SLAS590P March   2009  – September 2020 MSP430F5513 , MSP430F5514 , MSP430F5515 , MSP430F5517 , MSP430F5519 , MSP430F5521 , MSP430F5522 , MSP430F5524 , MSP430F5525 , MSP430F5526 , MSP430F5527 , MSP430F5528 , MSP430F5529

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Functional Block Diagrams
  5. Revision History
  6. Device Comparison
    1. 6.1 Related Products
  7. Terminal Configuration and Functions
    1. 7.1 Pin Diagrams
    2. 7.2 Signal Descriptions
  8. Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Active Mode Supply Current Into VCC Excluding External Current
    5. 8.5  Low-Power Mode Supply Currents (Into VCC) Excluding External Current
    6. 8.6  Thermal Resistance Characteristics
    7. 8.7  Schmitt-Trigger Inputs – General-Purpose I/O (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.7, P4.0 to P4.7, P5.0 to P5.7, P6.0 to P6.7, P7.0 to P7.7, P8.0 to P8.2, PJ.0 to PJ.3, RST/NMI)
    8. 8.8  Inputs – Ports P1 and P2 (P1.0 to P1.7, P2.0 to P2.7)
    9. 8.9  Leakage Current – General-Purpose I/O (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.7, P4.0 to P4.7) (P5.0 to P5.7, P6.0 to P6.7, P7.0 to P7.7, P8.0 to P8.2, PJ.0 to PJ.3, RST/NMI)
    10. 8.10 Outputs – General-Purpose I/O (Full Drive Strength) (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.7, P4.0 to P4.7, P5.0 to P5.7, P6.0 to P6.7, P7.0 to P7.7, P8.0 to P8.2, PJ.0 to PJ.3)
    11. 8.11 Outputs – General-Purpose I/O (Reduced Drive Strength) (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.7, P4.0 to P4.7, P5.0 to P5.7, P6.0 to P6.7, P7.0 to P7.7, P8.0 to P8.2, PJ.0 to PJ.3)
    12. 8.12 Output Frequency – General-Purpose I/O (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.7, P4.0 to P4.7, P5.0 to P5.7, P6.0 to P6.7, P7.0 to P7.7, P8.0 to P8.2, PJ.0 to PJ.3)
    13. 8.13 Typical Characteristics – Outputs, Reduced Drive Strength (PxDS.y = 0)
    14. 8.14 Typical Characteristics – Outputs, Full Drive Strength (PxDS.y = 1)
    15. 8.15 Crystal Oscillator, XT1, Low-Frequency Mode
    16. 8.16 Crystal Oscillator, XT2
    17. 8.17 Internal Very-Low-Power Low-Frequency Oscillator (VLO)
    18. 8.18 Internal Reference, Low-Frequency Oscillator (REFO)
    19. 8.19 DCO Frequency
    20. 8.20 PMM, Brownout Reset (BOR)
    21. 8.21 PMM, Core Voltage
    22. 8.22 PMM, SVS High Side
    23. 8.23 PMM, SVM High Side
    24. 8.24 PMM, SVS Low Side
    25. 8.25 PMM, SVM Low Side
    26. 8.26 Wake-up Times From Low-Power Modes and Reset
    27. 8.27 Timer_A
    28. 8.28 Timer_B
    29. 8.29 USCI (UART Mode) Clock Frequency
    30. 8.30 USCI (UART Mode)
    31. 8.31 USCI (SPI Master Mode) Clock Frequency
    32. 8.32 USCI (SPI Master Mode)
    33. 8.33 USCI (SPI Slave Mode)
    34. 8.34 USCI (I2C Mode)
    35. 8.35 12-Bit ADC, Power Supply and Input Range Conditions
    36. 8.36 12-Bit ADC, Timing Parameters
    37. 8.37 12-Bit ADC, Linearity Parameters Using an External Reference Voltage or AVCC as Reference Voltage
    38. 8.38 12-Bit ADC, Linearity Parameters Using the Internal Reference Voltage
    39. 8.39 12-Bit ADC, Temperature Sensor and Built-In VMID
    40. 8.40 REF, External Reference
    41. 8.41 REF, Built-In Reference
    42. 8.42 Comparator_B
