmitt Trigger
      4. 6.10.4  Port P4, P4.0 to P4.7, Input/Output With Schmitt Trigger
      5. 6.10.5  Port P5, P5.0 and P5.1, Input/Output With Schmitt Trigger
      6. 6.10.6  Port P5, P5.2, Input/Output With Schmitt Trigger
      7. 6.10.7  Port P5, P5.3, Input/Output With Schmitt Trigger
      8. 6.10.8  Port P5, P5.4 to P5.7, Input/Output With Schmitt Trigger
      9. 6.10.9  Port P6, P6.0 to P6.7, Input/Output With Schmitt Trigger
      10. 6.10.10 Port P7, P7.0, Input/Output With Schmitt Trigger
      11. 6.10.11 Port P7, P7.1, Input/Output With Schmitt Trigger
      12. 6.10.12 Port P7, P7.2 and P7.3, Input/Output With Schmitt Trigger
      13. 6.10.13 Port P7, P7.4 to P7.7, Input/Output With Schmitt Trigger
      14. 6.10.14 Port P8, P8.0 to P8.7, Input/Output With Schmitt Trigger
      15. 6.10.15 Port P9, P9.0 to P9.7, Input/Output With Schmitt Trigger
      16. 6.10.16 Port P10, P10.0 to P10.7, Input/Output With Schmitt Trigger
      17. 6.10.17 Port P11, P11.0 to P11.2, Input/Output With Schmitt Trigger
      18. 6.10.18 Port J, J.0 JTAG Pin TDO, Input/Output With Schmitt Trigger or Output
      19. 6.10.19 Port J, J.1 to J.3 JTAG Pins TMS, TCK, TDI/TCLK, Input/Output With Schmitt Trigger or Output
    11. 6.11 TLV (Device Descriptor) Structures
  7. 7Device and Documentation Support
    1. 7.1  Getting Started and Next Steps
    2. 7.2  Device Nomenclature
    3. 7.3  Tools and Software
    4. 7.4  Documentation Support
    5. 7.5  Related Links
    6. 7.6  Community Resources
    7. 7.7  Trademarks
    8. 7.8  Electrostatic Discharge Caution
    9. 7.9  Export Control Notice
    10. 7.10 Glossary
  8. 8Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.8 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.