SLAS645L July   2009  – May 2020 MSP430F5500 , MSP430F5501 , MSP430F5502 , MSP430F5503 , MSP430F5504 , MSP430F5505 , MSP430F5506 , MSP430F5507 , MSP430F5508 , MSP430F5509 , MSP430F5510

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagrams
  2. 2Revision History
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagrams
    2. 4.2 Signal Descriptions
      1. Table 4-1 Terminal Functions
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Active Mode Supply Current Into VCC Excluding External Current
    5. 5.5  Low-Power Mode Supply Currents (Into VCC) Excluding External Current
    6. 5.6  Thermal Resistance Characteristics
    7. 5.7  Schmitt-Trigger Inputs – General-Purpose I/O (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.4, P4.0 to P4.7) (P5.0 to P5.5, P6.0 to P6.7, PJ.0 to PJ.3, RST/NMI)
    8. 5.8  Inputs – Ports P1 and P2 (P1.0 to P1.7, P2.0 to P2.7)
    9. 5.9  Leakage Current – General-Purpose I/O (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.4, P4.0 to P4.7) (P5.0 to P5.5, P6.0 to P6.7, PJ.0 to PJ.3, RST/NMI)
    10. 5.10 Outputs – General-Purpose I/O (Full Drive Strength) (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.4, P4.0 to P4.7, P5.0 to P5.5, P6.0 to P6.7, PJ.0 to PJ.3)
    11. 5.11 Outputs – General-Purpose I/O (Reduced Drive Strength) (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.4, P4.0 to P4.7, P5.0 to P5.5, P6.0 to P6.7, PJ.0 to PJ.3)
    12. 5.12 Output Frequency – General-Purpose I/O (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.4, P4.0 to P4.7, P5.0 to P5.5, P6.0 to P6.7, PJ.0 to PJ.3)
    13. 5.13 Typical Characteristics – Outputs, Reduced Drive Strength (PxDS.y = 0)
    14. 5.14 Typical Characteristics – Outputs, Full Drive Strength (PxDS.y = 1)
    15. 5.15 Crystal Oscillator, XT1, Low-Frequency Mode
    16. 5.16 Crystal Oscillator, XT2
    17. 5.17 Internal Very-Low-Power Low-Frequency Oscillator (VLO)
    18. 5.18 Internal Reference, Low-Frequency Oscillator (REFO)
    19. 5.19 DCO Frequency
    20. 5.20 PMM, Brownout Reset (BOR)
    21. 5.21 PMM, Core Voltage
    22. 5.22 PMM, SVS High Side
    23. 5.23 PMM, SVM High Side
    24. 5.24 PMM, SVS Low Side
    25. 5.25 PMM, SVM Low Side
    26. 5.26 Wake-up Times From Low-Power Modes and Reset
    27. 5.27 Timer_A
    28. 5.28 Timer_B
    29. 5.29 USCI (UART Mode) Clock Frequency
    30. 5.30 USCI (UART Mode)
    31. 5.31 USCI (SPI Master Mode) Clock Frequency
    32. 5.32 USCI (SPI Master Mode)
    33. 5.33 USCI (SPI Slave Mode)
    34. 5.34 USCI (I2C Mode)
    35. 5.35 10-Bit ADC, Power Supply and Input Range Conditions
    36. 5.36 10-Bit ADC, Timing Parameters
    37. 5.37 10-Bit ADC, Linearity Parameters
    38. 5.38 REF, External Reference
    39. 5.39 REF, Built-In Reference
    40. 5.40 Comparator B
    41. 5.41 Ports PU.0 and PU.1
    42. 5.42 USB Output Ports (DP and DM)
    43. 5.43 USB Input Ports (DP and DM)
    44. 5.44 USB-PWR (USB Power System)
    45. 5.45 USB-PLL (USB Phase-Locked Loop)
    46. 5.46 Flash Memory
    47. 5.47 JTAG and Spy-Bi-Wire Interface
  6. 6Detailed Description
    1. 6.1  CPU (Link to User's Guide)
    2. 6.2  Operating Modes
    3. 6.3  Interrupt Vector Addresses
    4. 6.4  Memory Organization
    5. 6.5  Bootloader (BSL)
      1. 6.5.1 USB BSL
      2. 6.5.2 UART BSL
    6. 6.6  JTAG Operation
      1. 6.6.1 JTAG Standard Interface
      2. 6.6.2 Spy-Bi-Wire Interface
    7. 6.7  Flash Memory (Link to User's Guide)
    8. 6.8  RAM (Link to User's Guide)
    9. 6.9  Peripherals
      1. 6.9.1  Digital I/O (Link to User's Guide)
      2. 6.9.2  Port Mapping Controller (Link to User's Guide)
      3. 6.9.3  Oscillator and System Clock (Link to User's Guide)
      4. 6.9.4  Power-Management Module (PMM) (Link to User's Guide)
      5. 6.9.5  Hardware Multiplier (MPY) (Link to User's Guide)
      6. 6.9.6  Real-Time Clock (RTC_A) (Link to User's Guide)
      7. 6.9.7  Watchdog Timer (WDT_A) (Link to User's Guide)
      8. 6.9.8  System Module (SYS) (Link to User's Guide)
      9. 6.9.9  DMA Controller (Link to User's Guide)
      10. 6.9.10 Universal Serial Communication Interface (USCI) (Links to User's Guide: UART Mode, SPI Mode, I2C Mode)
      11. 6.9.11 TA0 (Link to User's Guide)
      12. 6.9.12 TA1 (Link to User's Guide)
      13. 6.9.13 TA2 (Link to User's Guide)
      14. 6.9.14 TB0 (Link to User's Guide)
      15. 6.9.15 Comparator_B (Link to User's Guide)
      16. 6.9.16 ADC10_A (Link to User's Guide)
      17. 6.9.17 CRC16 (Link to User's Guide)
      18. 6.9.18 Reference (REF) Voltage Reference (Link to User's Guide)
      19. 6.9.19 Universal Serial Bus (USB) (Link to User's Guide)
      20. 6.9.20 Embedded Emulation Module (EEM) (S Version) (Link to User's Guide)
    10. 6.10 Peripheral File Map
    11. 6.11 Input/Output Diagrams
      1. 6.11.1  Port P1 (P1.0 to P1.7) Input/Output With Schmitt Trigger
      2. 6.11.2  Port P2 (P2.0 to P2.7) Input/Output With Schmitt Trigger
      3. 6.11.3  Port P3 (P3.0 to P3.4) Input/Output With Schmitt Trigger
      4. 6.11.4  Port P4 (P4.0 to P4.7) Input/Output With Schmitt Trigger
      5. 6.11.5  Port P5 (P5.0 and P5.1) Input/Output With Schmitt Trigger
      6. 6.11.6  Port P5 (P5.2) Input/Output With Schmitt Trigger
      7. 6.11.7  Port P5 (P5.3) Input/Output With Schmitt Trigger
      8. 6.11.8  Port P5 (P5.4 and P5.5) Input/Output With Schmitt Trigger
      9. 6.11.9  Port P6 (P6.0 to P6.7) Input/Output With Schmitt Trigger
      10. 6.11.10 Port U (PU.0/DP, PU.1/DM, PUR) USB Ports
      11. 6.11.11 Port J (PJ.0) JTAG Pin TDO, Input/Output With Schmitt Trigger or Output
      12. 6.11.12 Port J (PJ.1 to PJ.3) JTAG Pins TMS, TCK, TDI/TCLK, Input/Output With Schmitt Trigger or Output
    12. 6.12 Device Descriptors
  7. 7Device and Documentation Support
    1. 7.1  Getting Started and Next Steps
    2. 7.2  Device Nomenclature
    3. 7.3  Tools and Software
    4. 7.4  Documentation Support
    5. 7.5  Related Links
    6. 7.6  Community Resources
    7. 7.7  Trademarks
    8. 7.8  Electrostatic Discharge Caution
    9. 7.9  Export Control Notice
    10. 7.10 Glossary
  8. 8Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4.1 Pin Diagrams