    43. 8.43 Ports PU.0 and PU.1
    44. 8.44 USB Output Ports DP and DM
    45. 8.45 USB Input Ports DP and DM
    46. 8.46 USB-PWR (USB Power System)
    47. 8.47 USB-PLL (USB Phase-Locked Loop)
    48. 8.48 Flash Memory
    49. 8.49 JTAG and Spy-Bi-Wire Interface
  9. Detailed Description
    1. 9.1  CPU
    2. 9.2  Operating Modes
    3. 9.3  Interrupt Vector Addresses
    4. 9.4  Memory Organization
    5. 9.5  Bootloader (BSL)
      1. 9.5.1 USB BSL
      2. 9.5.2 UART BSL
    6. 9.6  JTAG Operation
      1. 9.6.1 JTAG Standard Interface
      2. 9.6.2 Spy-Bi-Wire Interface
    7. 9.7  Flash Memory
    8. 9.8  RAM
    9. 9.9  Peripherals
      1. 9.9.1  Digital I/O
      2. 9.9.2  Port Mapping Controller
      3. 9.9.3  Oscillator and System Clock
      4. 9.9.4  Power-Management Module (PMM)
      5. 9.9.5  Hardware Multiplier
      6. 9.9.6  Real-Time Clock (RTC_A)
      7. 9.9.7  Watchdog Timer (WDT_A)
      8. 9.9.8  System Module (SYS)
      9. 9.9.9  DMA Controller
      10. 9.9.10 Universal Serial Communication Interface (USCI)
      11. 9.9.11 TA0
      12. 9.9.12 TA1
      13. 9.9.13 TA2
      14. 9.9.14 TB0
      15. 9.9.15 Comparator_B
      16. 9.9.16 ADC12_A
      17. 9.9.17 CRC16
      18. 9.9.18 Voltage Reference (REF) Module
      19. 9.9.19 Universal Serial Bus (USB)
      20. 9.9.20 Embedded Emulation Module (EEM)
      21. 9.9.21 Peripheral File Map
    10. 9.10 Input/Output Diagrams
      1. 9.10.1  Port P1 (P1.0 to P1.7) Input/Output With Schmitt Trigger
      2. 9.10.2  Port P2 (P2.0 to P2.7) Input/Output With Schmitt Trigger
      3. 9.10.3  Port P3 (P3.0 to P3.7) Input/Output With Schmitt Trigger
      4. 9.10.4  Port P4 (P4.0 to P4.7) Input/Output With Schmitt Trigger
      5. 9.10.5  Port P5 (P5.0 and P5.1) Input/Output With Schmitt Trigger
      6. 9.10.6  Port P5 (P5.2 and P5.3) Input/Output With Schmitt Trigger
      7. 9.10.7  Port P5 (P5.4 and P5.5) Input/Output With Schmitt Trigger
      8. 9.10.8  Port P5 (P5.6 and P5.7) Input/Output With Schmitt Trigger
      9. 9.10.9  Port P6 (P6.0 to P6.7) Input/Output With Schmitt Trigger
      10. 9.10.10 Port P7 (P7.0 to P7.3) Input/Output With Schmitt Trigger
      11. 9.10.11 Port P7 (P7.4 to P7.7) Input/Output With Schmitt Trigger
      12. 9.10.12 Port P8 (P8.0 to P8.2) Input/Output With Schmitt Trigger
      13. 9.10.13 Port PU (PU.0/DP, PU.1/DM, PUR) USB Ports
      14. 9.10.14 Port PJ (PJ.0) JTAG Pin TDO, Input/Output With Schmitt Trigger or Output
      15. 9.10.15 Port PJ (PJ.1 to PJ.3) JTAG Pins TMS, TCK, TDI/TCLK, Input/Output With Schmitt Trigger or Output
    11. 9.11 Device Descriptors (TLV)
  10. 10Device and Documentation Support
    1. 10.1  Getting Started and Next Steps
    2. 10.2  Device Nomenclature
    3. 10.3  Tools and Software
    4. 10.4  Documentation Support
    5. 10.5  Related Links
    6. 10.6  Support Resources
    7. 10.7  Trademarks
    8. 10.8  Electrostatic Discharge Caution
    9. 10.9  Export Control Notice
    10. 10.10 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Documentation Support

The following documents describe the MSP430F552x and MSP430F551x devices. Copies of these documents are available on the Internet at www.ti.com.

