SLAS942E November   2015  – December 2019 MSP430FR2532 , MSP430FR2533 , MSP430FR2632 , MSP430FR2633

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagrams
    2. 4.2 Pin Attributes
    3. 4.3 Signal Descriptions
    4. 4.4 Pin Multiplexing
    5. 4.5 Buffer Types
    6. 4.6 Connection of Unused Pins
  5. 5Specifications
    1. 5.1       Absolute Maximum Ratings
    2. 5.2       ESD Ratings
    3. 5.3       Recommended Operating Conditions
    4. 5.4       Active Mode Supply Current Into VCC Excluding External Current
    5. 5.5       Active Mode Supply Current Per MHz
    6. 5.6       Low-Power Mode LPM0 Supply Currents Into VCC Excluding External Current
    7. 5.7       Low-Power Mode (LPM3 and LPM4) Supply Currents (Into VCC) Excluding External Current
    8. 5.8       Low-Power Mode LPMx.5 Supply Currents (Into VCC) Excluding External Current
    9. 5.9       Typical Characteristics - Low-Power Mode Supply Currents
    10. Table 5-1 Typical Characteristics – Current Consumption Per Module
    11. 5.10      Thermal Resistance Characteristics
    12. 5.11      Timing and Switching Characteristics
      1. 5.11.1  Power Supply Sequencing
        1. Table 5-2 PMM, SVS and BOR
      2. 5.11.2  Reset Timing
        1. Table 5-3 Wake-up Times From Low-Power Modes and Reset
      3. 5.11.3  Clock Specifications
        1. Table 5-4 XT1 Crystal Oscillator (Low Frequency)
        2. Table 5-5 DCO FLL, Frequency
        3. Table 5-6 DCO Frequency
        4. Table 5-7 REFO
        5. Table 5-8 Internal Very-Low-Power Low-Frequency Oscillator (VLO)
        6. Table 5-9 Module Oscillator (MODOSC)
      4. 5.11.4  Digital I/Os
        1. Table 5-10 Digital Inputs
        2. Table 5-11 Digital Outputs
        3. 5.11.4.1   Typical Characteristics – Outputs at 3 V and 2 V
      5. 5.11.5  VREF+ Built-in Reference
        1. Table 5-12 VREF+
      6. 5.11.6  Timer_A
        1. Table 5-13 Timer_A
      7. 5.11.7  eUSCI
        1. Table 5-14 eUSCI (UART Mode) Clock Frequency
        2. Table 5-15 eUSCI (UART Mode)
        3. Table 5-16 eUSCI (SPI Master Mode) Clock Frequency
        4. Table 5-17 eUSCI (SPI Master Mode)
        5. Table 5-18 eUSCI (SPI Slave Mode)
        6. Table 5-19 eUSCI (I2C Mode)
      8. 5.11.8  ADC
        1. Table 5-20 ADC, Power Supply and Input Range Conditions
        2. Table 5-21 ADC, 10-Bit Timing Parameters
        3. Table 5-22 ADC, 10-Bit Linearity Parameters
      9. 5.11.9  CapTIvate
        1. Table 5-23 CapTIvate Electrical Characteristics
        2. Table 5-24 CapTIvate Signal-to-Noise Ratio Characteristics
      10. 5.11.10 FRAM
        1. Table 5-25 FRAM
      11. 5.11.11 Debug and Emulation
        1. Table 5-26 JTAG, Spy-Bi-Wire Interface
        2. Table 5-27 JTAG, 4-Wire Interface
  6. 6Detailed Description
