SLASE50A February   2015  – October 2018 MSP430F67621A , MSP430F67641A

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Application Diagram
  2. 2Revision History
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagrams
    2. 4.2 Pin Attributes
    3. 4.3 Signal Descriptions
      1. Table 4-3 Signal Descriptions – PZ Package
      2. Table 4-4 Signal Descriptions – PN Package
    4. 4.4 Pin Multiplexing
    5. 4.5 Buffer Type
    6. 4.6 Connection of Unused Pins
  5. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Active Mode Supply Current Into VCC Excluding External Current
    5. 5.5 Low-Power Mode Supply Currents (Into VCC) Excluding External Current
    6. 5.6 Low-Power Mode With LCD Supply Currents (Into VCC) Excluding External Current
    7. 5.7 Thermal Resistance Characteristics
    8. 5.8 Timing and Switching Characteristics
      1. 5.8.1  Power Supply Sequencing
      2. 5.8.2  Reset Timing
        1. Table 5-1 Wake-up Times From Low-Power Modes and Reset
      3. 5.8.3  Clock Specifications
        1. Table 5-2 Crystal Oscillator, XT1, Low-Frequency Mode
        2. Table 5-3 Internal Very-Low-Power Low-Frequency Oscillator (VLO)
        3. Table 5-4 Internal Reference, Low-Frequency Oscillator (REFO)
        4. Table 5-5 DCO Frequency
      4. 5.8.4  Digital I/O Ports
        1. Table 5-6  Schmitt-Trigger Inputs, General-Purpose I/O
        2. Table 5-7  Inputs, Ports P1 and P2
        3. Table 5-8  Leakage Current, General-Purpose I/O
        4. Table 5-9  Outputs, General-Purpose I/O (Full Drive Strength)
        5. 5.8.4.1    Typical Characteristics, General-Purpose I/O (Full Drive Strength)
        6. Table 5-10 Outputs, General-Purpose I/O (Reduced Drive Strength)
        7. 5.8.4.2    Typical Characteristics, General-Purpose I/O (Reduced Drive Strength)
        8. Table 5-11 Output Frequency, General-Purpose I/O
      5. 5.8.5  Power-Management Module (PMM)
        1. Table 5-12 PMM, Brownout Reset (BOR)
        2. Table 5-13 PMM, Core Voltage
        3. Table 5-14 PMM, SVS High Side
        4. Table 5-15 PMM, SVM High Side
        5. Table 5-16 PMM, SVS Low Side
        6. Table 5-17 PMM, SVM Low Side
      6. 5.8.6  Auxiliary Supplies Module
        1. Table 5-18 Auxiliary Supplies, Recommended Operating Conditions
        2. Table 5-19 Auxiliary Supplies, AUX3 (Backup Subsystem) Currents
        3. Table 5-20 Auxiliary Supplies, Auxiliary Supply Monitor
        4. Table 5-21 Auxiliary Supplies, Switch ON-Resistance
        5. Table 5-22 Auxiliary Supplies, Switching Time
        6. Table 5-23 Auxiliary Supplies, Switch Leakage
        7. Table 5-24 Auxiliary Supplies, Auxiliary Supplies to ADC10_A
        8. Table 5-25 Auxiliary Supplies, Charge-Limiting Resistor
      7. 5.8.7  Timer_A Module
        1. Table 5-26 Timer_A
      8. 5.8.8  eUSCI Module
        1. Table 5-27 eUSCI (UART Mode) Clock Frequency
        2. Table 5-28 eUSCI (UART Mode) Switching Characteristics
        3. Table 5-29 eUSCI (SPI Master Mode) Clock Frequency
        4. Table 5-30 eUSCI (SPI Master Mode) Switching Characteristics
        5. Table 5-31 eUSCI (SPI Slave Mode)
        6. Table 5-32 eUSCI (I2C Mode)
      9. 5.8.9  LCD Controller
        1. Table 5-33 LCD_C Operating Conditions
        2. Table 5-34 LCD_C Electrical Characteristics
      10. 5.8.10 SD24_B Module
        1. Table 5-35 SD24_B Power Supply and Recommended Operating Conditions
        2. Table 5-36 SD24_B Analog Input
        3. Table 5-37 SD24_B Supply Currents
        4. Table 5-38 SD24_B Performance
        5. Table 5-39 SD24_B AC Performance
        6. Table 5-40 SD24_B AC Performance
        7. Table 5-41 SD24_B AC Performance
        8. Table 5-42 SD24_B External Reference Input
      11. 5.8.11 ADC10_A Module
        1. Table 5-43 10-Bit ADC, Power Supply and Input Range Conditions
        2. Table 5-44 10-Bit ADC, Timing Parameters
        3. Table 5-45 10-Bit ADC, Linearity Parameters
        4. Table 5-46 10-Bit ADC, External Reference
      12. 5.8.12 REF Module
        1. Table 5-47 REF, Built-In Reference
      13. 5.8.13 Flash
        1. Table 5-48 Flash Memory
      14. 5.8.14 Emulation and Debug
        1. Table 5-49 JTAG and Spy-Bi-Wire Interface
  6. 6Detailed Description
    1. 6.1  Overview
    2. 6.2  Functional Block Diagrams
    3. 6.3  CPU
    4. 6.4  Instruction Set
    5. 6.5  Operating Modes
    6. 6.6  Interrupt Vector Addresses
    7. 6.7  Bootloader (BSL)
    8. 6.8  JTAG Operation
      1. 6.8.1 JTAG Standard Interface
      2. 6.8.2 Spy-Bi-Wire Interface
