SLASEO5D March   2019  – September 2021 MSP430FR2672 , MSP430FR2673 , MSP430FR2675 , MSP430FR2676

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Functional Block Diagram
  5. 5 Revision History
  6. 6 Device Comparison
    1. 6.1 Related Products
  7. 7 Terminal Configuration and Functions
    1. 7.1 Pin Diagrams
    2. 7.2 Pin Attributes
    3. 7.3 Signal Descriptions
    4. 7.4 Pin Multiplexing
    5. 7.5 Buffer Types
    6. 7.6 Connection of Unused Pins
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Active Mode Supply Current Into VCC Excluding External Current
    5. 8.5  Active Mode Supply Current Per MHz
    6. 8.6  Low-Power Mode LPM0 Supply Currents Into VCC Excluding External Current
    7. 8.7  Low-Power Mode (LPM3, LPM4) Supply Currents (Into VCC) Excluding External Current
    8. 8.8  Low-Power Mode LPMx.5 Supply Currents (Into VCC) Excluding External Current
    9. 8.9  Typical Characteristics – Low-Power Mode Supply Currents
    10. 8.10 Current Consumption Per Module
    11. 8.11 Thermal Resistance Characteristics
    12. 8.12 Timing and Switching Characteristics
      1. 8.12.1  Power Supply Sequencing
        1. 8.12.1.1 PMM, SVS and BOR
      2. 8.12.2  Reset Timing
        1. 8.12.2.1 Wake-up Times From Low-Power Modes and Reset
      3. 8.12.3  Clock Specifications
        1. 8.12.3.1 XT1 Crystal Oscillator (Low Frequency)
        2. 8.12.3.2 DCO FLL, Frequency
        3. 8.12.3.3 DCO Frequency
        4. 8.12.3.4 REFO
        5. 8.12.3.5 Internal Very-Low-Power Low-Frequency Oscillator (VLO)
        6. 8.12.3.6 Module Oscillator (MODOSC)
      4. 8.12.4  Digital I/Os
        1. 8.12.4.1 Digital Inputs
        2. 8.12.4.2 Digital Outputs
        3. 8.12.4.3 Typical Characteristics – Outputs at 3 V and 2 V
      5. 8.12.5  Internal Shared Reference
        1. 8.12.5.1 Internal Reference Characteristics
      6. 8.12.6  Timer_A and Timer_B
        1. 8.12.6.1 Timer_A
        2. 8.12.6.2 Timer_B
      7. 8.12.7  eUSCI
        1. 8.12.7.1 eUSCI (UART Mode) Clock Frequency
        2. 8.12.7.2 eUSCI (UART Mode) Timing Characteristics
        3. 8.12.7.3 eUSCI (SPI Master Mode) Clock Frequency
        4. 8.12.7.4 eUSCI (SPI Master Mode)
        5. 8.12.7.5 eUSCI (SPI Slave Mode)
        6. 8.12.7.6 eUSCI (I2C Mode)
      8. 8.12.8  ADC
        1. 8.12.8.1 ADC, Power Supply and Input Range Conditions
        2. 8.12.8.2 ADC, Timing Parameters
        3. 8.12.8.3 ADC, Linearity Parameters
      9. 8.12.9  Enhanced Comparator (eCOMP)
        1. 8.12.9.1 eCOMP0 Characteristics
      10. 8.12.10 CapTIvate
        1. 8.12.10.1 CapTIvate Electrical Characteristics
        2. 8.12.10.2 CapTIvate Signal-to-Noise Ratio Characteristics
      11. 8.12.11 FRAM
        1. 8.12.11.1 FRAM Characteristics
      12. 8.12.12 Debug and Emulation
        1. 8.12.12.1 JTAG, 4-Wire and Spy-Bi-Wire Interface
  9. 9 Detailed Description
    1. 9.1  Overview
    2. 9.2  CPU