    1. 6.1  Overview
    2. 6.2  CPU
    3. 6.3  Operating Modes
    4. 6.4  Interrupt Vector Addresses
    5. 6.5  Bootloader (BSL)
    6. 6.6  JTAG Standard Interface
    7. 6.7  Spy-Bi-Wire Interface (SBW)
    8. 6.8  FRAM
    9. 6.9  Memory Protection
    10. 6.10 Peripherals
      1. 6.10.1  Power-Management Module (PMM)
      2. 6.10.2  Clock System (CS) and Clock Distribution
      3. 6.10.3  General-Purpose Input/Output Port (I/O)
      4. 6.10.4  Watchdog Timer (WDT)
      5. 6.10.5  System (SYS) Module
      6. 6.10.6  Cyclic Redundancy Check (CRC)
      7. 6.10.7  Enhanced Universal Serial Communication Interface (eUSCI_A0, eUSCI_B0)
      8. 6.10.8  Timers (Timer0_A3, Timer1_A3, Timer2_A2 and Timer3_A2)
      9. 6.10.9  Hardware Multiplier (MPY)
      10. 6.10.10 Backup Memory (BAKMEM)
      11. 6.10.11 Real-Time Clock (RTC)
      12. 6.10.12 10-Bit Analog-to-Digital Converter (ADC)
      13. 6.10.13 CapTIvate Technology
      14. 6.10.14 Embedded Emulation Module (EEM)
    11. 6.11 Input/Output Diagrams
      1. 6.11.1 Port P1 Input/Output With Schmitt Trigger
      2. 6.11.2 Port P2 (P2.0 to P2.2) Input/Output With Schmitt Trigger
      3. 6.11.3 Port P2 (P2.3 to P2.7) Input/Output With Schmitt Trigger
      4. 6.11.4 Port P3 (P3.0 to P3.2) Input/Output With Schmitt Trigger
    12. 6.12 Device Descriptors
    13. 6.13 Memory
      1. 6.13.1 Memory Organization
      2. 6.13.2 Peripheral File Map
    14. 6.14 Identification
      1. 6.14.1 Revision Identification
      2. 6.14.2 Device Identification
      3. 6.14.3 JTAG Identification
  7. 7Applications, Implementation, and Layout
    1. 7.1 Device Connection and Layout Fundamentals
      1. 7.1.1 Power Supply Decoupling and Bulk Capacitors
      2. 7.1.2 External Oscillator
      3. 7.1.3 JTAG
      4. 7.1.4 Reset
      5. 7.1.5 Unused Pins
      6. 7.1.6 General Layout Recommendations
      7. 7.1.7 Do's and Don'ts
    2. 7.2 Peripheral- and Interface-Specific Design Information
      1. 7.2.1 ADC Peripheral
        1. 7.2.1.1 Partial Schematic
        2. 7.2.1.2 Design Requirements
        3. 7.2.1.3 Layout Guidelines
      2. 7.2.2 CapTIvate Peripheral
        1. 7.2.2.1 Device Connection and Layout Fundamentals
        2. 7.2.2.2 Measurements
          1. 7.2.2.2.1 SNR
          2. 7.2.2.2.2 Sensitivity
          3. 7.2.2.2.3 Power
    3. 7.3 CapTIvate Technology Evaluation
  8. 8Device and Documentation Support
    1. 8.1  Getting Started and Next Steps
    2. 8.2  Device Nomenclature
    3. 8.3  Tools and Software
    4. 8.4  Documentation Support
    5. 8.5  Related Links
    6. 8.6  Community Resources
    7. 8.7  Trademarks
    8. 8.8  Electrostatic Discharge Caution
    9. 8.9  Export Control Notice
    10. 8.10 Glossary
  9. 9Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

