SLASE23E January   2015  – August 2018 MSP430FR6820 , MSP430FR6822 , MSP430FR68221 , MSP430FR6870 , MSP430FR6872 , MSP430FR68721 , MSP430FR6920 , MSP430FR6922 , MSP430FR69221 , MSP430FR6970 , MSP430FR6972 , MSP430FR69721

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagrams
    2. 4.2 Pin Attributes
    3. 4.3 Signal Descriptions
      1. Table 4-2 Signal Descriptions
    4. 4.4 Pin Multiplexing
    5. 4.5 Buffer Type
    6. 4.6 Connection of Unused Pins
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Active Mode Supply Current Into VCC Excluding External Current
    5. 5.5  Typical Characteristics - Active Mode Supply Currents
    6. 5.6  Low-Power Mode (LPM0, LPM1) Supply Currents Into VCC Excluding External Current
    7. 5.7  Low-Power Mode LPM2, LPM3, LPM4 Supply Currents (Into VCC) Excluding External Current
    8. 5.8  Low-Power Mode With LCD Supply Currents (Into VCC) Excluding External Current
    9. 5.9  Low-Power Mode LPMx.5 Supply Currents (Into VCC) Excluding External Current
    10. 5.10 Typical Characteristics, Low-Power Mode Supply Currents
    11. 5.11 Typical Characteristics, Current Consumption per Module
    12. 5.12 Thermal Resistance Characteristics
    13. 5.13 Timing and Switching Characteristics
      1. 5.13.1  Power Supply Sequencing
        1. Table 5-1 Brownout and Device Reset Power Ramp Requirements
        2. Table 5-2 SVS
      2. 5.13.2  Reset Timing
        1. Table 5-3 Reset Input
      3. 5.13.3  Clock Specifications
        1. Table 5-4 Low-Frequency Crystal Oscillator, LFXT
        2. Table 5-5 High-Frequency Crystal Oscillator, HFXT
        3. Table 5-6 DCO
        4. Table 5-7 Internal Very-Low-Power Low-Frequency Oscillator (VLO)
        5. Table 5-8 Module Oscillator (MODOSC)
      4. 5.13.4  Wake-up Characteristics
        1. Table 5-9   Wake-up Times From Low-Power Modes and Reset
        2. Table 5-10 Typical Wake-up Charge
        3. 5.13.4.1    Typical Characteristics, Average LPM Currents vs Wake-up Frequency
      5. 5.13.5  Digital I/Os
        1. Table 5-11 Digital Inputs
        2. Table 5-12 Digital Outputs
        3. 5.13.5.1    Typical Characteristics, Digital Outputs at 3.0 V and 2.2 V
        4. Table 5-13 Pin-Oscillator Frequency, Ports Px
        5. 5.13.5.2    Typical Characteristics, Pin-Oscillator Frequency
      6. 5.13.6  Timer_A and Timer_B
        1. Table 5-14 Timer_A
        2. Table 5-15 Timer_B
      7. 5.13.7  eUSCI
        1. Table 5-16 eUSCI (UART Mode) Clock Frequency
        2. Table 5-17 eUSCI (UART Mode)
        3. Table 5-18 eUSCI (SPI Master Mode) Clock Frequency
        4. Table 5-19 eUSCI (SPI Master Mode)
        5. Table 5-20 eUSCI (SPI Slave Mode)
        6. Table 5-21 eUSCI (I2C Mode)
      8. 5.13.8  Segment LCD Controller
        1. Table 5-22 LCD_C Recommended Operating Conditions
        2. Table 5-23 LCD_C Electrical Characteristics
      9. 5.13.9  ADC12
        1. Table 5-24 12-Bit ADC, Power Supply and Input Range Conditions
