SLASEK0A December   2017  – March 2018 MSP430FR5969-SP

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Terminal Configuration and Functions
    1. 3.1 Pin Diagrams
    2. 3.2 Signal Descriptions
      1.      Signal Descriptions
    3. 3.3 Pin Multiplexing
    4. 3.4 Connection of Unused Pins
  4. 4Specifications
    1. 4.1  Absolute Maximum Ratings
    2. 4.2  ESD Ratings
    3. 4.3  Recommended Operating Conditions
    4. 4.4  Active Mode Supply Current Into VCC Excluding External Current
    5. 4.5  Typical Characteristics – Active Mode Supply Currents
    6. 4.6  Low-Power Mode (LPM0, LPM1) Supply Currents Into VCC Excluding External Current
    7. 4.7  Low-Power Mode (LPM2, LPM3, LPM4) Supply Currents (Into VCC) Excluding External Current
    8. 4.8  Low-Power Mode (LPM3.5, LPM4.5) Supply Currents (Into VCC) Excluding External Current
    9. 4.9  Typical Characteristics, Current Consumption per Module
    10. 4.10 Thermal Resistance Characteristics
    11. 4.11 Timing and Switching Characteristics
      1. 4.11.1  Power Supply Sequencing
        1. Table 4-1 Brownout and Device Reset Power Ramp Requirements
        2. Table 4-2 SVS
      2. 4.11.2  Reset Timing
        1. Table 4-3 Reset Input
      3. 4.11.3  Clock Specifications
        1. Table 4-4 Low-Frequency Crystal Oscillator, LFXT
        2. Table 4-5 High-Frequency Crystal Oscillator, HFXT
        3. Table 4-6 DCO
        4. Table 4-7 Internal Very-Low-Power Low-Frequency Oscillator (VLO)
        5. Table 4-8 Module Oscillator (MODOSC)
      4. 4.11.4  Wake-up Characteristics
        1. Table 4-9   Wake-up Times From Low-Power Modes and Reset
        2. Table 4-10 Typical Wake-up Charge
        3. 4.11.4.1    Typical Characteristics, Average LPM Currents vs Wake-up Frequency
      5. 4.11.5  Digital I/Os
        1. Table 4-11 Digital Inputs
        2. Table 4-12 Digital Outputs
        3. 4.11.5.1    Typical Characteristics, Digital Outputs at 3.0 V and 2.2 V
        4. Table 4-13 Pin-Oscillator Frequency, Ports Px
        5. 4.11.5.2    Typical Characteristics, Pin-Oscillator Frequency
      6. 4.11.6  Timer_A and Timer_B
        1. Table 4-14 Timer_A
        2. Table 4-15 Timer_B
      7. 4.11.7  eUSCI
        1. Table 4-16 eUSCI (UART Mode) Clock Frequency
        2. Table 4-17 eUSCI (UART Mode)
        3. Table 4-18 eUSCI (SPI Master Mode) Clock Frequency
        4. Table 4-19 eUSCI (SPI Master Mode)
        5. Table 4-20 eUSCI (SPI Slave Mode)
        6. Table 4-21 eUSCI (I2C Mode)
      8. 4.11.8  ADC
        1. Table 4-22 12-Bit ADC, Power Supply and Input Range Conditions
        2. Table 4-23 12-Bit ADC, Timing Parameters
        3. Table 4-24 12-Bit ADC, Linearity Parameters With External Reference
        4. Table 4-25 12-Bit ADC, Dynamic Performance for Differential Inputs With External Reference
        5. Table 4-26 12-Bit ADC, Dynamic Performance for Differential Inputs With Internal Reference
        6. Table 4-27 12-Bit ADC, Dynamic Performance for Single-Ended Inputs With External Reference
        7. Table 4-28 12-Bit ADC, Dynamic Performance for Single-Ended Inputs With Internal Reference