    3. 9.3  Operating Modes
    4. 9.4  Interrupt Vector Addresses
    5. 9.5  Bootloader (BSL)
    6. 9.6  JTAG Standard Interface
    7. 9.7  Spy-Bi-Wire Interface (SBW)
    8. 9.8  FRAM
    9. 9.9  Memory Protection
    10. 9.10 Peripherals
      1. 9.10.1  Power-Management Module (PMM)
      2. 9.10.2  Clock System (CS) and Clock Distribution
      3. 9.10.3  General-Purpose Input/Output Port (I/O)
      4. 9.10.4  Watchdog Timer (WDT)
      5. 9.10.5  System (SYS) Module
      6. 9.10.6  Cyclic Redundancy Check (CRC)
      7. 9.10.7  Enhanced Universal Serial Communication Interface (eUSCI_A0, eUSCI_B0)
      8. 9.10.8  Timers (TA0, TA1, TA2, TA3 and TB0)
      9. 9.10.9  Hardware Multiplier (MPY)
      10. 9.10.10 Backup Memory (BAKMEM)
      11. 9.10.11 Real-Time Clock (RTC)
      12. 9.10.12 12-Bit Analog-to-Digital Converter (ADC)
      13. 9.10.13 eCOMP0
      14. 9.10.14 CapTIvate Technology
      15. 9.10.15 Embedded Emulation Module (EEM)
    11. 9.11 Input/Output Diagrams
      1. 9.11.1 Port P1 (P1.0 to P1.7) Input/Output With Schmitt Trigger
      2. 9.11.2 Port P2 (P2.0 to P2.7) Input/Output With Schmitt Trigger
      3. 9.11.3 Port P3 (P3.0 to P3.7) Input/Output With Schmitt Trigger
      4. 9.11.4 Port P4 (P4.0 to P4.7) Input/Output With Schmitt Trigger
      5. 9.11.5 Port P5 (P5.0 to P5.7) Input/Output With Schmitt Trigger
      6. 9.11.6 Port P6 (P6.0 to P6.2) Input/Output With Schmitt Trigger
    12. 9.12 Device Descriptors
    13. 9.13 Memory
      1. 9.13.1 Memory Organization
      2. 9.13.2 Peripheral File Map
    14. 9.14 Identification
      1. 9.14.1 Revision Identification
      2. 9.14.2 Device Identification
      3. 9.14.3 JTAG Identification
  10. 10Applications, Implementation, and Layout
    1. 10.1 Device Connection and Layout Fundamentals
      1. 10.1.1 Power Supply Decoupling and Bulk Capacitors
      2. 10.1.2 External Oscillator
      3. 10.1.3 JTAG
      4. 10.1.4 Reset
      5. 10.1.5 Unused Pins
      6. 10.1.6 General Layout Recommendations
      7. 10.1.7 Do's and Don'ts
    2. 10.2 Peripheral- and Interface-Specific Design Information
      1. 10.2.1 ADC Peripheral
        1. 10.2.1.1 Partial Schematic
        2. 10.2.1.2 Design Requirements
        3. 10.2.1.3 Layout Guidelines
      2. 10.2.2 CapTIvate Peripheral
        1. 10.2.2.1 Device Connection and Layout Fundamentals
        2. 10.2.2.2 125
        3. 10.2.2.3 Measurements
          1. 10.2.2.3.1 SNR
          2. 10.2.2.3.2 Sensitivity
          3. 10.2.2.3.3 Power
    3. 10.3 CapTIvate Technology Evaluation
  11. 11Device and Documentation Support
    1. 11.1 Getting Started and Next Steps
    2. 11.2 Device Nomenclature
    3. 11.3 Tools and Software
    4. 11.4 Documentation Support
    5. 11.5 Support Resources
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Export Control Notice
    9. 11.9 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Revision History