Receiving Notification of Document Updates

To receive notification of documentation updates—including silicon errata—go to the product folder for your device on ti.com (for links to the product folders, see Section 10.5). In the upper right corner, click the "Alert me" button. This registers you to receive a weekly digest of product information that has changed (if any). For change details, check the revision history of any revised document.

Errata

MSP430F5529 Device Erratasheet

Describes the known exceptions to the functional specifications.

MSP430F5528 Device Erratasheet

Describes the known exceptions to the functional specifications.

MSP430F5527 Device Erratasheet

Describes the known exceptions to the functional specifications.

MSP430F5526 Device Erratasheet

Describes the known exceptions to the functional specifications.

MSP430F5525 Device Erratasheet

Describes the known exceptions to the functional specifications.

MSP430F5524 Device Erratasheet

Describes the known exceptions to the functional specifications.

MSP430F5522 Device Erratasheet

Describes the known exceptions to the functional specifications.

MSP430F5521 Device Erratasheet

Describes the known exceptions to the functional specifications.

MSP430F5519 Device Erratasheet

Describes the known exceptions to the functional specifications.

MSP430F5517 Device Erratasheet

Describes the known exceptions to the functional specifications.

MSP430F5515 Device Erratasheet

Describes the known exceptions to the functional specifications.

MSP430F5514 Device Erratasheet

Describes the known exceptions to the functional specifications.

MSP430F5513 Device Erratasheet

Describes the known exceptions to the functional specifications.

User's Guides

MSP430x5xx and MSP430x6xx Family User's Guide

Detailed information on the modules and peripherals available in this device family.

MSP430 Flash Device Bootloader (BSL) User's Guide

The MSP430 bootloader (BSL) lets users communicate with embedded memory in the MSP430 microcontroller during the prototyping phase, final production, and in service. Both the programmable memory (flash memory) and the data memory (RAM) can be modified as required. Do not confuse the bootloader with the bootstrap loader programs found in some digital signal processors (DSPs) that automatically load program code (and data) from external memory to the internal memory of the DSP.

MSP430 Programming With the JTAG Interface

This document describes the functions that are required to erase, program, and verify the memory module of the MSP430 flash-based and FRAM-based microcontroller families using the JTAG communication port. In addition, it describes how to program the JTAG access security fuse that is available on all MSP430 devices. This document describes device access using both the standard 4-wire JTAG interface and the 2-wire JTAG interface, which is also referred to as Spy-Bi-Wire (SBW).

MSP430 Hardware Tools User's Guide

This manual describes the hardware of the TI MSP-FET430 Flash Emulation Tool (FET). The FET is the program development tool for the MSP430 ultra-low-power microcontroller. Both available interface types, the parallel port interface and the USB interface, are described.

Application Reports

MSP430 32-kHz Crystal Oscillators

Selection of the right crystal, correct load circuit, and proper board layout are important for a stable crystal oscillator. This application report summarizes crystal oscillator function and explains the parameters to select the correct crystal for MSP430 ultra-low-power operation. In addition, hints and examples for correct board layout are given. The document also contains detailed information on the possible oscillator tests to ensure stable oscillator operation in mass production.

MSP430 System-Level ESD Considerations

System-level ESD has become increasingly demanding with silicon technology scaling towards lower voltages and the need for designing cost-effective and ultra-low-power components. This application report addresses different ESD topics to help board designers and OEMs understand and design robust system-level designs. A few real-world system-level ESD protection design examples and their results are also discussed.