2 Revision History

Changes from revision D to revision E

Changes from August 20, 2019 to December 9, 2019

  • Changed the note that begins "Supply voltage changes faster than 0.2 V/µs can trigger a BOR reset..." in Section 5.3, Recommended Operating ConditionsGo
  • Added the note that begins "TI recommends that power to the DVCC pin must not exceed the limits..." in Section 5.3, Recommended Operating ConditionsGo
  • Changed the note that begins "A capacitor tolerance of ±20% or better is required..." in Section 5.3, Recommended Operating ConditionsGo
  • Changed the note that begins "Requires external capacitors at both terminals..." in Table 5-4, XT1 Crystal Oscillator (Low Frequency)Go
  • Added the t(int) parameter in Table 5-10, Digital InputsGo
  • Corrected the test conditions for the RI,MUX parameter in Table 5-20, ADC, Power Supply and Input Range ConditionsGo
  • Added the note that begins "tSample = ln(2n+1) × τ ..." in Table 5-21, ADC, 10-Bit Timing ParametersGo
  • Changed the CRC covered end address to 0x1AF5 in note (1) in Table 6-22, Device DescriptorsGo

Changes from August 29, 2018 to August 19, 2019

  • Updated Section 1.1, FeaturesGo
  • Added "Target development board" information in Section 1.1, FeaturesGo
  • Changed "fCONVER = 2 MHz" to "fCONVER = 4 MHz" in the note that begins "CapTIvate technology works in LPM3 with 64 mutual-capacitance buttons" on Section 5.7, Low-Power Mode (LPM3 and LPM4) Supply Currents (Into VCC) Excluding External CurrentGo
  • Changed the parameter symbol from RI to RI,MUX in Table 5-20 , ADC, Power Supply and Input Range ConditionsGo
  • Added RI,Misc TYP value of 34 kΩ in Table 5-20 , ADC, Power Supply and Input Range ConditionsGo
  • Added formula for RI calculation in Table 5-21 , ADC, 10-Bit Timing ParametersGo
  • Removed the description of "±3°C" in table note that starts "The device descriptor structure ..." of Table 5-22, ADC, 10-Bit Linearity ParametersGo
  • Added test condition for CELECTRODE in Table 5-23 , CapTIvate Electrical CharacteristicsGo
  • Changed the symbol and description of the DCCAPCLK parameter in Table 5-23, CapTIvate Electrical CharacteristicsGo
  • Moved the SNR parameter to Table 5-24, CapTIvate Signal-to-Noise Ratio CharacteristicsGo
  • Corrected bitfield from IRDSEL to IRDSSEL in Section 6.10.8, Timers (Timer0_A3, Timer1_A3, Timer2_A2 and Timer3_A2), in the description that starts "The interconnection of Timer0_A3 and ..."Go
  • Corrected the ADCINCHx column heading in Table 6-15, ADC Channel ConnectionsGo
  • Corrected the ADCSHSx column heading in Table 6-16, ADC Trigger Signal ConnectionsGo
  • Added P1SELC information in Table 6-32, Port P1, P2 Registers (Base Address: 0200h)Go
  • Added P2SELC information in Table 6-32, Port P1, P2 Registers (Base Address: 0200h)Go
  • Added P3SELC information in Table 6-33, Port P3 Registers (Base Address: 0220h)Go
  • Updated Section 7.2.2, CapTIvate PeripheralGo

Changes from June 9, 2017 to August 28, 2018

  • Removed "30-cm" from the "Proximity Sensing" item in Section 1.1, FeaturesGo
  • Updated Section 3.1, Related ProductsGo
  • Corrected package type in VQFN row (changed from QFN to VQFN) in Table 4-2, Signal DescriptionsGo
  • Changed HBM limit to ±1000 V and CDM limit to ±250 V in Section 5.2, ESD RatingsGo
  • Added note to VSVSH- and VSVSH+ parameters in Table 5-2, PMM, SVS and BORGo
  • Added the SNR parameter in Table 5-23, CapTIvate Electrical CharacteristicsGo
  • Moved "FRAM access time error" to "System Reset" row and added ACCTEIFG to interrupt flag column in Table 6-2, Interrupt Sources, Flags, and VectorsGo
  • Corrected the offset for P2SEL1 in Table 6-32, Port P1, P2 Registers (Base Address: 0200h)Go
  • Updated text and figure in Section 8.2, Device NomenclatureGo

Changes from December 10, 2015 to June 8, 2017

  • Changed the organization of the Features listGo
  • Added DSBGA (YQW) package to "Package Options" list in Section 1.1, FeaturesGo
  • Updated list in Section 1.2, ApplicationsGo
  • Updated Section 1.3, DescriptionGo
  • Added DSBGA (YQW) package option to Device Information table in Section 1.3, DescriptionGo
  • Added MSP430FR2633IYQW and MSP430FR2632IYQW to Table 3-1, Device ComparisonGo
  • Added Section 3.1, Related ProductsGo
  • Added DSBGA (YQW) pinoutGo
  • Added DSBGA (YQW) package to Table 4-1, Pin AttributesGo
  • Added DSBGA (YQW) package to Table 4-2, Signal DescriptionsGo
  • Added row for VQFN thermal pad in Table 4-2, Signal DescriptionsGo
  • Removed FRAM reflow noteGo
  • Updated the notes on ILPM3, CapTIvate, 16 buttons and ILPM3, CapTIvate, 64 buttons in Section 5.7, Low-Power Mode (LPM3 and LPM4) Supply Currents (Into VCC) Excluding External CurrentGo
  • Added DSBGA (YQW) package and changed notes for Section 5.10, Thermal Resistance CharacteristicsGo
  • Removed ADCDIV from the formula for the TYP value in the second row of the tCONVERT parameter in Table 5-21, ADC, 10-Bit Timing Parameters (removed because ADCCLK is after division)Go
  • Add description of blank device detectionGo
  • Changed the paragraph that starts "Quickly switching digital signals and ..." in Section 7.2.1.2, Design RequirementsGo
  • Updated Figure 8-1, Device NomenclatureGo
  • Replaced former section Development Tools Support with Section 8.3, Tools and SoftwareGo
  • Updated format and content of Section 8.4, Documentation SupportGo

Changes from November 6, 2015 to December 9, 2015

  • Changed document status from PRODUCT PREVIEW to PRODUCTION DATAGo
  • Changed list item that starts "Enables Reliable Touch Solutions..."Go
  • Added note to list item that starts "Wide Supply Voltage Range..." Go
  • In the note that starts "Low-power mode 3, VLO, excludes SVS test conditions...", changed "fXT1 = 0 Hz" to "fXT1 = 32768 Hz"Go
  • Added note that starts "The VLO clock frequency is reduced by 15%..."Go
  • Added note to "Clock" in Table 6-1, Operating ModesGo
  • Added note that starts "XT1CLK and VLOCLK can be active during LPM4..."Go
  • Corrected description in Section 6.10.10, Backup Memory (BKMEM)Go