        2. Table 5-25 12-Bit ADC, Timing Parameters
        3. Table 5-26 12-Bit ADC, Linearity Parameters With External Reference
        4. Table 5-27 12-Bit ADC, Dynamic Performance for Differential Inputs With External Reference
        5. Table 5-28 12-Bit ADC, Dynamic Performance for Differential Inputs With Internal Reference
        6. Table 5-29 12-Bit ADC, Dynamic Performance for Single-Ended Inputs With External Reference
        7. Table 5-30 12-Bit ADC, Dynamic Performance for Single-Ended Inputs With Internal Reference
        8. Table 5-31 12-Bit ADC, Dynamic Performance With 32.768-kHz Clock
        9. Table 5-32 12-Bit ADC, Temperature Sensor and Built-In V1/2
        10. Table 5-33 12-Bit ADC, External Reference
      10. 5.13.10 REF Module
        1. Table 5-34 REF, Built-In Reference
      11. 5.13.11 Comparator
        1. Table 5-35 Comparator_E
      12. 5.13.12 FRAM Controller
        1. Table 5-36 FRAM
      13. 5.13.13 Emulation and Debug
        1. Table 5-37 JTAG and Spy-Bi-Wire Interface
  6. 6Detailed Description
    1. 6.1  Overview
    2. 6.2  CPU
    3. 6.3  Operating Modes
      1. 6.3.1 Peripherals in Low-Power Modes
      2. 6.3.2 Idle Currents of Peripherals in LPM3 and LPM4
    4. 6.4  Interrupt Vector Table and Signatures
    5. 6.5  Bootloader (BSL)
    6. 6.6  JTAG Operation
      1. 6.6.1 JTAG Standard Interface
      2. 6.6.2 Spy-Bi-Wire Interface
    7. 6.7  FRAM
    8. 6.8  RAM
    9. 6.9  Tiny RAM
    10. 6.10 Memory Protection Unit (MPU) Including IP Encapsulation
    11. 6.11 Peripherals
      1. 6.11.1  Digital I/O
      2. 6.11.2  Oscillator and Clock System (CS)
      3. 6.11.3  Power-Management Module (PMM)
      4. 6.11.4  Hardware Multiplier
      5. 6.11.5  Real-Time Clock (RTC_C)
      6. 6.11.6  Watchdog Timer (WDT_A)
      7. 6.11.7  System Module (SYS)
      8. 6.11.8  DMA Controller
      9. 6.11.9  Enhanced Universal Serial Communication Interface (eUSCI)
      10. 6.11.10 Timer_A TA0, Timer_A TA1
      11. 6.11.11 Timer_A TA2
      12. 6.11.12 Timer_A TA3
      13. 6.11.13 Timer_B TB0
      14. 6.11.14 ADC12_B
      15. 6.11.15 Comparator_E
      16. 6.11.16 CRC16
      17. 6.11.17 CRC32
      18. 6.11.18 AES256 Accelerator
      19. 6.11.19 True Random Seed
      20. 6.11.20 Shared Reference (REF_A)
      21. 6.11.21 LCD_C
      22. 6.11.22 Embedded Emulation
        1. 6.11.22.1 Embedded Emulation Module (EEM)
        2. 6.11.22.2 EnergyTrace++ Technology
      23. 6.11.23 Input/Output Diagrams
        1. 6.11.23.1  Digital I/O Functionality Port P1 to P7 and P9
        2. 6.11.23.2  Capacitive Touch Functionality on Port P1 to P7, P9, and PJ
        3. 6.11.23.3  Port P1 (P1.0 to P1.3) Input/Output With Schmitt Trigger
        4. 6.11.23.4  Port P1 (P1.4 to P1.7) Input/Output With Schmitt Trigger
        5. 6.11.23.5  Port P2 (P2.0 to P2.3) Input/Output With Schmitt Trigger
        6. 6.11.23.6  Port P3 (P3.0 to P3.7) Input/Output With Schmitt Trigger
