SLAS734G April   2011  – April 2016 MSP430G2203 , MSP430G2233 , MSP430G2303 , MSP430G2333 , MSP430G2403 , MSP430G2433 , MSP430G2533

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagrams
  2. 2Revision History
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagrams
    2. 4.2 Signal Descriptions
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Active Mode Supply Current Into VCC Excluding External Current
    5. 5.5  Typical Characteristics, Active Mode Supply Current (Into VCC)
    6. 5.6  Low-Power Mode Supply Currents (Into VCC) Excluding External Current
    7. 5.7  Typical Characteristics, Low-Power Mode Supply Currents
    8. 5.8  Thermal Resistance Characteristics
    9. 5.9  Schmitt-Trigger Inputs, Ports Px
    10. 5.10 Leakage Current, Ports Px
    11. 5.11 Outputs, Ports Px
    12. 5.12 Output Frequency, Ports Px
    13. 5.13 Typical Characteristics - Outputs
    14. 5.14 Pin-Oscillator Frequency - Ports Px
    15. 5.15 Typical Characteristics - Pin-Oscillator Frequency
    16. 5.16 POR, BOR
    17. 5.17 Main DCO Characteristics
    18. 5.18 DCO Frequency
    19. 5.19 Calibrated DCO Frequencies, Tolerance
    20. 5.20 Wake-up Times From Lower-Power Modes (LPM3, LPM4)
    21. 5.21 Typical Characteristics, DCO Clock Wake-up Time From LPM3 or LPM4
    22. 5.22 Crystal Oscillator, XT1, Low-Frequency Mode
    23. 5.23 Internal Very-Low-Power Low-Frequency Oscillator (VLO)
    24. 5.24 Timer_A
    25. 5.25 USCI (UART Mode)
    26. 5.26 USCI (SPI Master Mode)
    27. 5.27 USCI (SPI Slave Mode)
    28. 5.28 USCI (I2C Mode)
    29. 5.29 10-Bit ADC, Power Supply and Input Range Conditions (MSP430G2x33 Only)
    30. 5.30 10-Bit ADC, Built-In Voltage Reference (MSP430G2x33 Only)
    31. 5.31 10-Bit ADC, External Reference (MSP430G2x33 Only)
    32. 5.32 10-Bit ADC, Timing Parameters (MSP430G2x33 Only)
    33. 5.33 10-Bit ADC, Linearity Parameters (MSP430G2x33 Only)
    34. 5.34 10-Bit ADC, Temperature Sensor and Built-In VMID (MSP430G2x33 Only)
    35. 5.35 Flash Memory
    36. 5.36 RAM
    37. 5.37 JTAG and Spy-Bi-Wire Interface
    38. 5.38 JTAG Fuse
  6. 6Detailed Description
    1. 6.1  CPU
    2. 6.2  Instruction Set
    3. 6.3  Operating Modes
    4. 6.4  Interrupt Vector Addresses
    5. 6.5  Special Function Registers (SFRs)
    6. 6.6  Memory Organization
    7. 6.7  Bootloader (BSL)
    8. 6.8  Flash Memory
    9. 6.9  Peripherals
      1. 6.9.1 Oscillator and System Clock
      2. 6.9.2 Calibration Data Stored in Information Memory Segment A
      3. 6.9.3 Brownout
      4. 6.9.4 Digital I/O
      5. 6.9.5 WDT+ Watchdog Timer
      6. 6.9.6 Timer_A3 (TA0, TA1)
      7. 6.9.7 Universal Serial Communications Interface (USCI)
      8. 6.9.8 ADC10 (MSP430G2x33 Only)
      9. 6.9.9 Peripheral File Map
    10. 6.10 I/O Port Diagrams
      1. 6.10.1 Port P1 Pin Diagram: P1.0 to P1.2, Input/Output With Schmitt Trigger
      2. 6.10.2 Port P1 Pin Diagram: P1.3, Input/Output With Schmitt Trigger
      3. 6.10.3 Port P1 Pin Diagram: P1.4, Input/Output With Schmitt Trigger
      4. 6.10.4 Port P1 Pin Diagram: P1.5 to P1.7, Input/Output With Schmitt Trigger
      5. 6.10.5 Port P2 Pin Diagram: P2.0 to P2.5, Input/Output With Schmitt Trigger
      6. 6.10.6 Port P2 Pin Diagram: P2.6, Input/Output With Schmitt Trigger
      7. 6.10.7 Port P2 Pin Diagram: P2.7, Input/Output With Schmitt Trigger
      8. 6.10.8 Port P3 Pin Diagram: P3.0 to P3.7, Input/Output With Schmitt Trigger (RHB and PW28 Package Only)
  7. 7Device and Documentation Support
    1. 7.1 Getting Started and Next Steps
    2. 7.2 Device Nomenclature
    3. 7.3 Tools and Software
    4. 7.4 Documentation Support
    5. 7.5 Related Links
    6. 7.6 Community Resources
    7. 7.7 Trademarks
    8. 7.8 Electrostatic Discharge Caution
    9. 7.9 Glossary
  8. 8Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Device Comparison

Table 3-1 compares the available family members.

Table 3-1 Device Comparison(1)(2)

DEVICE BSL EEM FLASH
(KB)		 RAM
(B)		 Timer_A ADC10 CHANNELS USCI_A0, USCI_B0 CLOCK I/O PACKAGE
MSP430G2533 1 1 16 512 2x TA3 8 1 LF, DCO, VLO 24 32-QFN
24 28-TSSOP
16 20-TSSOP
16 20-PDIP
MSP430G2433 1 1 8 512 2x TA3 8 1 LF, DCO, VLO 24 32-QFN
24 28-TSSOP
16 20-TSSOP
16 20-PDIP
MSP430G2333 1 1 4 256 2x TA3 8 1 LF, DCO, VLO 24 32-QFN
24 28-TSSOP
16 20-TSSOP
16 20-PDIP
MSP430G2233 1 1 2 256 2x TA3 8 1 LF, DCO, VLO 24 32-QFN
24 28-TSSOP
16 20-TSSOP
16 20-PDIP
MSP430G2403 1 1 8 512 2x TA3 – 1 LF, DCO, VLO 24 32-QFN
24 28-TSSOP
16 20-TSSOP
16 20-PDIP
MSP430G2303 1 1 4 256 2x TA3 – 1 LF, DCO, VLO 24 32-QFN
24 28-TSSOP
16 20-TSSOP
16 20-PDIP
MSP430G2203 1 1 2 256 2x TA3 – 1 LF, DCO, VLO 24 32-QFN
24 28-TSSOP
16 20-TSSOP
16 20-PDIP
(1) For the most current device, package, and ordering information, see the Package Option Addendum in Section 8, or see the TI website at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

For information about other devices in this family of products or related products, see the following links.

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    Products for MSP430G2x/i2x Low-Cost Industrial MCUs MSP430G2x microcontrollers (MCUs) from the MSP ultra-low-power MCU series, offers the low power and performance of 16-bit MSP microcontrollers with a feature set targeted at cost sensitive applications.
    Reference Designs for MSP430G2533 TI Designs Reference Design Library is a robust reference design library that spans analog, embedded processor, and connectivity. Created by TI experts to help you jump start your system design, all TI Designs include schematic or block diagrams, BOMs, and design files to speed your time to market. Search and download designs at ti.com/tidesigns.