SLVSCN6A November   2014  – December 2014 MSP430FR5739-EP

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Pin Configuration and Functions
    1. 3.1 Pin Diagram
    2. 3.2 Signal Descriptions
  4. 4Specifications
    1. 4.1  Absolute Maximum Ratings
    2. 4.2  Recommended Operating Conditions
    3. 4.3  Thermal Information
    4. 4.4  Active Mode Supply Current Into VCC Excluding External Current
    5. 4.5  Low-Power Mode Supply Currents (Into VCC) Excluding External Current
    6. 4.6  Schmitt-Trigger Inputs - General Purpose I/O (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.7, P4.0 to P4.1, PJ.0 to PJ.5, RST/NMI)
    7. 4.7  Inputs - Ports P1 and P2 (P1.0 to P1.7, P2.0 to P2.7)
    8. 4.8  Leakage Current - General Purpose I/O (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.7, P4.0 to P4.1, PJ.0 to PJ.5, RST/NMI)
    9. 4.9  Outputs - General Purpose I/O (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.7, P4.0 to P4.1, PJ.0 to PJ.5)
    10. 4.10 Output Frequency - General Purpose I/O (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.7, P4.0 to P4.1, PJ.0 to PJ.5)
    11. 4.11 Typical Characteristics - Outputs
    12. 4.12 Crystal Oscillator, XT1, Low-Frequency (LF) Mode
    13. 4.13 Crystal Oscillator, XT1, High-Frequency (HF) Mode
    14. 4.14 Internal Very-Low-Power Low-Frequency Oscillator (VLO)
    15. 4.15 DCO Frequencies
    16. 4.16 MODOSC
    17. 4.17 PMM, Core Voltage
    18. 4.18 PMM, SVS, BOR
    19. 4.19 Wake-Up from Low Power Modes
    20. 4.20 Timer_A
    21. 4.21 Timer_B
    22. 4.22 eUSCI (UART Mode) Recommended Operating Conditions
    23. 4.23 eUSCI (UART Mode)
    24. 4.24 eUSCI (SPI Master Mode) Recommended Operating Conditions
    25. 4.25 eUSCI (SPI Master Mode)
    26. 4.26 eUSCI (SPI Slave Mode)
    27. 4.27 eUSCI (I2C Mode)
    28. 4.28 10-Bit ADC, Power Supply and Input Range Conditions
    29. 4.29 10-Bit ADC, Timing Parameters
    30. 4.30 10-Bit ADC, Linearity Parameters
    31. 4.31 REF, External Reference
    32. 4.32 REF, Built-In Reference
    33. 4.33 REF, Temperature Sensor and Built-In VMID
    34. 4.34 Comparator_D
    35. 4.35 FRAM
    36. 4.36 JTAG and Spy-Bi-Wire Interface
  5. 5Detailed Description
    1. 5.1  Functional Block Diagram
    2. 5.2  CPU
    3. 5.3  Operating Modes
    4. 5.4  Interrupt Vector Addresses
    5. 5.5  Memory Organization
    6. 5.6  Bootstrap Loader (BSL)
    7. 5.7  JTAG Operation
      1. 5.7.1 JTAG Standard Interface
      2. 5.7.2 Spy-Bi-Wire Interface
    8. 5.8  FRAM
    9. 5.9  Memory Protection Unit (MPU)
    10. 5.10 Peripherals
