SLASEV3A March   2020  – December 2020 MSP430FR6005 , MSP430FR6007

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Functional Block Diagram
  5. 5 Revision History
  6. 6 Device Comparison
    1. 6.1 Related Products
  7. 7 Terminal Configuration and Functions
    1. 7.1 Pin Diagram
    2. 7.2 Pin Attributes
    3. 7.3 Signal Descriptions
    4. 7.4 Pin Multiplexing
    5. 7.5 Buffer Type
    6. 7.6 Connection of Unused Pins
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Active Mode Supply Current Into VCC Excluding External Current
    5. 8.5  Typical Characteristics, Active Mode Supply Currents
    6. 8.6  Low-Power Mode (LPM0, LPM1) Supply Currents Into VCC Excluding External Current
    7. 8.7  Low-Power Mode (LPM2, LPM3, LPM4) Supply Currents (Into VCC) Excluding External Current
    8. 8.8  Low-Power Mode With LCD Supply Currents (Into VCC) Excluding External Current
    9. 8.9  Low-Power Mode (LPMx.5) Supply Currents (Into VCC) Excluding External Current
    10. 8.10 Typical Characteristics, Low-Power Mode Supply Currents
    11. 8.11 Current Consumption per Module
    12. 8.12 Thermal Resistance Characteristics for 100-Pin LQFP (PZ) Package
    13. 8.13 Timing and Switching Characteristics
      1. 8.13.1  Power Supply Sequencing
        1. 8.13.1.1 Brownout and Device Reset Power Ramp Requirements
        2. 8.13.1.2 SVS
      2. 8.13.2  Reset Timing
        1. 8.13.2.1 Reset Input
      3. 8.13.3  Clock Specifications
        1. 8.13.3.1 Low-Frequency Crystal Oscillator, LFXT
        2. 8.13.3.2 High-Frequency Crystal Oscillator, HFXT
        3. 8.13.3.3 DCO
        4. 8.13.3.4 Internal Very-Low-Power Low-Frequency Oscillator (VLO)
        5. 8.13.3.5 Module Oscillator (MODOSC)
      4. 8.13.4  Wake-up Characteristics
        1. 8.13.4.1 Wake-up Times From Low-Power Modes and Reset
        2. 8.13.4.2 Typical Wake-up Charges
        3. 8.13.4.3 Typical Characteristics, Average LPM Currents vs Wake-up Frequency
      5. 8.13.5  Digital I/Os
        1. 8.13.5.1 Digital Inputs
        2. 8.13.5.2 Digital Outputs
        3. 8.13.5.3 Typical Characteristics, Digital Outputs
      6. 8.13.6  LEA
        1. 8.13.6.1 Low-Energy Accelerator (LEA) Performance
      7. 8.13.7  Timer_A and Timer_B
        1. 8.13.7.1 Timer_A
        2. 8.13.7.2 Timer_B
      8. 8.13.8  eUSCI
        1. 8.13.8.1 eUSCI (UART Mode) Clock Frequency
        2. 8.13.8.2 eUSCI (UART Mode) Switching Characteristics
        3. 8.13.8.3 eUSCI (SPI Master Mode) Clock Frequency
        4. 8.13.8.4 eUSCI (SPI Master Mode) Switching Characteristics
        5. 8.13.8.5 eUSCI (SPI Master Mode) Timing Diagrams
        6. 8.13.8.6 eUSCI (SPI Slave Mode) Switching Characteristics
        7. 8.13.8.7 eUSCI (SPI Slave Mode) Timing Diagrams
        8. 8.13.8.8 eUSCI (I2C Mode) Switching Characteristics
        9. 8.13.8.9 eUSCI (I2C Mode) Timing Diagram
      9. 8.13.9  Segment LCD Controller
        1. 8.13.9.1 LCD_C Recommended Operating Conditions
        2. 8.13.9.2 LCD_C Electrical Characteristics
      10. 8.13.10 ADC12_B
        1. 8.13.10.1 12-Bit ADC, Power Supply and Input Range Conditions
        2. 8.13.10.2 12-Bit ADC, Timing Parameters
        3. 8.13.10.3 12-Bit ADC, Linearity Parameters
        4. 8.13.10.4 12-Bit ADC, Dynamic Performance With External Reference
        5. 8.13.10.5 12-Bit ADC, Dynamic Performance With Internal Reference
        6. 8.13.10.6 12-Bit ADC, Temperature Sensor and Built-In V1/2
        7. 8.13.10.7 12-Bit ADC, External Reference
      11. 8.13.11 Reference
        1. 8.13.11.1 REF, Built-In Reference
      12. 8.13.12 Comparator
        1. 8.13.12.1 Comparator_E
      13. 8.13.13 FRAM
        1. 8.13.13.1 FRAM
      14. 8.13.14 USS
        1. 8.13.14.1 USS Recommended Operating Conditions
        2. 8.13.14.2 USS LDO
        3. 8.13.14.3 USSXTAL
