ZHCSJA6 数据表 | 德州仪器 TI.com.cn

SLASEF5B January 2019 – December 2021 MSP430FR5041 , MSP430FR5043 , MSP430FR50431 , MSP430FR6041 , MSP430FR6043 , MSP430FR60431

PRODUCTION DATA

Package Options

Mechanical Data (Package|Pins)

PM|64
- MTQF008B
RGC|64
- MPQF125F

Thermal pad, mechanical data (Package|Pins)

Orderable Information

8.12 Thermal Resistance Characteristics

THERMAL METRIC⁽¹⁾		PACKAGE	VALUE⁽²⁾	UNIT
Rθ_JA	Junction-to-ambient thermal resistance, still air	QFP-80 (PN)	53.3	°C/W
Rθ_JC(TOP)	Junction-to-case (top) thermal resistance		15.2	°C/W
Rθ_JB	Junction-to-board thermal resistance		28.4	°C/W
Ψ_JB	Junction-to-board thermal characterization parameter		28.0	°C/W
Ψ_JT	Junction-to-top thermal characterization parameter		0.7	°C/W
Rθ_JC(BOTTOM)	Junction-to-case (bottom) thermal resistance		N/A⁽³⁾	°C/W
Rθ_JA	Junction-to-ambient thermal resistance, still air	QFP-64 (PM)	56.6	°C/W
Rθ_JC(TOP)	Junction-to-case (top) thermal resistance		16.4	°C/W
Rθ_JB	Junction-to-board thermal resistance		27.8	°C/W
Ψ_JB	Junction-to-board thermal characterization parameter		27.5	°C/W
Ψ_JT	Junction-to-top thermal characterization parameter		0.8	°C/W
Rθ_JC(BOTTOM)	Junction-to-case (bottom) thermal resistance		N/A	°C/W
Rθ_JA	Junction-to-ambient thermal resistance, still air	RGC-64	24.7	°C/W
Rθ_JC(TOP)	Junction-to-case (top) thermal resistance		12.3	°C/W
Rθ_JB	Junction-to-board thermal resistance		8.8	°C/W
Ψ_JB	Junction-to-board thermal characterization parameter		8.7	°C/W
Ψ_JT	Junction-to-top thermal characterization parameter		0.1	°C/W
Rθ_JC(BOTTOM)	Junction-to-case (bottom) thermal resistance		N/A	°C/W

(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.

(2) These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC (Rθ_JC) value, which is based on a JEDEC-defined 1S0P system) and will change based on environment and application. For more information, see these EIA/JEDEC standards:

JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements

(3) N/A = Not applicable