Figure 4-1 shows the pinout for the 64-pin RGC package of the MSP430F5510, MSP430F5509, and MSP430F5508 MCUs.

MSP430F5510 MSP430F5509 MSP430F5508 MSP430F5507 MSP430F5506 MSP430F5505 MSP430F5504 MSP430F5503 MSP430F5502 MSP430F5501 MSP430F5500 slas645_pinning64.gif
A.

NOTE:

TI recommends connection of the exposed thermal pad to VSS.
Figure 4-1 64-Pin RGC Package (Top View) – F5510, F5509, F5508

Figure 4-2 shows the pinout for the 80-pin ZXH or ZQE package of the MSP430F5510, MSP430F5509, and MSP430F5508 MCUs. See Section 4.2 for the pin assignments.

MSP430F5510 MSP430F5509 MSP430F5508 MSP430F5507 MSP430F5506 MSP430F5505 MSP430F5504 MSP430F5503 MSP430F5502 MSP430F5501 MSP430F5500 slas645_zqe80.gifFigure 4-2 80-Pin ZXH or ZQE Package (Top View) – F5510, F5509, F5508

Figure 4-3 shows the pinout for 48-pin RGZ and PT packages of the MSP430F5510, MSP430F5509, and MSP430F5508 MCUs.

MSP430F5510 MSP430F5509 MSP430F5508 MSP430F5507 MSP430F5506 MSP430F5505 MSP430F5504 MSP430F5503 MSP430F5502 MSP430F5501 MSP430F5500 slas645_pinning48.gif
A.

NOTE:

TI recommends connection of the exposed thermal pad to VSS.
Figure 4-3 48-Pin RGZ or PT Package (Top View) – F5510, F5509, F5508

Figure 4-4 shows the pinout for the 48-pin RGZ and PT packages of the MSP430F5507, MSP430F5506, MSP430F5505, and MSP430F5504 MCUs.

MSP430F5510 MSP430F5509 MSP430F5508 MSP430F5507 MSP430F5506 MSP430F5505 MSP430F5504 MSP430F5503 MSP430F5502 MSP430F5501 MSP430F5500 slas645_pinning48_no_compb.gif
A.

NOTE:

TI recommends connection of the exposed thermal pad to VSS.
Figure 4-4 48-Pin RGZ or PT Package (Top View) – F5507, F5506, F5505, F5504

Figure 4-5 shows the pinout for the 48-pin RGZ package of the MSP430F5503, MSP430F5502, MSP430F5501, and MSP430F5500 MCUs.

MSP430F5510 MSP430F5509 MSP430F5508 MSP430F5507 MSP430F5506 MSP430F5505 MSP430F5504 MSP430F5503 MSP430F5502 MSP430F5501 MSP430F5500 slas645_pinning48_no_adc10.gif
A.

NOTE:

TI recommends connection of the exposed thermal pad to VSS.
Figure 4-5 48-Pin RGZ Package (Top View) – F5503, F5502, F5501, F5500