      1. 5.10.1  Digital I/O
      2. 5.10.2  Oscillator and Clock System (CS)
      3. 5.10.3  Power Management Module (PMM)
      4. 5.10.4  Hardware Multiplier (MPY)
      5. 5.10.5  Real-Time Clock (RTC_B)
      6. 5.10.6  Watchdog Timer (WDT_A)
      7. 5.10.7  System Module (SYS)
      8. 5.10.8  DMA Controller
      9. 5.10.9  Enhanced Universal Serial Communication Interface (eUSCI)
      10. 5.10.10 TA0, TA1
      11. 5.10.11 TB0, TB1, TB2
      12. 5.10.12 ADC10_B
      13. 5.10.13 Comparator_D
      14. 5.10.14 CRC16
      15. 5.10.15 Shared Reference (REF)
      16. 5.10.16 Embedded Emulation Module (EEM)
      17. 5.10.17 Peripheral File Map
  6. 6Input/Output Schematics
    1. 6.1  Port P1, P1.0 to P1.2, Input/Output With Schmitt Trigger
    2. 6.2  Port P1, P1.3 to P1.5, Input/Output With Schmitt Trigger
    3. 6.3  Port P1, P1.6 to P1.7, Input/Output With Schmitt Trigger
    4. 6.4  Port P2, P2.0 to P2.2, Input/Output With Schmitt Trigger
    5. 6.5  Port P2, P2.3 to P2.4, Input/Output With Schmitt Trigger
    6. 6.6  Port P2, P2.5 to P2.6, Input/Output With Schmitt Trigger
    7. 6.7  Port P2, P2.7, Input/Output With Schmitt Trigger
    8. 6.8  Port P3, P3.0 to P3.3, Input/Output With Schmitt Trigger
    9. 6.9  Port P3, P3.4 to P3.6, Input/Output With Schmitt Trigger
    10. 6.10 Port P3, P3.7, Input/Output With Schmitt Trigger
    11. 6.11 Port P4, P4.0, Input/Output With Schmitt Trigger
    12. 6.12 Port P4, P4.1, Input/Output With Schmitt Trigger
    13. 6.13 Port J, J.0 to J.3 JTAG pins TDO, TMS, TCK, TDI/TCLK, Input/Output With Schmitt Trigger or Output
    14. 6.14 Port PJ, PJ.4 and PJ.5 Input/Output With Schmitt Trigger
  7. 7Device Descriptors (TLV)
  8. 8Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Getting Started
      2. 8.1.2 Development Tools Support
        1. 8.1.2.1 Hardware Features
        2. 8.1.2.2 Recommended Hardware Options
          1. 8.1.2.2.1 Target Socket Boards
          2. 8.1.2.2.2 Experimenter Boards
          3. 8.1.2.2.3 Debugging and Programming Tools
          4. 8.1.2.2.4 Production Programmers
        3. 8.1.2.3 Recommended Software Options
          1. 8.1.2.3.1 Integrated Development Environments
          2. 8.1.2.3.2 MSP430Ware
          3. 8.1.2.3.3 Command-Line Programmer
      3. 8.1.3 Device and Development Tool Nomenclature
    2. 8.2 Documentation Support
    3. 8.3 Community Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  9. 9Mechanical Packaging and Orderable Information
    1. 9.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Device Overview