        7. 6.11.23.7  Port P4 (P4.2 to P4.7) Input/Output With Schmitt Trigger
        8. 6.11.23.8  Port P5 (P5.4 to P5.7) Input/Output With Schmitt Trigger
        9. 6.11.23.9  Port P6 (P6.0 to P6.6) Input/Output With Schmitt Trigger
        10. 6.11.23.10 Port P7 (P7.0 to P7.4) Input/Output With Schmitt Trigger
        11. 6.11.23.11 Port P9 (P9.4 to P9.7) Input/Output With Schmitt Trigger
        12. 6.11.23.12 Port PJ (PJ.4 and PJ.5) Input/Output With Schmitt Trigger
        13. 6.11.23.13 Port PJ (PJ.6 and PJ.7) Input/Output With Schmitt Trigger
        14. 6.11.23.14 Port PJ (PJ.0 to PJ.3) JTAG Pins TDO, TMS, TCK, TDI/TCLK, Input/Output With Schmitt Trigger
    12. 6.12 Device Descriptors (TLV)
    13. 6.13 Memory
      1. 6.13.1 Peripheral File Map
    14. 6.14 Identification
      1. 6.14.1 Revision Identification
      2. 6.14.2 Device Identification
      3. 6.14.3 JTAG Identification
  7. 7Applications, Implementation, and Layout
    1. 7.1 Device Connection and Layout Fundamentals
      1. 7.1.1 Power Supply Decoupling and Bulk Capacitors
      2. 7.1.2 External Oscillator
      3. 7.1.3 JTAG
      4. 7.1.4 Reset
      5. 7.1.5 Unused Pins
      6. 7.1.6 General Layout Recommendations
      7. 7.1.7 Do's and Don'ts
    2. 7.2 Peripheral- and Interface-Specific Design Information
      1. 7.2.1 ADC12_B Peripheral
        1. 7.2.1.1 Partial Schematic
        2. 7.2.1.2 Design Requirements
        3. 7.2.1.3 Detailed Design Procedure
        4. 7.2.1.4 Layout Guidelines
      2. 7.2.2 LCD_C Peripheral
        1. 7.2.2.1 Partial Schematic
        2. 7.2.2.2 Design Requirements
        3. 7.2.2.3 Detailed Design Procedure
        4. 7.2.2.4 Layout Guidelines
  8. 8Device and Documentation Support
    1. 8.1  Getting Started and Next Steps
    2. 8.2  Device Nomenclature
    3. 8.3  Tools and Software
    4. 8.4  Documentation Support
    5. 8.5  Related Links
    6. 8.6  Community Resources
    7. 8.7  Trademarks
    8. 8.8  Electrostatic Discharge Caution
    9. 8.9  Export Control Notice
    10. 8.10 Glossary
  9. 9Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.12 Device Descriptors (TLV)

Table 6-35 summarizes the Device IDs. Table 6-36 list the contents of the device descriptor tag-length-value (TLV) structure.

Table 6-35 Device ID

DEVICE PACKAGE DEVICE ID
At 01A05h At 01A04h
MSP430FR6970 PM and RGC 82h 49h
MSP430FR6972(1) PM and RGC 82h 4Bh
MSP430FR6870 PM and RGC 82h 4Ch
MSP430FR6872(1) PM and RGC 82h 4Eh
MSP430FR6920 DGG 82h 4Fh
PM and RGC 82h 50h
MSP430FR6922(1) DGG 82h 53h
PM and RGC 82h 54h
MSP430FR6820 DGG 82h 55h
PM and RGC 82h 56h
MSP430FR6822(1) DGG 82h 59h
PM and RGC 82h 5Ah

Table 6-36 Device Descriptor Table (1)

DESCRIPTION MSP430FRxxxx (UART BSL) MSP430FRxxxx1 (I2C BSL)
ADDRESS VALUE ADDRESS VALUE
Info Block Info length 01A00h 06h 01A00h 06h
CRC length 01A01h 06h 01A01h 06h
CRC value 01A02h Per unit 01A02h Per unit
01A03h Per unit 01A03h Per unit
Device ID 01A04h See Table 6-35. 01A04h See Table 6-35.