        8. Table 4-29 12-Bit ADC, Dynamic Performance With 32.768-kHz Clock
        9. Table 4-30 12-Bit ADC, Temperature Sensor and Built-In V1/2
        10. Table 4-31 12-Bit ADC, External Reference
      9. 4.11.9  Reference
        1. Table 4-32 REF, Built-In Reference
      10. 4.11.10 Comparator
        1. Table 4-33 Comparator_E
      11. 4.11.11 FRAM
        1. Table 4-34 FRAM
    12. 4.12 Emulation and Debug
      1. Table 4-35 JTAG and Spy-Bi-Wire Interface
  5. 5Detailed Description
    1. 5.1  Overview
    2. 5.2  CPU
    3. 5.3  Operating Modes
      1. 5.3.1 Peripherals in Low-Power Modes
        1. 5.3.1.1 Idle Currents of Peripherals in LPM3 and LPM4
    4. 5.4  Interrupt Vector Table and Signatures
    5. 5.5  Memory Organization
    6. 5.6  Bootloader (BSL)
    7. 5.7  JTAG Operation
      1. 5.7.1 JTAG Standard Interface
      2. 5.7.2 Spy-Bi-Wire Interface
    8. 5.8  FRAM
    9. 5.9  Memory Protection Unit Including IP Encapsulation
    10. 5.10 Peripherals
      1. 5.10.1  Digital I/O
      2. 5.10.2  Oscillator and Clock System (CS)
      3. 5.10.3  Power-Management Module (PMM)
      4. 5.10.4  Hardware Multiplier (MPY)
      5. 5.10.5  Real-Time Clock (RTC_B) (Only MSP430FR596x and MSP430FR594x)
      6. 5.10.6  Watchdog Timer (WDT_A)
      7. 5.10.7  System Module (SYS)
      8. 5.10.8  DMA Controller
      9. 5.10.9  Enhanced Universal Serial Communication Interface (eUSCI)
      10. 5.10.10 TA0, TA1
      11. 5.10.11 TA2, TA3
      12. 5.10.12 TB0
      13. 5.10.13 ADC12_B
      14. 5.10.14 Comparator_E
      15. 5.10.15 CRC16
      16. 5.10.16 AES256 Accelerator
      17. 5.10.17 True Random Seed
      18. 5.10.18 Shared Reference (REF)
      19. 5.10.19 Embedded Emulation
        1. 5.10.19.1 Embedded Emulation Module (EEM)
        2. 5.10.19.2 EnergyTrace++ Technology
      20. 5.10.20 Peripheral File Map
    11. 5.11 Input and Output Diagrams
      1. 5.11.1  Port P1 (P1.0 to P1.2) Input/Output With Schmitt Trigger
      2. 5.11.2  Port P1 (P1.3 to P1.5) Input/Output With Schmitt Trigger
      3. 5.11.3  Port P1 (P1.6 and P1.7) Input/Output With Schmitt Trigger
      4. 5.11.4  Port P2 (P2.0 to P2.2) Input/Output With Schmitt Trigger
      5. 5.11.5  Port P2 (P2.3 and P2.4) Input/Output With Schmitt Trigger
      6. 5.11.6  Port P2 (P2.5 and P2.6) Input/Output With Schmitt Trigger
      7. 5.11.7  Port P2 (P2.7) Input/Output With Schmitt Trigger
      8. 5.11.8  Port P3 (P3.0 to P3.3) Input/Output With Schmitt Trigger
      9. 5.11.9  Port P3 (P3.4 to P3.7) Input/Output With Schmitt Trigger
      10. 5.11.10 Port P4 (P4.0 to P4.3) Input/Output With Schmitt Trigger
      11. 5.11.11 Port P4 (P4.4 to P4.7) Input/Output With Schmitt Trigger
      12. 5.11.12 Port PJ, PJ.4 and PJ.5 Input/Output With Schmitt Trigger
      13. 5.11.13 Port PJ (PJ.6 and PJ.7) Input/Output With Schmitt Trigger
      14. 5.11.14 Port PJ (PJ.0 to PJ.3) JTAG Pins TDO, TMS, TCK, TDI/TCLK, Input/Output With Schmitt Trigger
    12. 5.12 Device Descriptor (TLV)
    13. 5.13 Identification
