SLASEO5 Data sheet

SLASEO5D March 2019 – September 2021 MSP430FR2672 , MSP430FR2673 , MSP430FR2675 , MSP430FR2676

PRODUCTION DATA

Package Options

Mechanical Data (Package|Pins)

PT|48
- MTQF003C
RHB|32
- MPQF130D
RHA|40
- MPQF135D

Thermal pad, mechanical data (Package|Pins)

RHB|32
- QFND029X
RHA|40
- QFND027R

Orderable Information

9.12 Device Descriptors

Table 9-29 lists the Device IDs. Table 9-30 lists the contents of the device descriptor tag-length-value (TLV) structure.

Table 9-29 Device IDs

DEVICE	DEVICE ID
DEVICE	1A05h	1A04h
MSP430FR2676	83h	28h
MSP430FR2675	83h	29h
MSP430FR2673	83h	38h
MSP430FR2672	83h	39h

Table 9-30 Device Descriptors

DESCRIPTION		ADDRESS	VALUE
Information block	Info length	1A00h	06h
	CRC length	1A01h	06h
	CRC value⁽¹⁾	1A02h	Per unit
	CRC value⁽¹⁾	1A03h	Per unit
	Device ID	1A04h	See Table 9-29
	Device ID	1A05h	See Table 9-29
	Hardware revision	1A06h	Per unit
	Firmware revision	1A07h	Per unit
Die record	Die record tag	1A08h	08h
	Die record length	1A09h	0Ah
	Lot wafer ID	1A0Ah	Per unit
		1A0Bh	Per unit
		1A0Ch	Per unit
		1A0Dh	Per unit
	Die X position	1A0Eh	Per unit
	Die X position	1A0Fh	Per unit
	Die Y position	1A10h	Per unit
	Die Y position	1A11h	Per unit
	Test result	1A12h	Per unit
	Test result	1A13h	Per unit
ADC calibration	ADC calibration tag	1A14h	11h
	ADC calibration length	1A15h	10h
	ADC gain factor⁽³⁾	1A16h	Per unit
	ADC gain factor⁽³⁾	1A17h	Per unit
	ADC offset⁽⁴⁾	1A18h	Per unit
	ADC offset⁽⁴⁾	1A19h	Per unit
	ADC internal shared 1.5-V reference, temperature sensor 30°C	1A1Ah	Per unit
		1A1Bh	Per unit
	ADC internal shared 1.5-V reference, temperature sensor 105°C	1A1Ch	Per unit
		1A1Dh	Per unit
	ADC internal shared 2.0-V reference, temperature sensor 30°C	1A1Eh	Per unit
		1A1Fh	Per unit
	ADC internal shared 2.0-V reference, temperature sensor 105°C	1A20h	Per unit
		1A21h	Per unit
	ADC internal shared 2.5-V reference, temperature sensor 30°C	1A22h	Per unit
		1A23h	Per unit
	ADC internal shared 2.5-V reference, temperature sensor 105°C	1A24h	Per unit
		1A25h	Per unit
Reference and DCO calibration	Internal shared reference Calibration tag	1A26h	12h
	Internal shared reference Calibration length	1A27h	0Ah
	Internal shared 1.5-V reference factor	1A28h	Per unit
	Internal shared 1.5-V reference factor	1A29h	Per unit
	Internal shared 2.0-V reference factor	1A2Ah	Per unit
	Internal shared 2.0-V reference factor	1A2Bh	Per unit
	Internal shared 2.5-V reference factor	1A2Ch	Per unit
	Internal shared 2.5-V reference factor	1A2Dh	Per unit
	DCO tap settings for 16 MHz, temperature 30°C	1A2Eh	Per unit
	DCO tap settings for 16 MHz, temperature 30°C	1A2Fh	Per unit
	DCO tap settings for 24 MHz, temperature 30°C ⁽²⁾	1A30h	Per unit
	DCO tap settings for 24 MHz, temperature 30°C ⁽²⁾	1A31h	Per unit

(1) CRC value covers the checksum from 0x1A04h to 0x1AF7h by applying CRC-CCITT-16 polynomial of x¹⁶ + x¹² + x⁵ + 1.

(2) This value can be directly loaded into the DCO bits in the CSCTL0 register to get an accurate 24-MHz frequency at room temperature, especially when MCU exits from LPM3 and below. TI also suggests to use a predivider to decrease the frequency if the temperature drift might result an overshoot faster than 24 MHz.

(3) ADC gain: the gain correction factor is measured at 2.4 V and room temperature using ADCSREFx = 0x7, an external reference without internal buffer. V_R+= V_eref+, V_R-= V_eref-. Other settings can result in different factors.

(4) ADC offset: the offset correction factor is measured at 2.4 V and room temperature using ADCSREFx = 0x7, an external reference without internal buffer. V_R+= V_eref+, V_R-= V_eref-. Other settings can result in different factors