Device ID 01A05h 01A05h
Hardware revision 01A06h Per unit 01A06h Per unit
Firmware revision 01A07h Per unit 01A07h Per unit
Die Record Die record tag 01A08h 08h 01A08h 08h
Die record length 01A09h 0Ah 01A09h 0Ah
Lot/wafer ID 01A0Ah Per unit 01A0Ah Per unit
01A0Bh Per unit 01A0Bh Per unit
01A0Ch Per unit 01A0Ch Per unit
01A0Dh Per unit 01A0Dh Per unit
Die X position 01A0Eh Per unit 01A0Eh Per unit
01A0Fh Per unit 01A0Fh Per unit
Die Y position 01A10h Per unit 01A10h Per unit
01A11h Per unit 01A11h Per unit
Test results 01A12h Per unit 01A12h Per unit
01A13h Per unit 01A13h Per unit
ADC12B Calibration ADC12B calibration tag 01A14h 11h 01A14h 11h
ADC12B calibration length 01A15h 10h 01A15h 10h
ADC gain factor(2) 01A16h Per unit 01A16h Per unit
01A17h Per unit 01A17h Per unit
ADC offset(3) 01A18h Per unit 01A18h Per unit
01A19h Per unit 01A19h Per unit
ADC 1.2-V reference
Temperature sensor 30°C		 01A1Ah Per unit 01A1Ah Per unit
01A1Bh Per unit 01A1Bh Per unit
ADC 1.2-V reference
Temperature sensor 85°C		 01A1Ch Per unit 01A1Ch Per unit
01A1Dh Per unit 01A1Dh Per unit
ADC 2.0-V reference
Temperature sensor 30°C		 01A1Eh Per unit 01A1Eh Per unit
01A1Fh Per unit 01A1Fh Per unit
ADC 2.0-V reference
Temperature sensor 85°C		 01A20h Per unit 01A20h Per unit
01A21h Per unit 01A21h Per unit
ADC 2.5-V reference
Temperature sensor 30°C		 01A22h Per unit 01A22h Per unit
01A23h Per unit 01A23h Per unit
ADC 2.5-V reference
Temperature sensor 85°C		 01A24h Per unit 01A24h Per unit
01A25h Per unit 01A25h Per unit
REF Calibration REF calibration tag 01A26h 12h 01A26h 12h
REF calibration length 01A27h 06h 01A27h 06h
REF 1.2-V reference 01A28h Per unit 01A28h Per unit
01A29h Per unit 01A29h Per unit
REF 2.0-V reference 01A2Ah Per unit 01A2Ah Per unit
01A2Bh Per unit 01A2Bh Per unit
REF 2.5-V reference 01A2Ch Per unit 01A2Ch Per unit
01A2Dh Per unit 01A2Dh Per unit
Random Number 128-bit random number tag 01A2Eh 15h 01A2Eh 15h
Random number length 01A2Fh 10h 01A2Fh 10h
128-bit random number(4) 01A30h Per unit 01A30h Per unit
01A31h Per unit 01A31h Per unit
01A32h Per unit 01A32h Per unit
01A33h Per unit 01A33h Per unit
01A34h Per unit 01A34h Per unit
01A35h Per unit 01A35h Per unit
01A36h Per unit 01A36h Per unit
01A37h Per unit 01A37h Per unit
01A38h Per unit 01A38h Per unit
01A39h Per unit 01A39h Per unit
01A3Ah Per unit 01A3Ah Per unit
01A3Bh Per unit 01A3Bh Per unit
01A3Ch Per unit 01A3Ch Per unit
01A3Dh Per unit 01A3Dh Per unit
01A3Eh Per unit 01A3Eh Per unit
01A3Fh Per unit 01A3Fh Per unit
BSL Configuration BSL tag 01A40h 1Ch 01A40h 1Ch
BSL length 01A41h 02h 01A41h 02h
BSL interface 01A42h 00h 01A42h 01h
BSL interface configuration 01A43h 00h 01A43h 48h
(1) NA = Not applicable, Per unit = content can differ from device to device
(2) ADC gain: The gain correction factor is measured using the internal voltage reference with REFOUT = 0. Other settings (for example, with REFOUT = 1) can result in different correction factors.
(3) ADC offset: The offset correction factor is measured using the internal 2.5-V reference.
(4) 128-bit random number: The random number is generated during production test using the CryptGenRandom() function from Microsoft®.