Changes from revision C to revision D

Changes from February 20, 2020 to September 14, 2021

  • Updated the numbering format for tables, figures, and cross references throughout the documentGo
  • Added links to online collateral in Section 3 Description Go
  • Corrected the pin numbers for the Veref+ and Veref- signals in Table 7-2, Signal Descriptions Go
  • Corrected the TAxRMP, USCIA0RMP, USCIB0RMP, and USCIB1RMP bit names in the notes for Table 7-2, Signal Descriptions Go
  • Corrected the USCIA0RMP and USCIBxRMP bit names in Section 9.10.7, Enhanced Universal Serial Communication Interface (eUSCI_A0, eUSCI_B0) Go
  • Corrected the TAxRMP bit name in the notes for Table 9-16, TA2 and TA3 Pin Configurations of Remap Functionality Go
  • Added an inverter to the Schmitt-trigger enable in Figure 9-4, Port Input/Output With Schmitt Trigger Go
  • Corrected the value of the P5SEL.x column for P5.3 and P5.4 in Table 9-27, Port P5 (P5.0 to P5.7) Pin Functions Go
  • Added the SYSCFG3 register to Table 9-35, SYS Registers (Base Address: 0140h) Go

Changes from revision B to revision C

Changes from December 11, 2019 to February 19, 2020

  • Added MSP430FR2673 and MSP430FR2672 to Section 1, Features Go
  • Added MSP430FR2673 and MSP430FR2672 to this data sheetGo
  • Added MSP430FR2673 and MSP430FR2672 to Device Information in Section 3 Description Go
  • Added MSP430FR2673TRHB and MSP430FR2672TRHB to Table 6-1, Device Comparison Go
  • Added MSP430FR2673TRHB and MSP430FR2672TRHB to Figure 7-3, 32-Pin RHB Package (Top View) Go
  • Added MSP430FR2673 and MSP430FR2672 to Table 9-29, Device IDs Go
  • Added MSP430FR2673 and MSP430FR2672 to Table 9-31, Memory Organization Go
  • Added MSP430FR2673 and MSP430FR2672 in Figure 11-1, Device Nomenclature Go

Changes from revision A to revision B

Changes from April 26, 2019 to December 10, 2019

  • Updated Section 1, Features Go
  • Changed the note that begins "Supply voltage changes faster than 0.2 V/µs can trigger a BOR reset..." in Section 8.3, Recommended Operating Conditions Go
  • Added the note that begins "TI recommends that power to the DVCC pin must not exceed the limits..." in Section 8.3, Recommended Operating Conditions Go
  • Changed the note that begins "A capacitor tolerance of ±20% or better is required..." in Section 8.3, Recommended Operating Conditions Go
  • Added the note "See MSP430 32-kHz Crystal Oscillators for details on crystal section, layout, and testing" to Section 8.12.3.1, XT1 Crystal Oscillator (Low Frequency) Go
  • Changed the note that begins "Requires external capacitors at both terminals..." in Section 8.12.3.1, XT1 Crystal Oscillator (Low Frequency) Go
  • Added the tTA,cap parameter in Section 8.12.6.1, Timer_A Go
  • Added the tTB,cap parameter in Section 8.12.6.2, Timer_B Go
  • Corrected the test conditions for the RI parameter in Section 8.12.8.1, ADC, Power Supply and Input Range Conditions Go
  • Removed ADCDIV from the equations for tCONVERT because ADCCLK is after division in Section 8.12.8.2, ADC, Timing Parameters Go
  • Added the note that begins "tSample = ln(2n+1) × τ ..." in Section 8.12.8.2, ADC, Timing Parameters Go
  • Changed the symbol and description of the DCCAPCLK parameter in Section 8.12.10.1, CapTIvate Electrical Characteristics Go
  • Changed CRC covered end address to 0x1AF7 in table note (1) in Table 9-30 , Device Descriptors Go

Changes from initial release to revision A

Changes from March 12, 2019 to April 25, 2019

  • Changed document status to Production DataGo
  • Added memory sizes for MSP430FR2673 and MSP430FR2672 in Figure 4-1, Functional Block Diagram Go
  • Updated Section 8.7 Low-Power Mode (LPM3, LPM4) Supply Currents (Into VCC) Excluding External Current with production values Go
  • Updated Section 8.12.3.2 DCO FLL, Frequency with production valuesGo