SLAS982A May 2014 – September 2018 MSP430F6745A , MSP430F6746A , MSP430F6747A , MSP430F6748A , MSP430F6749A , MSP430F6765A , MSP430F6766A , MSP430F6767A , MSP430F6768A , MSP430F6769A , MSP430F6775A , MSP430F6776A , MSP430F6777A , MSP430F6778A , MSP430F6779A
PRODUCTION DATA.
THERMAL METRIC(1)(2) | VALUE | UNIT | ||
---|---|---|---|---|
RθJA | Junction-to-ambient thermal resistance, still air | LQFP 128 (PEU) | 44.4 | °C/W |
LQFP 100 (PZ) | 42.9 | |||
RθJC(TOP) | Junction-to-case (top) thermal resistance | LQFP 128 (PEU) | 10.5 | °C/W |
LQFP 100 (PZ) | 9.3 | |||
RθJC(BOTTOM) | Junction-to-case (bottom) thermal resistance | LQFP 128 (PEU) | N/A(3) | °C/W |
LQFP 100 (PZ) | N/A | |||
RθJB | Junction-to-board thermal resistance | LQFP 128 (PEU) | 23.1 | °C/W |
LQFP 100 (PZ) | 20.6 | |||
ΨJT | Junction-to-package-top thermal characterization parameter | LQFP 128 (PEU) | 0.4 | °C/W |
LQFP 100 (PZ) | 0.3 | |||
ΨJB | Junction-to-board thermal characterization parameter | LQFP 128 (PEU) | 22.8 | °C/W |
LQFP 100 (PZ) | 20.3 |