SLASE33C August   2014  – August 2018 MSP430FR6877 , MSP430FR6879 , MSP430FR68791

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagrams
    2. 4.2 Signal Descriptions
      1. Table 4-1 Signal Descriptions – MSP430FR687x and MSP430FR687x1
    3. 4.3 Pin Multiplexing
    4. 4.4 Connection of Unused Pins
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Active Mode Supply Current Into VCC Excluding External Current
    5. 5.5  Typical Characteristics, Active Mode Supply Currents
    6. 5.6  Low-Power Mode (LPM0, LPM1) Supply Currents Into VCC Excluding External Current
    7. 5.7  Low-Power Mode (LPM2, LPM3, LPM4) Supply Currents (Into VCC) Excluding External Current
    8. 5.8  Low-Power Mode With LCD Supply Currents (Into VCC) Excluding External Current
    9. 5.9  Low-Power Mode LPMx.5 Supply Currents (Into VCC) Excluding External Current
    10. 5.10 Typical Characteristics, Low-Power Mode Supply Currents
    11. 5.11 Typical Characteristics, Current Consumption per Module
    12. 5.12 Thermal Resistance Characteristics
    13. 5.13 Timing and Switching Characteristics
      1. 5.13.1 Power Supply Sequencing
        1. Table 5-1 Brownout and Device Reset Power Ramp Requirements
        2. Table 5-2 SVS
      2. 5.13.2 Reset Timing
        1. Table 5-3 Reset Input
      3. 5.13.3 Clock Specifications
        1. Table 5-4 Low-Frequency Crystal Oscillator, LFXT
        2. Table 5-5 High-Frequency Crystal Oscillator, HFXT
        3. Table 5-6 DCO
        4. Table 5-7 Internal Very-Low-Power Low-Frequency Oscillator (VLO)
        5. Table 5-8 Module Oscillator (MODOSC)
      4. 5.13.4 Wake-up Characteristics
        1. Table 5-9   Wake-up Times From Low-Power Modes and Reset
        2. Table 5-10 Typical Wake-up Charge
        3. 5.13.4.1    Typical Characteristics, Average LPM Currents vs Wake-up Frequency
      5. 5.13.5 Peripherals
        1. 5.13.5.1 Digital I/Os
          1. Table 5-11 Digital Inputs
          2. Table 5-12 Digital Outputs
          3. 5.13.5.1.1  Typical Characteristics, Digital Outputs at 3.0 V and 2.2 V
          4. Table 5-13 Pin-Oscillator Frequency, Ports Px
          5. 5.13.5.1.2  Typical Characteristics, Pin-Oscillator Frequency
        2. 5.13.5.2 Timer_A and Timer_B
          1. Table 5-14 Timer_A
          2. Table 5-15 Timer_B
        3. 5.13.5.3 eUSCI
          1. Table 5-16 eUSCI (UART Mode) Clock Frequency
          2. Table 5-17 eUSCI (UART Mode)
          3. Table 5-18 eUSCI (SPI Master Mode) Clock Frequency
          4. Table 5-19 eUSCI (SPI Master Mode)
          5. Table 5-20 eUSCI (SPI Slave Mode)
          6. Table 5-21 eUSCI (I2C Mode)
        4. 5.13.5.4 LCD Controller
          1. Table 5-22 LCD_C, Recommended Operating Conditions
          2. Table 5-23 LCD_C Electrical Characteristics
        5. 5.13.5.5 ADC
          1. Table 5-24 12-Bit ADC, Power Supply and Input Range Conditions
          2. Table 5-25 12-Bit ADC, Timing Parameters
          3. Table 5-26 12-Bit ADC, Linearity Parameters With External Reference
          4. Table 5-27 12-Bit ADC, Dynamic Performance for Differential Inputs With External Reference
          5. Table 5-28 12-Bit ADC, Dynamic Performance for Differential Inputs With Internal Reference
          6. Table 5-29 12-Bit ADC, Dynamic Performance for Single-Ended Inputs With External Reference
          7. Table 5-30 12-Bit ADC, Dynamic Performance for Single-Ended Inputs With Internal Reference
          8. Table 5-31 12-Bit ADC, Dynamic Performance With 32.768-kHz Clock
          9. Table 5-32 12-Bit ADC, Temperature Sensor and Built-In V1/2
          10. Table 5-33 12-Bit ADC, External Reference
        6. 5.13.5.6 Reference
