SLAS655H January   2010  – May 2021 MSP430F5418A , MSP430F5419A , MSP430F5435A , MSP430F5436A , MSP430F5437A , MSP430F5438A

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Functional Block Diagrams
  5. 5 Revision History
  6. 6 Device Comparison
    1. 6.1 Related Products
  7. 7 Terminal Configuration and Functions
    1. 7.1 Pin Diagrams
    2. 7.2 Signal Descriptions
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Active Mode Supply Current Into VCC Excluding External Current
    5. 8.5  Low-Power Mode Supply Currents (Into VCC) Excluding External Current
    6. 8.6  Thermal Resistance Characteristics
    7. 8.7  Schmitt-Trigger Inputs – General-Purpose I/O
    8. 8.8  Inputs – Ports P1 and P2
    9. 8.9  Leakage Current – General-Purpose I/O
    10. 8.10 Outputs – General-Purpose I/O (Full Drive Strength)
    11. 8.11 Outputs – General-Purpose I/O (Reduced Drive Strength)
    12. 8.12 Output Frequency – General-Purpose I/O
    13. 8.13 Typical Characteristics – Outputs, Reduced Drive Strength (PxDS.y = 0)
    14. 8.14 Typical Characteristics – Outputs, Full Drive Strength (PxDS.y = 1)
    15. 8.15 Crystal Oscillator, XT1, Low-Frequency Mode
    16. 8.16 Crystal Oscillator, XT1, High-Frequency Mode
    17. 8.17 Crystal Oscillator, XT2
    18. 8.18 Internal Very-Low-Power Low-Frequency Oscillator (VLO)
    19. 8.19 Internal Reference, Low-Frequency Oscillator (REFO)
    20. 8.20 DCO Frequency
    21. 8.21 PMM, Brownout Reset (BOR)
    22. 8.22 PMM, Core Voltage
    23. 8.23 PMM, SVS High Side
    24. 8.24 PMM, SVM High Side
    25. 8.25 PMM, SVS Low Side
    26. 8.26 PMM, SVM Low Side
    27. 8.27 Wake-up Times From Low-Power Modes and Reset
    28. 8.28 Timer_A
    29. 8.29 Timer_B
    30. 8.30 USCI (UART Mode) Clock Frequency
    31. 8.31 USCI (UART Mode)
    32. 8.32 USCI (SPI Master Mode) Clock Frequency
    33. 8.33 USCI (SPI Master Mode)
    34. 8.34 USCI (SPI Slave Mode)
    35. 8.35 USCI (I2C Mode)
    36. 8.36 12-Bit ADC, Power Supply and Input Range Conditions
    37. 8.37 12-Bit ADC, Timing Parameters
    38. 8.38 12-Bit ADC, Linearity Parameters Using an External Reference Voltage or AVCC as Reference Voltage
    39. 8.39 12-Bit ADC, Linearity Parameters Using the Internal Reference Voltage
    40. 8.40 12-Bit ADC, Temperature Sensor and Built-In VMID
    41. 8.41 REF, External Reference
    42. 8.42 REF, Built-In Reference
    43. 8.43 Flash Memory
    44. 8.44 JTAG and Spy-Bi-Wire Interface
  9. 9 Detailed Description
    1. 9.1  CPU
    2. 9.2  Operating Modes
    3. 9.3  Interrupt Vector Addresses
    4. 9.4  Memory Organization
    5. 9.5  Bootloader (BSL)
    6. 9.6  JTAG Operation
      1. 9.6.1 JTAG Standard Interface
      2. 9.6.2 Spy-Bi-Wire Interface
    7. 9.7  Flash Memory
    8. 9.8  RAM
    9. 9.9  Peripherals
      1. 9.9.1  Digital I/O
      2. 9.9.2  Oscillator and System Clock
      3. 9.9.3  Power-Management Module (PMM)
