SLASE58E February   2016  – December 2019 MSP430FR2310 , MSP430FR2311

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagrams
    2. 4.2 Pin Attributes
    3. 4.3 Signal Descriptions
    4. 4.4 Pin Multiplexing
    5. 4.5 Buffer Type
    6. 4.6 Connection of Unused Pins
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Active Mode Supply Current Into VCC Excluding External Current
    5. 5.5  Active Mode Supply Current Per MHz
    6. 5.6  Low-Power Mode LPM0 Supply Currents Into VCC Excluding External Current
    7. 5.7  Low-Power Mode LPM3 and LPM4 Supply Currents (Into VCC) Excluding External Current
    8. 5.8  Low-Power Mode LPMx.5 Supply Currents (Into VCC) Excluding External Current
    9. 5.9  Production Distribution of LPM Supply Currents
    10. 5.10 Typical Characteristics – Current Consumption Per Module
    11. 5.11 Thermal Resistance Characteristics
    12. 5.12 Timing and Switching Characteristics
      1. 5.12.1  Power Supply Sequencing
        1. Table 5-1 PMM, SVS and BOR
      2. 5.12.2  Reset Timing
        1. Table 5-2 Wake-up Times From Low-Power Modes and Reset
      3. 5.12.3  Clock Specifications
        1. Table 5-3 XT1 Crystal Oscillator (Low Frequency)
        2. Table 5-4 XT1 Crystal Oscillator (High Frequency)
        3. Table 5-5 DCO FLL
        4. Table 5-6 DCO Frequency
        5. Table 5-7 REFO
        6. Table 5-8 Internal Very-Low-Power Low-Frequency Oscillator (VLO)
        7. Table 5-9 Module Oscillator (MODOSC)
      4. 5.12.4  Digital I/Os
        1. Table 5-10 Digital Inputs
        2. Table 5-11 Digital Outputs
        3. 5.12.4.1   Digital I/O Typical Characteristics
      5. 5.12.5  VREF+ Built-in Reference
        1. Table 5-12 VREF+
      6. 5.12.6  Timer_B
        1. Table 5-13 Timer_B
      7. 5.12.7  eUSCI
        1. Table 5-14 eUSCI (UART Mode) Clock Frequency
        2. Table 5-15 eUSCI (UART Mode) Switching Characteristics
        3. Table 5-16 eUSCI (SPI Master Mode) Clock Frequency
        4. Table 5-17 eUSCI (SPI Master Mode) Switching Characteristics
        5. Table 5-18 eUSCI (SPI Slave Mode) Switching Characteristics
        6. Table 5-19 eUSCI (I2C Mode) Switching Characteristics
      8. 5.12.8  ADC
        1. Table 5-20 ADC, Power Supply and Input Range Conditions
        2. Table 5-21 ADC, 10-Bit Timing Parameters
        3. Table 5-22 ADC, 10-Bit Linearity Parameters
      9. 5.12.9  Enhanced Comparator (eCOMP)
        1. Table 5-23 eCOMP0
      10. 5.12.10 Smart Analog Combo (SAC)
        1. Table 5-24 SAC0 (SAC-L1, OA)
      11. 5.12.11 Transimpedance Amplifier (TIA)
        1. Table 5-25 TIA0
      12. 5.12.12 FRAM
        1. Table 5-26 FRAM
      13. 5.12.13 Emulation and Debug
        1. Table 5-27 JTAG, Spy-Bi-Wire Interface
        2. Table 5-28 JTAG, 4-Wire Interface
  6. 6Detailed Description
    1. 6.1  Overview
    2. 6.2  CPU
    3. 6.3  Operating Modes
    4. 6.4  Interrupt Vector Addresses
    5. 6.5  Memory Organization
    6. 6.6  Bootloader (BSL)
    7. 6.7  JTAG Standard Interface
    8. 6.8  Spy-Bi-Wire Interface (SBW)
    9. 6.9  FRAM
    10. 6.10 Memory Protection
    11. 6.11 Peripherals
      1. 6.11.1  Power-Management Module (PMM) and On-chip Reference Voltages
      2. 6.11.2  Clock System (CS) and Clock Distribution
      3. 6.11.3  General-Purpose Input/Output Port (I/O)
      4. 6.11.4  Watchdog Timer (WDT)
      5. 6.11.5  System Module (SYS)
      6. 6.11.6  Cyclic Redundancy Check (CRC)
      7. 6.11.7  Enhanced Universal Serial Communication Interface (eUSCI_A0, eUSCI_B0)
      8. 6.11.8  Timers (Timer0_B3, Timer1_B3)
      9. 6.11.9  Backup Memory (BAKMEM)
      10. 6.11.10 Real-Time Clock (RTC) Counter
      11. 6.11.11 10-Bit Analog-to-Digital Converter (ADC)
      12. 6.11.12 eCOMP0
      13. 6.11.13 SAC0
      14. 6.11.14 TIA0
      15. 6.11.15 eCOMP0, SAC0, TIA0, and ADC in SOC Interconnection
      16. 6.11.16 Embedded Emulation Module (EEM)
      17. 6.11.17 Peripheral File Map
    12. 6.12 Input/Output Diagrams
      1. 6.12.1 Port P1 Input/Output With Schmitt Trigger
      2. 6.12.2 Port P2 Input/Output With Schmitt Trigger
    13. 6.13 Device Descriptors (TLV)
    14. 6.14 Identification
      1. 6.14.1 Revision Identification
      2. 6.14.2 Device Identification
      3. 6.14.3 JTAG Identification
  7. 7Applications, Implementation, and Layout
    1. 7.1 Device Connection and Layout Fundamentals
      1. 7.1.1 Power Supply Decoupling and Bulk Capacitors
      2. 7.1.2 External Oscillator
      3. 7.1.3 JTAG
      4. 7.1.4 Reset
      5. 7.1.5 Unused Pins
      6. 7.1.6 General Layout Recommendations
      7. 7.1.7 Do's and Don'ts
    2. 7.2 Peripheral- and Interface-Specific Design Information
      1. 7.2.1 ADC Peripheral
        1. 7.2.1.1 Partial Schematic
        2. 7.2.1.2 Design Requirements
        3. 7.2.1.3 Layout Guidelines
    3. 7.3 Typical Applications
  8. 8Device and Documentation Support
    1. 8.1 Getting Started
    2. 8.2 Device Nomenclature
    3. 8.3 Tools and Software
    4. 8.4 Documentation Support
    5. 8.5 Related Links
    6. 8.6 Community Resources
    7. 8.7 Trademarks
    8. 8.8 Electrostatic Discharge Caution
    9. 8.9 Glossary
  9. 9Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.13 Device Descriptors (TLV)