1.1 Features

  • Embedded Microcontroller
    • 16-Bit RISC Architecture up to 24-MHz Clock
    • Wide Supply Voltage Range (2 to 3.6 V)
    • –55°C to 85°C Operation
  • Optimized Ultra-Low-Power Modes
    • Active Mode: 81.4 µA/MHz (Typical)
    • Standby (LPM3 With VLO): 6.3 µA (Typical)
    • Real-Time Clock (LPM3.5 With Crystal): 1.5 µA (Typical)
    • Shutdown (LPM4.5): 0.32 µA (Typical)
  • Ultra-Low-Power Ferroelectric RAM (FRAM)
    • Up to 16KB of Nonvolatile Memory
    • Ultra-Low-Power Writes
    • Fast Write at 125 ns per Word (16KB in 1 ms)
    • Built-In Error Correction Coding (ECC) and Memory Protection Unit (MPU)
    • Universal Memory = Program + Data + Storage
    • 1015 Write Cycle Endurance
    • Radiation Resistant and Nonmagnetic
  • Intelligent Digital Peripherals
    • 32-Bit Hardware Multiplier (MPY)
    • Three-Channel Internal DMA
    • Real-Time Clock (RTC) With Calendar and Alarm Functions
    • Five 16-Bit Timers With up to Three Capture/Compare Registers
    • 16-Bit Cyclic Redundancy Checker (CRC)
  • High-Performance Analog
    • 16-Channel Analog Comparator With Voltage Reference and Programmable Hysteresis
    • 14-Channel 10-Bit Analog-to-Digital Converter With Internal Reference and Sample-and-Hold
      • 200 ksps at 100-µA Consumption
  • Enhanced Serial Communication
    • eUSCI_A0 and eUSCI_A1 Support:
      • UART With Automatic Baud-Rate Detection
      • IrDA Encode and Decode
      • SPI at Rates up to 10 Mbps
    • eUSCI_B0 Supports:
      • I2C With Multiple Slave Addressing
      • SPI at Rates up to 10 Mbps
    • Hardware UART Bootstrap Loader (BSL)
  • Power Management System
    • Fully Integrated LDO
    • Supply Voltage Supervisor for Core and Supply Voltages With Reset Capability
    • Always-On Zero-Power Brownout Detection
    • Serial On-Board Programming With No External Voltage Needed
  • Flexible Clock System
    • Fixed-Frequency DCO With Six Selectable Factory-Trimmed Frequencies (Device Dependent)
    • Low-Power Low-Frequency Internal Clock Source (VLO)
    • 32-kHz Crystals (LFXT)
    • High-Frequency Crystals (HFXT)
  • Development Tools and Software
  • Family Members
    • Variants and Available Packages Summarized in
    • For Complete Module Descriptions, See the MSP430FR57xx Family User's Guide (SLAU272)
  • Supports Defense, Aerospace, and Medical Applications
    • Controlled Baseline
    • One Assembly and Test Site
    • One Fabrication Site
    • Available in Extended (–55°C to 85°C) Temperature Range

      • (Some Noted Parameters Specified for –40°C to 85°C Only)

    • Extended Product Life Cycle
    • Extended Product-Change Notification
    • Product Traceability

1.2 Applications

  • Home Automation
  • Security
  • Sensor Management
  • Data Acquisition

CAUTION These products use FRAM nonvolatile memory technology. FRAM retention is sensitive to extreme temperatures, such as those experienced during reflow or hand soldering. See Absolute Maximum Ratings for more information.
CAUTION System-level ESD protection must be applied in compliance with the device-level ESD specification to prevent electrical overstress or disturb of data or code memory. See the application report MSP430™ System-Level ESD Considerations (SLAA530) for more information.

1.3 Description

The Texas Instruments MSP430FR573x family of ultra-low-power microcontrollers consists of multiple devices that feature embedded FRAM nonvolatile memory, ultra-low-power 16-bit MSP430™ CPU, and different peripherals targeted for various applications. The architecture, FRAM, and peripherals, combined with seven low-power modes, are optimized to achieve extended battery life in portable and wireless sensing applications. FRAM is a new nonvolatile memory that combines the speed, flexibility, and endurance of SRAM with the stability and reliability of flash, all at lower total power consumption. Peripherals include a 10-bit analog-to-digital converter (ADC), a 16-channel comparator with voltage reference generation and hysteresis capabilities, three enhanced serial channels capable of I2C, SPI, or UART protocols, an internal DMA, a hardware multiplier, an RTC, five 16-bit timers, and digital I/Os.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE(2)
MSP430FR5739-EP VQFN (40) 6.00 mm × 6.00 mm
(1) For the most current part, package, and ordering information, see the Package Option Addendum in Section 9, or see the TI web site at www.ti.com.
(2) The dimensions shown here are approximations. For the package dimensions with tolerances, see the Mechanical Data in Section 9.

1.4 Functional Block Diagram

This section shows the functional block diagram for the MSP430FR5739 device in the RHA package.

slas639-blk_fr5739_35_31_rha.gif