SLASEF5 Data sheet

SLASEF5B January 2019 – December 2021 MSP430FR5041 , MSP430FR5043 , MSP430FR50431 , MSP430FR6041 , MSP430FR6043 , MSP430FR60431

PRODUCTION DATA

Package Options

Mechanical Data (Package|Pins)

PN|80
- MTQF010B

Thermal pad, mechanical data (Package|Pins)

Orderable Information

9.13.2 Oscillator and Clock System (CS)

The clock system includes support for a 32-kHz watch-crystal oscillator XT1 (LF), an internal very-low-power low-frequency oscillator (VLO), an integrated internal digitally controlled oscillator (DCO), and a high-frequency crystal oscillator XT2 (HF). The clock system module is designed to meet the requirements of both low system cost and low power consumption. A fail-safe mechanism exists for all crystal sources. The clock system module provides the following clock signals:

Auxiliary clock (ACLK). ACLK can be sourced from a 32-kHz watch crystal (LFXT1), the internal VLO, or a digital external low-frequency (<50 kHz) clock source.
Main clock (MCLK), the system clock used by the CPU. MCLK can be sourced from a high-frequency crystal (HFXT2), the internal DCO, a 32-kHz watch crystal (LFXT1), the internal VLO, or a digital external clock source.
Sub-Main clock (SMCLK), the subsystem clock used by the peripheral modules. SMCLK can be sourced by same sources made available to MCLK.
The high frequency oscillator XT2 (HF) can be sourced from the oscillator of the ultrasonic subsystem USSXT through an internal connection.