Table 6-45 lists the Device IDs of the MSP430FR231x MCU variants. Table 6-46 lists the contents of the device descriptor tag-length-value (TLV) structure for the devices.

Table 6-45 Device IDs

DEVICE DEVICE ID
1A04h 1A05h
MSP430FR2311 F0 82
MSP430FR2310 F1 82

Table 6-46 Device Descriptors

DESCRIPTION MSP430FR231x
ADDRESS VALUE
Info block Info length 1A00h 06h
CRC length 1A01h 06h
CRC value(1) 1A02h Per unit
1A03h Per unit
Device ID 1A04h See Table 6-45.
1A05h
Hardware revision 1A06h Per unit
Firmware revision 1A07h Per unit
Die record Die record tag 1A08h 08h
Die record length 1A09h 0Ah
Lot wafer ID 1A0Ah Per unit
1A0Bh Per unit
1A0Ch Per unit
1A0Dh Per unit
Die X position 1A0Eh Per unit
1A0Fh Per unit
Die Y position 1A10h Per unit
1A11h Per unit
Test result 1A12h Per unit
1A13h Per unit
ADC calibration ADC calibration tag 1A14h Per unit
ADC calibration length 1A15h Per unit
ADC gain factor 1A16h Per unit
1A17h Per unit
ADC offset 1A18h Per unit
1A19h Per unit
ADC 1.5-V reference, temperature 30°C(3) 1A1Ah Per unit
1A1Bh Per unit
ADC 1.5-V reference, temperature 85°C(3) 1A1Ch Per unit
1A1Dh Per unit
Reference and DCO calibration Calibration tag 1A1Eh 12h
Calibration length 1A1Fh 04h
1.5-V reference factor 1A20h Per unit
1A21h Per unit
DCO tap settings for 16 MHz, temperature 30°C (2) 1A22h Per unit
1A23h Per unit
(1) The CRC value covers the checksum from 0x1A04h to 0x1A77h by applying CRC-CCITT-16 polynomial of X16 + X12 + X5 + 1
(2) This value can be directly loaded into the DCO bits in the CSCTL0 register to get an accurate 16-MHz frequency at room temperature, especially when MCU exits from LPM3 and below. TI also suggests using a predivider to decrease the frequency if the temperature drift might result an overshoot above 16 MHz.
(3) TI recommends to do a two-point calibration for the on-chip temperature sensor in precision application.