          1. Table 5-34 REF, Built-In Reference
        7. 5.13.5.7 Comparator
          1. Table 5-35 Comparator_E
        8. 5.13.5.8 FRAM Controller
          1. Table 5-36 FRAM
      6. 5.13.6 Emulation and Debug
        1. Table 5-37 JTAG and Spy-Bi-Wire Interface
  6. 6Detailed Description
    1. 6.1  Overview
    2. 6.2  CPU
    3. 6.3  Operating Modes
      1. 6.3.1 Peripherals in Low-Power Modes
        1. 6.3.1.1 Idle Currents of Peripherals in LPM3 and LPM4
    4. 6.4  Interrupt Vector Table and Signatures
    5. 6.5  Bootloader (BSL)
    6. 6.6  JTAG Operation
      1. 6.6.1 JTAG Standard Interface
      2. 6.6.2 Spy-Bi-Wire Interface
    7. 6.7  FRAM
    8. 6.8  RAM
    9. 6.9  Tiny RAM
    10. 6.10 Memory Protection Unit Including IP Encapsulation
    11. 6.11 Peripherals
      1. 6.11.1  Digital I/O
      2. 6.11.2  Oscillator and Clock System (CS)
      3. 6.11.3  Power-Management Module (PMM)
      4. 6.11.4  Hardware Multiplier (MPY)
      5. 6.11.5  Real-Time Clock (RTC_C)
      6. 6.11.6  Watchdog Timer (WDT_A)
      7. 6.11.7  System Module (SYS)
      8. 6.11.8  DMA Controller
      9. 6.11.9  Enhanced Universal Serial Communication Interface (eUSCI)
      10. 6.11.10 Timer_A TA0, Timer_A TA1
      11. 6.11.11 Timer_A TA2
      12. 6.11.12 Timer_A TA3
      13. 6.11.13 Timer_B TB0
      14. 6.11.14 ADC12_B
      15. 6.11.15 Comparator_E
      16. 6.11.16 CRC16
      17. 6.11.17 CRC32
      18. 6.11.18 True Random Seed
      19. 6.11.19 Shared Reference (REF_A)
      20. 6.11.20 LCD_C
      21. 6.11.21 Embedded Emulation
        1. 6.11.21.1 Embedded Emulation Module (EEM)
        2. 6.11.21.2 EnergyTrace++™ Technology
      22. 6.11.22 Input/Output Diagrams
        1. 6.11.22.1  Digital I/O Functionality – Ports P1 to P10
        2. 6.11.22.2  Capacitive Touch Functionality Ports P1 to P10 and PJ
        3. 6.11.22.3  Port P1 (P1.0 to P1.3) Input/Output With Schmitt Trigger
        4. 6.11.22.4  Port P1 (P1.4 to P1.7) Input/Output With Schmitt Trigger
        5. 6.11.22.5  Port P2 (P2.0 to P2.3) Input/Output With Schmitt Trigger
        6. 6.11.22.6  Port P2 (P2.4 to P2.7) Input/Output With Schmitt Trigger
        7. 6.11.22.7  Port P3 (P3.0 to P3.7) Input/Output With Schmitt Trigger
        8. 6.11.22.8  Port P4 (P4.0 to P4.7) Input/Output With Schmitt Trigger
        9. 6.11.22.9  Port P5 (P5.0 to P5.7) Input/Output With Schmitt Trigger
        10. 6.11.22.10 Port P6 (P6.0 to P6.6) Input/Output With Schmitt Trigger
        11. 6.11.22.11 Port P6 (P6.7) Input/Output With Schmitt Trigger
        12. 6.11.22.12 Port P7 (P7.0 to P7.7) Input/Output With Schmitt Trigger
        13. 6.11.22.13 Port P8 (P8.0 to P8.3) Input/Output With Schmitt Trigger
        14. 6.11.22.14 Port P8 (P8.4 to P8.7) Input/Output With Schmitt Trigger
        15. 6.11.22.15 Port P9 (P9.0 to P9.3) Input/Output With Schmitt Trigger
        16. 6.11.22.16 Port P9 (P9.4 to P9.7) Input/Output With Schmitt Trigger
        17. 6.11.22.17 Port P10 (P10.0 to P10.2) Input/Output With Schmitt Trigger
        18. 6.11.22.18 Port PJ (PJ.4 and PJ.5) Input/Output With Schmitt Trigger
        19. 6.11.22.19 Port PJ (PJ.6 and PJ.7) Input/Output With Schmitt Trigger
        20. 6.11.22.20 Port PJ (PJ.0 to PJ.3) JTAG Pins TDO, TMS, TCK, TDI/TCLK, Input/Output With Schmitt Trigger
    12. 6.12 Device Descriptors (TLV)
    13. 6.13 Memory
      1. 6.13.1 Peripheral File Map
    14. 6.14 Identification
      1. 6.14.1 Revision Identification
      2. 6.14.2 Device Identification
      3. 6.14.3 JTAG Identification
  7. 7Applications, Implementation, and Layout
    1. 7.1 Device Connection and Layout Fundamentals
      1. 7.1.1 Power Supply Decoupling and Bulk Capacitors