        4. 8.13.14.4 USS HSPLL
        5. 8.13.14.5 USS SDHS
        6. 8.13.14.6 USS PHY Output Stage
        7. 8.13.14.7 USS PHY Input Stage, Multiplexer
        8. 8.13.14.8 USS PGA
        9. 8.13.14.9 USS Bias Voltage Generator
      15. 8.13.15 Emulation and Debug
        1. 8.13.15.1 JTAG and Spy-Bi-Wire Interface
  9. 9 Detailed Description
    1. 9.1  Overview
    2. 9.2  CPU
    3. 9.3  Ultrasonic Sensing Solution (USS) Module
    4. 9.4  Low-Energy Accelerator (LEA) for Signal Processing
    5. 9.5  Operating Modes
      1. 9.5.1 Peripherals in Low-Power Modes
      2. 9.5.2 Idle Currents of Peripherals in LPM3 and LPM4
    6. 9.6  Interrupt Vector Table and Signatures
    7. 9.7  Bootloader (BSL)
    8. 9.8  JTAG Operation
      1. 9.8.1 JTAG Standard Interface
      2. 9.8.2 Spy-Bi-Wire (SBW) Interface
    9. 9.9  FRAM Controller A (FRCTL_A)
    10. 9.10 RAM
    11. 9.11 Tiny RAM
    12. 9.12 Memory Protection Unit (MPU) Including IP Encapsulation
    13. 9.13 Peripherals
      1. 9.13.1  Digital I/O
      2. 9.13.2  Oscillator and Clock System (CS)
      3. 9.13.3  Power-Management Module (PMM)
      4. 9.13.4  Hardware Multiplier (MPY)
      5. 9.13.5  Real-Time Clock (RTC_C)
      6. 9.13.6  Watchdog Timer (WDT_A)
      7. 9.13.7  System Module (SYS)
      8. 9.13.8  DMA Controller
      9. 9.13.9  Enhanced Universal Serial Communication Interface (eUSCI)
      10. 9.13.10 TA0, TA1, and TA4
      11. 9.13.11 TA2 and TA3
      12. 9.13.12 TB0
      13. 9.13.13 ADC12_B
      14. 9.13.14 USS
      15. 9.13.15 Comparator_E
      16. 9.13.16 CRC16
      17. 9.13.17 CRC32
      18. 9.13.18 AES256 Accelerator
      19. 9.13.19 True Random Seed
      20. 9.13.20 Shared Reference (REF)
      21. 9.13.21 LCD_C
      22. 9.13.22 Embedded Emulation
        1. 9.13.22.1 Embedded Emulation Module (EEM) (S Version)
        2. 9.13.22.2 EnergyTrace++ Technology
    14. 9.14 Input/Output Diagrams
      1. 9.14.1  Port Function Select Registers (PySEL1 , PySEL0)
      2. 9.14.2  Port P1 (P1.0 and P1.1) Input/Output With Schmitt Trigger
      3. 9.14.3  Port P1 (P1.2 to P1.7) Input/Output With Schmitt Trigger
      4. 9.14.4  Port P2 (P2.0 to P2.3) Input/Output With Schmitt Trigger
      5. 9.14.5  Port P2 (P2.4 to P2.7) Input/Output With Schmitt Trigger
      6. 9.14.6  Port P3 (P3.0 to P3.7) Input/Output With Schmitt Trigger
      7. 9.14.7  Port P4 (P4.0 to P4.7) Input/Output With Schmitt Trigger
      8. 9.14.8  Port P5 (P5.0 to P5.7) Input/Output With Schmitt Trigger
      9. 9.14.9  Port P6 (P6.0) Input/Output With Schmitt Trigger
      10. 9.14.10 Port P6 (P6.1 to P6.5) Input/Output With Schmitt Trigger
      11. 9.14.11 Port P6 (P6.6 and P6.7) Input/Output With Schmitt Trigger
      12. 9.14.12 Port P7 (P7.0 to P7.3) Input/Output With Schmitt Trigger
      13. 9.14.13 Port P7 (P7.4 to P7.7) Input/Output With Schmitt Trigger
      14. 9.14.14 Port P8 (P8.0 to P8.3) Input/Output With Schmitt Trigger
      15. 9.14.15 Port P8 (P8.4 to P8.7) Input/Output With Schmitt Trigger
      16. 9.14.16 Port P9 (P9.0 to P9.3) Input/Output With Schmitt Trigger
      17. 9.14.17 Port PJ (PJ.0 to PJ.3) JTAG Pins TDO, TMS, TCK, TDI/TCLK, Input/Output With Schmitt Trigger
      18. 9.14.18 Port PJ (PJ.4 and PJ.5) Input/Output With Schmitt Trigger
      19. 9.14.19 Port PJ (PJ.6 and PJ.7) Input/Output With Schmitt Trigger
    15. 9.15 Device Descriptors (TLV)
    16. 9.16 Memory Map
      1. 9.16.1 Peripheral File Map
    17. 9.17 Identification
      1. 9.17.1 Revision Identification
      2. 9.17.2 Device Identification
      3. 9.17.3 JTAG Identification
  10. 10Applications, Implementation, and Layout
    1. 10.1 Device Connection and Layout Fundamentals
      1. 10.1.1  Power Supply Decoupling and Bulk Capacitors
      2. 10.1.2  External Oscillator (HFXT and LFXT)