      4. 9.9.4  Hardware Multiplier (MPY)
      5. 9.9.5  Real-Time Clock (RTC_A)
      6. 9.9.6  Watchdog Timer (WDT_A)
      7. 9.9.7  System Module (SYS)
      8. 9.9.8  DMA Controller
      9. 9.9.9  Universal Serial Communication Interface (USCI)
      10. 9.9.10 TA0
      11. 9.9.11 TA1
      12. 9.9.12 TB0
      13. 9.9.13 ADC12_A
      14. 9.9.14 CRC16
      15. 9.9.15 Reference (REF) Module Voltage Reference
      16. 9.9.16 Embedded Emulation Module (EEM) (L Version)
      17. 9.9.17 Peripheral File Map
    10. 9.10 Input/Output Diagrams
      1. 9.10.1  Port P1 (P1.0 to P1.7) Input/Output With Schmitt Trigger
      2. 9.10.2  Port P2 (P2.0 to P2.7) Input/Output With Schmitt Trigger
      3. 9.10.3  Port P3 (P3.0 to P3.7) Input/Output With Schmitt Trigger
      4. 9.10.4  Port P4 (P4.0 to P4.7) Input/Output With Schmitt Trigger
      5. 9.10.5  Port P5 (P5.0 and P5.1) Input/Output With Schmitt Trigger
      6. 9.10.6  Port P5 (P5.2 and P5.3) Input/Output With Schmitt Trigger
      7. 9.10.7  Port P5 (P5.4 to P5.7) Input/Output With Schmitt Trigger
      8. 9.10.8  Port P6 (P6.0 to P6.7) Input/Output With Schmitt Trigger
      9. 9.10.9  Port P7 (P7.0 and P7.1) Input/Output With Schmitt Trigger
      10. 9.10.10 Port P7 (P7.2 and P7.3) Input/Output With Schmitt Trigger
      11. 9.10.11 Port P7 (P7.4 to P7.7) Input/Output With Schmitt Trigger
      12. 9.10.12 Port P8 (P8.0 to P8.7) Input/Output With Schmitt Trigger
      13. 9.10.13 Port P9 (P9.0 to P9.7) Input/Output With Schmitt Trigger
      14. 9.10.14 Port P10 (P10.0 to P10.7) Input/Output With Schmitt Trigger
      15. 9.10.15 Port P11 (P11.0 to P11.2) Input/Output With Schmitt Trigger
      16. 9.10.16 Port PJ (PJ.0) JTAG Pin TDO, Input/Output With Schmitt Trigger or Output
      17. 9.10.17 Port PJ (PJ.1 to PJ.3) JTAG Pins TMS, TCK, TDI/TCLK, Input/Output With Schmitt Trigger or Output
    11. 9.11 Device Descriptors
  10. 10Device and Documentation Support
    1. 10.1 Getting Started
    2. 10.2 Device Nomenclature
    3. 10.3 Tools and Software
    4. 10.4 Documentation Support
    5. 10.5 Support Resources
    6. 10.6 Trademarks
    7. 10.7 Electrostatic Discharge Caution
    8. 10.8 Export Control Notice
    9. 10.9 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.17 Crystal Oscillator, XT2

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(1) (2)
PARAMETER TEST CONDITIONS VCC MIN TYP MAX UNIT
IDVCC.XT2 XT2 oscillator crystal current consumption fOSC = 4 MHz, XT2OFF = 0,
XT2BYPASS = 0, XT2DRIVEx = 0,
TA = 25°C		 3.0 V 200 µA
fOSC = 12 MHz, XT2OFF = 0,
XT2BYPASS = 0, XT2DRIVEx = 1,
TA = 25°C		 260
fOSC = 20 MHz, XT2OFF = 0,
XT2BYPASS = 0, XT2DRIVEx = 2,
TA = 25°C		 325
fOSC = 32 MHz, XT2OFF = 0,
XT2BYPASS = 0, XT2DRIVEx = 3,
TA = 25°C		 450
fXT2,HF0 XT2 oscillator crystal frequency, mode 0 XT2DRIVEx = 0, XT2BYPASS = 0(3) 4 8 MHz
fXT2,HF1 XT2 oscillator crystal frequency, mode 1 XT2DRIVEx = 1, XT2BYPASS = 0(3) 8 16 MHz