      2. 7.1.2 External Oscillator
      3. 7.1.3 JTAG
      4. 7.1.4 Reset
      5. 7.1.5 Unused Pins
      6. 7.1.6 General Layout Recommendations
      7. 7.1.7 Do's and Don'ts
    2. 7.2 Peripheral- and Interface-Specific Design Information
      1. 7.2.1 ADC12_B Peripheral
        1. 7.2.1.1 Partial Schematic
        2. 7.2.1.2 Design Requirements
        3. 7.2.1.3 Detailed Design Procedure
        4. 7.2.1.4 Layout Guidelines
      2. 7.2.2 LCD_C Peripheral
        1. 7.2.2.1 Partial Schematic
        2. 7.2.2.2 Design Requirements
        3. 7.2.2.3 Detailed Design Procedure
        4. 7.2.2.4 Layout Guidelines
  8. 8Device and Documentation Support
    1. 8.1  Getting Started and Next Steps
    2. 8.2  Device Nomenclature
    3. 8.3  Tools and Software
    4. 8.4  Documentation Support
    5. 8.5  Related Links
    6. 8.6  Community Resources
    7. 8.7  Trademarks
    8. 8.8  Electrostatic Discharge Caution
    9. 8.9  Export Control Notice
    10. 8.10 Glossary
  9. 9Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Active Mode Supply Current Into VCC Excluding External Current

over recommended operating free-air temperature (unless otherwise noted)(1)(2)
PARAMETER EXECUTION MEMORY VCC FREQUENCY (fMCLK = fSMCLK) UNIT
1 MHz
0 WAIT STATES
(NWAITSx = 0)		 4 MHz
0 WAIT STATES
(NWAITSx = 0)		 8 MHz
0 WAIT STATES
(NWAITSx = 0)		 12 MHz
1 WAIT STATE
(NWAITSx = 1)		 16 MHz
1 WAIT STATE
(NWAITSx = 1)
TYP MAX TYP MAX TYP MAX TYP MAX TYP MAX
IAM, FRAM_UNI
(Unified memory)(3) 		FRAM 3.0 V 210 640 1220 1475 1845 µA
IAM, FRAM(0%)(4)(5) FRAM
0% cache hit ratio		 3.0 V 375 1290 2525 2100 2675 µA
IAM, FRAM(50%)(4)(5) FRAM
50% cache hit ratio		 3.0 V 240 745 1440 1575 1990 µA
IAM, FRAM(66%)(4)(5) FRAM
66% cache hit ratio		 3.0 V 200 560 1070 1300 1620 µA
IAM, FRAM(75%)(4)(5) FRAM
75% cache hit ratio		 3.0 V 170 255 480 890 1085 1155 1310 1420 1620 µA
IAM, FRAM(100%(4)(5) FRAM
100% cache hit ratio		 3.0 V 110 235 420 640 730 µA
IAM, RAM(6)(5) RAM 3.0 V 130 320 585 890 1070 µA
IAM, RAM only(7)(5) RAM 3.0 V 100 180 290 555 860 1040 1300 µA
(1) All inputs are tied to 0 V or to VCC. Outputs do not source or sink any current.
(2) Characterized with program executing typical data processing.
fACLK = 32768 Hz, fMCLK = fSMCLK = fDCO at specified frequency, except for 12 MHz. For 12 MHz, fDCO = 24 MHz and fMCLK = fSMCLK = fDCO / 2.
At MCLK frequencies above 8 MHz, the FRAM requires wait states. When wait states are required, the effective MCLK frequency (fMCLK,eff) decreases. The effective MCLK frequency also depends on the cache hit ratio. SMCLK is not affected by the number of wait states or the cache hit ratio.
The following equation can be used to compute fMCLK,eff:
fMCLK,eff = fMCLK / [wait states × (1 – cache hit ratio) + 1]
For example, with 1 wait state and 75% cache hit ratio fMCKL,eff = fMCLK / [1 × (1 – 0.75) + 1] = fMCLK / 1.25.
(3) Represents typical program execution. Program and data reside entirely in FRAM. All execution is from FRAM.
(4) Program resides in FRAM. Data resides in SRAM. Average current dissipation varies with cache hit-to-miss ratio as specified. Cache hit ratio represents number cache accesses divided by the total number of FRAM accesses. For example, a 75% ratio implies three of every four accesses is from cache, and the remaining are FRAM accesses.
(5) See Figure 5-1 for typical curves. Each characteristic equation shown in the graph is computed using the least squares method for best linear fit using the typical data shown in Section 5.4.
(6) Program and data reside entirely in RAM. All execution is from RAM.
(7) Program and data reside entirely in RAM. All execution is from RAM. FRAM is off.