      3. 10.1.3  USS Oscillator (USSXT)
      4. 10.1.4  Transducer Connection to the USS Module
      5. 10.1.5  Charge Pump Control of Input Multiplexer
      6. 10.1.6  JTAG
      7. 10.1.7  Reset
      8. 10.1.8  Unused Pins
      9. 10.1.9  General Layout Recommendations
      10. 10.1.10 Do's and Don'ts
    2. 10.2 Peripheral- and Interface-Specific Design Information
      1. 10.2.1 ADC12_B Peripheral
        1. 10.2.1.1 Partial Schematic
        2. 10.2.1.2 Design Requirements
        3. 10.2.1.3 Detailed Design Procedure
        4. 10.2.1.4 Layout Guidelines
      2. 10.2.2 LCD_C Peripheral
        1. 10.2.2.1 Partial Schematic
        2. 10.2.2.2 Design Requirements
        3. 10.2.2.3 Detailed Design Procedure
        4. 10.2.2.4 Layout Guidelines
  11. 11Device and Documentation Support
    1. 11.1 Getting Started and Next Steps
    2. 11.2 Device Nomenclature
    3. 11.3 Tools and Software
    4. 11.4 Documentation Support
    5. 11.5 Support Resources
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Export Control Notice
    9. 11.9 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.4 Active Mode Supply Current Into VCC Excluding External Current

over recommended operating free-air temperature (unless otherwise noted)(1)(2)
PARAMETER EXECUTION MEMORY VCC FREQUENCY (fMCLK = fSMCLK) UNIT
1 MHz
0 WAIT STATES
(NWAITSx = 0)		 4 MHz
0 WAIT STATES
(NWAITSx = 0)		 8 MHz
0 WAIT STATES
(NWAITSx = 0)		 12 MHz
1 WAIT STATE
(NWAITSx = 1)		 16 MHz
1 WAIT STATE
(NWAITSx = 1)
TYP MAX TYP MAX TYP MAX TYP MAX TYP MAX
IAM, FRAM_UNI
(Unified memory)(3)		 FRAM 3.0 V 225 665 1275 1550 1970 µA
IAM, FRAM (0%)(4)(5) FRAM
0% cache hit ratio		 3.0 V 420 1455 2850 2330 3000 µA
IAM, FRAM (50%)(4)(5) FRAM
50% cache hit ratio		 3.0 V 275 855 1022 1650 1888 1770 2041 2265 2606 µA
IAM, FRAM (66%)(4)(5) FRAM
66% cache hit ratio		 3.0 V 220 650 1240 1443 1490 1735 1880 2197 µA
IAM, FRAM (75%)(4)(5) FRAM
75% cache hit ratio		 3.0 V 192 261 535 1015 1170 1290 1490 1620 1870 µA
IAM, FRAM (100%)(4)(5) FRAM
100% cache hit ratio		 3.0 V 125 237 450 670 790 µA
IAM, RAM(6)(5) RAM 3.0 V 140 323 590 880 1070 µA
IAM, RAM only(7)(5) RAM 3.0 V 90 182 292 540 830 1020 1313 µA
(1) All inputs are tied to 0 V or to VCC. Outputs do not source or sink any current.
(2) Characterized with program executing typical data processing.
fACLK = 32768 Hz, fMCLK = fSMCLK = fDCO at specified frequency, except for 12 MHz. For 12 MHz, fDCO = 24 MHz and fMCLK = fSMCLK = fDCO/2.
At MCLK frequencies above 8 MHz, the FRAM requires wait states. When wait states are required, the effective MCLK frequency (fMCLK,eff) decreases. The effective MCLK frequency also depends on the cache hit ratio. SMCLK is not affected by the number of wait states or the cache hit ratio.
The following equation can be used to compute fMCLK,eff:
fMCLK,eff = fMCLK / [wait states × (1 – cache hit ratio) + 1]
For example, with 1 wait state and 75% cache hit ratio, fMCKL,eff = fMCLK / [1 × (1 – 0.75) + 1] = fMCLK / 1.25.
(3) Represents typical program execution. Program and data reside entirely in FRAM. All execution is from FRAM.
(4) Program resides in FRAM. Data resides in SRAM. Average current dissipation varies with cache hit-to-miss ratio as specified. Cache hit ratio represents number cache accesess divided by the total number of FRAM accesses. For example, a 75% ratio implies three of every four accesses is from cache, and the remaining are FRAM accesses.
(5) See Section 8.5 for typical curves. Each characteristic equation shown in the graph is computed using the least squares method for best linear fit using the typical data shown in Section 8.4.
(6) Program and data reside entirely in RAM. All execution is from RAM.
(7) Program and data reside entirely in RAM. All execution is from RAM. FRAM is off.