fXT2,HF2 XT2 oscillator crystal frequency, mode 2 XT2DRIVEx = 2, XT2BYPASS = 0(3) 16 24 MHz
fXT2,HF3 XT2 oscillator crystal frequency, mode 3 XT2DRIVEx = 3, XT2BYPASS = 0(3) 24 32 MHz
fXT2,HF,SW XT2 oscillator logic-level square-wave input frequency, bypass mode XT2BYPASS = 1(4) (3) 0.7 32 MHz
OAHF Oscillation allowance for HF crystals(5) XT2DRIVEx = 0, XT2BYPASS = 0,
fXT2,HF0 = 6 MHz, CL,eff = 15 pF		 450 Ω
XT2DRIVEx = 1, XT2BYPASS = 0,
fXT2,HF1 = 12 MHz, CL,eff = 15 pF		 320
XT2DRIVEx = 2, XT2BYPASS = 0,
fXT2,HF2 = 20 MHz, CL,eff = 15 pF		 200
XT2DRIVEx = 3, XT2BYPASS = 0,
fXT2,HF3 = 32 MHz, CL,eff = 15 pF		 200
tSTART,HF Start-up time fOSC = 6 MHz,
XT2BYPASS = 0, XT2DRIVEx = 0,
TA = 25°C, CL,eff = 15 pF		 3.0 V 0.5 ms
fOSC = 20 MHz,
XT2BYPASS = 0, XT2DRIVEx = 2,
TA = 25°C, CL,eff = 15 pF		 0.3
CL,eff Integrated effective load capacitance, HF mode(6)(1) 1 pF
Duty cycle Measured at ACLK, fXT2,HF2 = 20 MHz 40% 50% 60%
fFault,HF Oscillator fault frequency(7) XT2BYPASS = 1(8) 30 300 kHz
(1) Requires external capacitors at both terminals. Values are specified by crystal manufacturers. In general, an effective load capacitance of up to 18 pF can be supported.
(2) To improve EMI on the XT2 oscillator the following guidelines should be observed.
  • Keep the traces between the device and the crystal as short as possible.
  • Design a good ground plane around the oscillator pins.
  • Prevent crosstalk from other clock or data lines into oscillator pins XT2IN and XT2OUT.
  • Avoid running PCB traces underneath or adjacent to the XT2IN and XT2OUT pins.
  • Use assembly materials and processes that avoid any parasitic load on the oscillator XT2IN and XT2OUT pins.
  • If conformal coating is used, make sure that it does not induce capacitive or resistive leakage between the oscillator pins.
(3) This represents the maximum frequency that can be input to the device externally. Maximum frequency achievable on the device operation is based on the frequencies present on ACLK, MCLK, and SMCLK cannot be exceed for a given range of operation.
(4) When XT2BYPASS is set, the XT2 circuit is automatically powered down. Input signal is a digital square wave with parametrics defined in the Schmitt-trigger Inputs section of this data sheet.
(5) Oscillation allowance is based on a safety factor of 5 for recommended crystals.
(6) Includes parasitic bond and package capacitance (approximately 2 pF per pin).
Because the PCB adds additional capacitance, verify the correct load by measuring the ACLK frequency. For a correct setup, the effective load capacitance should always match the specification of the used crystal.
(7) Frequencies below the MIN specification set the fault flag. Frequencies above the MAX specification do not set the fault flag. Frequencies between the MIN and MAX specifications might set the flag.
(8) Measured with logic-level input frequency but also applies to operation with crystals.