SLASE58E February 2016 – December 2019 MSP430FR2310 , MSP430FR2311
PRODUCTION DATA.
The MSP430FR231x FRAM microcontrollers (MCUs) are part of the MSP430™ MCU value line sensing family. The devices integrate a configurable low-leakage transimpedance amplifier (TIA) and a general purpose operational amplifier. The MCUs feature a powerful 16-bit RISC CPU, 16-bit registers, and a constant generator that contribute to maximum code efficiency. The digitally controlled oscillator (DCO) also allows the device to wake up from low-power modes to active mode typically in less than 10 µs. The feature set of these MCUs are well suited for applications ranging from smoke detectors to portable health and fitness accessories.
The ultra-low-power MSP430FR231x MCU family consists of several devices that feature embedded nonvolatile FRAM and different sets of peripherals targeted for various sensing and measurement applications. The architecture, FRAM, and peripherals, combined with extensive low-power modes, are optimized to achieve extended battery life in portable and wireless sensing applications. FRAM is a nonvolatile memory technology that combines the speed, flexibility, and endurance of SRAM with the stability and reliability of flash at lower total power consumption.
The MSP430FR231x MCUs are supported by an extensive hardware and software ecosystem with reference designs and code examples to get your design started quickly. Development kits include the MSP‑EXP430FR2311LaunchPad™ development kit and the MSP‑TS430PW20 20-pin target development board. TI provides free MSP430Ware™ software, which is available as a component of Code Composer Studio™ IDE desktop and cloud versions within TI Resource Explorer. The MSP430 MCUs are also supported by extensive online collateral, training, and online support through the E2E™ Community Forum.
For complete module descriptions, see the MSP430FR4xx and MSP430FR2xx Family User's Guide.
PART NUMBER | PACKAGE | BODY SIZE(2) |
---|---|---|
MSP430FR2311IPW20 | TSSOP (20) | 6.5 mm × 4.4 mm |
MSP430FR2310IPW20 | ||
MSP430FR2311IPW16 | TSSOP (16) | 5 mm × 4.4 mm |
MSP430FR2310IPW16 | ||
MSP430FR2311IRGY | VQFN (16) | 4 mm × 3.5 mm |
MSP430FR2310IRGY |
CAUTION
System-level ESD protection must be applied in compliance with the device-level ESD specification to prevent electrical overstress or disturbing of data or code memory. See MSP430™ System-Level ESD Considerations for more information.
Figure 1-1 shows the functional block diagram.
Changes from revision D to revision E
Changes from August 29, 2018 to December 9, 2019
Changes from September 12, 2017 to August 28, 2018
Changes from June 1, 2016 to September 11, 2017
Changes from March 30, 2016 to May 31, 2016
Changes from February 23, 2016 to March 29, 2016
Table 3-1 summarizes the features of the available family members.
DEVICE | PROGRAM FRAM (KB) | SRAM (Bytes) | TB0, TB1 | eUSCI_A | eUSCI_B | 10-BIT ADC CHANNELS | SAC0 (OA) | TIA0 | eCOMP0 | I/O | PACKAGE |
---|---|---|---|---|---|---|---|---|---|---|---|
MSP430FR2311IPW20 | 3.75 | 1024 | 3 CCR(3) | 1 | 1 | 8 | 1 | 1 | 1 | 16 | 20 PW (TSSOP) |
MSP430FR2310IPW20 | 2 | 1024 | 3 CCR(3) | 1 | 1 | 8 | 1 | 1 | 1 | 16 | 20 PW (TSSOP) |
MSP430FR2311IPW16 | 3.75 | 1024 | 3 CCR(3)(4) | 1 | 1 | 8 | 1 | 1 | 1 | 11 | 16 PW (TSSOP) |
MSP430FR2310IPW16 | 2 | 1024 | 3 CCR(3)(4) | 1 | 1 | 8 | 1 | 1 | 1 | 11 | 16 PW (TSSOP) |
MSP430FR2311IRGY | 3.75 | 1024 | 3 CCR(3) | 1 | 1 | 8 | 1 | 1 | 1 | 12 | 16 RGY (VQFN) |
MSP430FR2310IRGY | 2 | 1024 | 3 CCR(3) | 1 | 1 | 8 | 1 | 1 | 1 | 12 | 16 RGY (VQFN) |
For information about other devices in this family of products or related products, see the following links.
TI 16-bit and 32-bit microcontrollers
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Products for MSP430 ultra-low-power sensing & measurement MCUs
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Companion products for MSP430FR2311
Review products that are frequently purchased or used with this product.
Reference designs for MSP430FR2311
Find reference designs leveraging the best in TI technology – from analog and power management to embedded processors