SLAS768 Data sheet

SLAS768E September 2012 – September 2018 MSP430F6745 , MSP430F6746 , MSP430F6747 , MSP430F6748 , MSP430F6749 , MSP430F6765 , MSP430F6766 , MSP430F6767 , MSP430F6768 , MSP430F6769 , MSP430F6775 , MSP430F6776 , MSP430F6777 , MSP430F6778 , MSP430F6779

PRODUCTION DATA.

Package Options

Mechanical Data (Package|Pins)

PEU|128
- MPQF058B
PZ|100
- MTQF013A

Thermal pad, mechanical data (Package|Pins)

PZ|100
- QFND428

Orderable Information

5.63 JTAG and Spy-Bi-Wire Interface

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER		V_CC	MIN	TYP	MAX	UNIT
f_SBW	Spy-Bi-Wire input frequency	2.2 V, 3 V	0		20	MHz
t_SBW,Low	Spy-Bi-Wire low clock pulse duration	2.2 V, 3 V	0.025		15	µs
t_{SBW, En}	Spy-Bi-Wire enable time (TEST high to acceptance of first clock edge)⁽¹⁾	2.2 V, 3 V			1	µs
t_SBW,Rst	Spy-Bi-Wire return to normal operation time		15		100	µs
f_TCK	TCK input frequency for 4-wire JTAG⁽²⁾	2.2 V	0		5	MHz
f_TCK	TCK input frequency for 4-wire JTAG⁽²⁾	3 V	0		10	MHz
R_internal	Internal pulldown resistance on TEST	2.2 V, 3 V	45	60	80	kΩ

(1) Tools that access the Spy-Bi-Wire interface must wait for the minimum t_SBW,En time after pulling the TEST/SBWTCK pin high before applying the first SBWTCK clock edge.

(2) f_TCK may be restricted to meet the timing requirements of the module selected.