SLAS865 Data sheet

SLAS865F October 2014 – December 2021 MSP430FR4131 , MSP430FR4132 , MSP430FR4133

PRODUCTION DATA

Package Options

Mechanical Data (Package|Pins)

PM|64
- MTQF008B
DGG|48
- MPDS583
DGG|56
- MPDS570

Thermal pad, mechanical data (Package|Pins)

Orderable Information

8.11 Thermal Characteristics

PARAMETER			VALUE	UNIT
θ_JA	Junction-to-ambient thermal resistance, still air⁽¹⁾	LQFP-64 (PM)	61.7	°C/W
θ_{JC, (TOP)}	Junction-to-case (top) thermal resistance⁽²⁾		25.4	°C/W
θ_JB	Junction-to-board thermal resistance⁽³⁾		32.7	°C/W
Ψ_JB	Junction-to-board thermal characterization parameter		32.4	°C/W
Ψ_JT	Junction-to-top thermal characterization parameter		2.5	°C/W
θ_JA	Junction-to-ambient thermal resistance, still air(⁽¹⁾	TSSOP-56 (DGG56)	62.4	°C/W
θ_{JC, (TOP)}	Junction-to-case (top) thermal resistance⁽²⁾		18.7	°C/W
θ_JB	Junction-to-board thermal resistance⁽³⁾		31.4	°C/W
Ψ_JB	Junction-to-board thermal characterization parameter		31.1	°C/W
Ψ_JT	Junction-to-top thermal characterization parameter		0.8	°C/W
θ_JA	Junction-to-ambient thermal resistance, still air(⁽¹⁾	TSSOP-48 (DGG48)	68.9	°C/W
θ_{JC, (TOP)}	Junction-to-case (top) thermal resistance⁽²⁾		23	°C/W
θ_JB	Junction-to-board thermal resistance⁽³⁾		35.8	°C/W
Ψ_JB	Junction-to-board thermal characterization parameter		35.3	°C/W
Ψ_JT	Junction-to-top thermal characterization parameter		1.1	°C/W

(1) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, High-K board, as specified in JESD51-7, in an environment described in JESD51-2a.

(2) The junction-to-case (top) thermal resistance is obtained by simulating a cold place test on the package top. No specific JEDEC-standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.

(3) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold place fixture to control the PCB temperature, as described in JESD51-8.