    9. 6.9  Flash Memory
    10. 6.10 RAM
    11. 6.11 Backup RAM
    12. 6.12 Peripherals
      1. 6.12.1  Oscillator and System Clock
      2. 6.12.2  Power-Management Module (PMM)
      3. 6.12.3  Auxiliary Supply System
      4. 6.12.4  Backup Subsystem
      5. 6.12.5  Digital I/O
      6. 6.12.6  Port Mapping Controller
      7. 6.12.7  System Module (SYS)
      8. 6.12.8  Watchdog Timer (WDT_A)
      9. 6.12.9  DMA Controller
      10. 6.12.10 CRC16
      11. 6.12.11 Hardware Multiplier
      12. 6.12.12 Enhanced Universal Serial Communication Interface (eUSCI)
      13. 6.12.13 ADC10_A
      14. 6.12.14 SD24_B
      15. 6.12.15 TA0
      16. 6.12.16 TA1
      17. 6.12.17 TA2
      18. 6.12.18 TA3
      19. 6.12.19 SD24_B Triggers
      20. 6.12.20 ADC10_A Triggers
      21. 6.12.21 Real-Time Clock (RTC_C)
      22. 6.12.22 Reference (REF) Module Voltage Reference
      23. 6.12.23 LCD_C
      24. 6.12.24 Embedded Emulation Module (EEM) (S Version)
    13. 6.13 Input/Output Diagrams
      1. 6.13.1  Port P1 (P1.0 and P1.1) Input/Output With Schmitt Trigger
      2. 6.13.2  Port P1 (P1.2) Input/Output With Schmitt Trigger
      3. 6.13.3  Port P1 (P1.3 to P1.5) Input/Output With Schmitt Trigger
      4. 6.13.4  Port P1 (P1.6 and P1.7), Port P2 (P2.0 and P2.1) (PZ Package Only) Input/Output With Schmitt Trigger
      5. 6.13.5  Port P2 (P2.2 to P2.7) Input/Output With Schmitt Trigger (PZ Package Only)
      6. 6.13.6  Port P3 (P3.0 to P3.3) Input/Output With Schmitt Trigger (PZ Package Only)
      7. 6.13.7  Port P3 (P3.4 to P3.7) Input/Output With Schmitt Trigger (PZ Package Only)
      8. 6.13.8  Port P4 (P4.0 to P4.7), Port P5 (P5.0 to P5.7), Port P6 (P6.0 to P6.7), Port P7 (P7.0 to P7.7), Port P8 (P8.0 to P8.3) Input/Output With Schmitt Trigger (PZ Package Only)
      9. 6.13.9  Port P8 (P8.4 to P8.7) Input/Output With Schmitt Trigger (PZ Package Only)
      10. 6.13.10 Port P9 (P9.0), Input/Output With Schmitt Trigger (PZ Package Only)
      11. 6.13.11 Port P9 (P9.1 to P9.3) Input/Output With Schmitt Trigger (PZ Package Only)
      12. 6.13.12 Port P2 (P2.0 and P2.1) Input/Output With Schmitt Trigger (PN Package Only)
      13. 6.13.13 Port P2 (P2.2 to P2.7) Input/Output With Schmitt Trigger (PN Package Only)
      14. 6.13.14 Port P3 (P3.0 to P3.7) Input/Output With Schmitt Trigger (PN Package Only)
      15. 6.13.15 Port P4 (P4.0 to P4.7), Port P5 (P5.0 to P5.7), Port P6 (P6.0 to P6.7) Input/Output With Schmitt Trigger (PN Package Only)
      16. 6.13.16 Port PJ (PJ.0) JTAG Pin TDO, Input/Output With Schmitt Trigger or Output
      17. 6.13.17 Port PJ (PJ.1 to PJ.3) JTAG Pins TMS, TCK, TDI/TCLK, Input/Output With Schmitt Trigger or Output
    14. 6.14 Device Descriptors (TLV)
    15. 6.15 Memory
      1. 6.15.1 Peripheral File Map
    16. 6.16 Identification
      1. 6.16.1 Revision Identification
      2. 6.16.2 Device Identification
      3. 6.16.3 JTAG Identification
  7. 7Applications, Implementation, and Layout
  8. 8Device and Documentation Support
    1. 8.1  Getting Started and Next Steps
    2. 8.2  Device Nomenclature
    3. 8.3  Tools and Software
    4. 8.4  Documentation Support
    5. 8.5  Related Links
    6. 8.6  Community Resources
    7. 8.7  Trademarks
    8. 8.8  Electrostatic Discharge Caution
    9. 8.9  Export Control Notice
    10. 8.10 Glossary
  9. 9Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.7 Thermal Resistance Characteristics

THERMAL METRIC(1)(2) VALUE UNIT
RθJA Junction-to-ambient thermal resistance, still air LQFP 80 (PN) 46.3 °C/W
LQFP 100 (PZ) 45.6
RθJC(TOP) Junction-to-case (top) thermal resistance LQFP 80 (PN) 11.5 °C/W
LQFP 100 (PZ) 11.0
RθJC(BOTTOM) Junction-to-case (bottom) thermal resistance LQFP 80 (PN) N/A(3) °C/W
LQFP 100 (PZ) N/A
RθJB Junction-to-board thermal resistance LQFP 80 (PN) 21.9 °C/W
LQFP 100 (PZ) 23.4
ΨJT Junction-to-package-top thermal characterization parameter LQFP 80 (PN) 0.5 °C/W
LQFP 100 (PZ) 0.4
ΨJB Junction-to-board thermal characterization parameter LQFP 80 (PN) 21.6 °C/W
LQFP 100 (PZ) 23.0
(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.
(2) These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RθJC] value, which is based on a JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these EIA/JEDEC standards:
  • JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
  • JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
  • JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
  • JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements
(3) N/A = not applicable