      1. 5.13.1 Revision Identification
      2. 5.13.2 Device Identification
      3. 5.13.3 JTAG Identification
  6. 6Applications, Implementation, and Layout
    1. 6.1 Software Best Practices for Radiation Effects Mitigation
    2. 6.2 Device Connection and Layout Fundamentals
      1. 6.2.1 Power Supply Decoupling and Bulk Capacitors
      2. 6.2.2 External Oscillator
      3. 6.2.3 JTAG
      4. 6.2.4 Reset
      5. 6.2.5 Unused Pins
      6. 6.2.6 General Layout Recommendations
      7. 6.2.7 Do's and Don'ts
    3. 6.3 Peripheral- and Interface-Specific Design Information
      1. 6.3.1 ADC12_B Peripheral
        1. 6.3.1.1 Partial Schematic
        2. 6.3.1.2 Design Requirements
        3. 6.3.1.3 Detailed Design Procedure
        4. 6.3.1.4 Layout Guidelines
  7. 7Device and Documentation Support
    1. 7.1  Getting Started and Next Steps
    2. 7.2  Tools and Software
    3. 7.3  Documentation Support
    4. 7.4  Radiation Information
    5. 7.5  Related Links
    6. 7.6  Community Resources
    7. 7.7  Trademarks
    8. 7.8  Electrostatic Discharge Caution
    9. 7.9  Export Control Notice
    10. 7.10 Glossary
  8. 8Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Table 4-31 12-Bit ADC, External Reference(1)

over recommended ranges of supply voltage and operating temperature (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VR+ Positive external reference voltage input VeREF+ or VeREF- based on ADC12VRSEL bit VR+> VR– 1.2 AVCC V
VR– Negative external reference voltage input VeREF+ or VeREF- based on ADC12VRSEL bit VR+> VR– 0 1.2 V
VR+ – VR– Differential external reference voltage input VR+> VR– 1.2 AVCC V
IVeREF+,
IVeREF- 		Static input current, singled-ended input mode 1.2 V ≤ VeREF+ ≤ VAVCC, VeREF– = 0 V
fADC12CLK = 5 MHz, ADC12SHTx = 1h,
ADC12DIF = 0, ADC12PWRMD = 0 		±10 µA
1.2 V ≤ VeREF+ ≤ VAVCC , VeREF– = 0 V
fADC12CLK = 5 MHz, ADC12SHTx = 8h,
ADC12DIF = 0, ADC12PWRMD = 01		 ±2.5
IVeREF+,
IVeREF- 		Static input current, differential input mode 1.2 V ≤ VeREF+ ≤ VAVCC, VeREF– = 0 V
fADC12CLK = 5 MHz, ADC12SHTx = 1h,
ADC12DIF = 1, ADC12PWRMD = 0 		±20 µA
1.2 V ≤ VeREF+ ≤ VAVCC , VeREF– = 0 V
fADC12CLK = 5 MHz, ADC12SHTx = 8h,
ADC12DIF = 1, ADC12PWRMD = 1		 ±5
IVeREF+ Peak input current with single-ended input 0 V ≤ VeREF+ ≤ VAVCC, ADC12DIF = 0 1.5 mA
IVeREF+ Peak input current with differential input 0 V ≤ VeREF+ ≤ VAVCC, ADC12DIF = 1 3 mA
CVeREF+/- Capacitance at VeREF+ or VeREF- terminal See (2) 10 µF
(1) The external reference is used during ADC conversion to charge and discharge the capacitance array. The input capacitance, CI, is also the dynamic load for an external reference during conversion. The dynamic impedance of the reference supply should follow the recommendations on analog-source impedance to allow the charge to settle for 12-bit accuracy.
(2) Connect two decoupling capacitors, 10 µF and 470 nF, to VeREF to decouple the dynamic current required for an external reference source if it is used for the ADC12_B. Also see the MSP430FR58xx, MSP430FR59xx, MSP430FR68xx, and MSP430FR69xx Family User's Guide.