SLASEN5 October   2017 MSP432E401Y

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Device Characteristics
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagram
    2. 4.2 Pin Attributes
    3. 4.3 Signal Descriptions
    4. 4.4 GPIO Pin Multiplexing
    5. 4.5 Buffer Type
    6. 4.6 Connections for Unused Pins
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Recommended DC Operating Conditions
    5. 5.5  Recommended GPIO Operating Characteristics
    6. 5.6  Recommended Fast GPIO Pad Operating Conditions
    7. 5.7  Recommended Slow GPIO Pad Operating Conditions
    8. 5.8  GPIO Current Restrictions
    9. 5.9  I/O Reliability
    10. 5.10 Current Consumption
    11. 5.11 Peripheral Current Consumption
    12. 5.12 LDO Regulator Characteristics
    13. 5.13 Power Dissipation
    14. 5.14 Thermal Resistance Characteristics, 128-Pin PDT (TQFP) Package
    15. 5.15 Timing and Switching Characteristics
      1. 5.15.1  Load Conditions
      2. 5.15.2  Power Supply Sequencing
        1. 5.15.2.1 Power and Brownout
          1. 5.15.2.1.1 VDDA Levels
          2. 5.15.2.1.2 VDD Levels
          3. 5.15.2.1.3 VDDC Levels
          4. 5.15.2.1.4 VDD Glitch Response
          5. 5.15.2.1.5 VDD Droop Response
      3. 5.15.3  Reset Timing
      4. 5.15.4  Clock Specifications
        1. 5.15.4.1 PLL Specifications
          1. 5.15.4.1.1 PLL Configuration
        2. 5.15.4.2 PIOSC Specifications
        3. 5.15.4.3 Low-Frequency Oscillator Specifications
        4. 5.15.4.4 Hibernation Low-Frequency Oscillator Specifications
        5. 5.15.4.5 Main Oscillator Specifications
        6. 5.15.4.6 Main Oscillator Specification WIth ADC
        7. 5.15.4.7 System Clock Characteristics With USB Operation
      5. 5.15.5  Sleep Modes
      6. 5.15.6  Hibernation Module
      7. 5.15.7  Flash Memory
      8. 5.15.8  EEPROM
      9. 5.15.9  Input/Output Pin Characteristics
        1. 5.15.9.1 Types of I/O Pins and ESD Protection
          1. 5.15.9.1.1 Hibernate WAKE pin
          2. 5.15.9.1.2 Nonpower I/O Pins
      10. 5.15.10 External Peripheral Interface (EPI)
      11. 5.15.11 Analog-to-Digital Converter (ADC)
      12. 5.15.12 Synchronous Serial Interface (SSI)
      13. 5.15.13 Inter-Integrated Circuit (I2C) Interface
      14. 5.15.14 Ethernet Controller
        1. 5.15.14.1 DC Characteristics
        2. 5.15.14.2 Clock Characteristics for Ethernet
        3. 5.15.14.3 AC Characteristics
      15. 5.15.15 Universal Serial Bus (USB) Controller
      16. 5.15.16 Analog Comparator
      17. 5.15.17 Pulse-Width Modulator (PWM)
      18. 5.15.18 Emulation and Debug
  6. 6Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Arm Cortex-M4F Processor Core
      1. 6.3.1 Processor Core
      2. 6.3.2 System Timer (SysTick)
      3. 6.3.3 Nested Vectored Interrupt Controller (NVIC)
      4. 6.3.4 System Control Block (SCB)
      5. 6.3.5 Memory Protection Unit (MPU)
      6. 6.3.6 Floating-Point Unit (FPU)
    4. 6.4 On-Chip Memory
      1. 6.4.1 SRAM
      2. 6.4.2 Flash Memory
      3. 6.4.3 ROM
      4. 6.4.4 EEPROM
      5. 6.4.5 Memory Map
    5. 6.5 Peripherals
      1. 6.5.1  External Peripheral Interface (EPI)
      2. 6.5.2  Cyclical Redundancy Check (CRC)
      3. 6.5.3  Advanced Encryption Standard (AES) Accelerator
      4. 6.5.4  Data Encryption Standard (DES) Accelerator
      5. 6.5.5  Secure Hash Algorithm/Message Digest Algorithm (SHA/MD5) Accelerator
      6. 6.5.6  Serial Communications Peripherals
        1. 6.5.6.1 Ethernet MAC and PHY
        2. 6.5.6.2 Controller Area Network (CAN)
        3. 6.5.6.3 Universal Serial Bus (USB)
        4. 6.5.6.4 Universal Asynchronous Receiver/Transmitter (UART)
        5. 6.5.6.5 Inter-Integrated Circuit (I2C)
        6. 6.5.6.6 Quad Synchronous Serial Interface (QSSI)
      7. 6.5.7  System Integration
        1. 6.5.7.1 Direct Memory Access (DMA)
        2. 6.5.7.2 System Control and Clocks
        3. 6.5.7.3 Programmable Timers
        4. 6.5.7.4 Capture Compare PWM (CCP) Pins
        5. 6.5.7.5 Hibernation (HIB) Module
        6. 6.5.7.6 Watchdog Timers
        7. 6.5.7.7 Programmable GPIOs
      8. 6.5.8  Advanced Motion Control
        1. 6.5.8.1 Pulse Width Modulation (PWM)
        2. 6.5.8.2 Quadrature Encoder With Index (QEI) Module
      9. 6.5.9  Analog
        1. 6.5.9.1 ADC
        2. 6.5.9.2 Analog Comparators
      10. 6.5.10 JTAG and Arm Serial Wire Debug
      11. 6.5.11 Peripheral Memory Map
    6. 6.6 Identification
    7. 6.7 Boot Modes
  7. 7Applications, Implementation, and Layout
    1. 7.1 System Design Guidelines
  8. 8Device and Documentation Support
    1. 8.1 Getting Started and Next Steps
    2. 8.2 Device Nomenclature
    3. 8.3 Tools and Software
    4. 8.4 Documentation Support
    5. 8.5 Community Resources
    6. 8.6 Trademarks
    7. 8.7 Electrostatic Discharge Caution
    8. 8.8 Export Control Notice
    9. 8.9 Glossary
  9. 9Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8 Device and Documentation Support

8.1 Getting Started and Next Steps

TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device, generate code, and develop solutions follow.

8.2 Device Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all microprocessors (MPUs) and support tools. Each device has one of three prefixes: XMS, PMS, or MSP. These prefixes represent evolutionary stages of product development from engineering prototypes through fully qualified production devices and tools.

Device development evolutionary flow:

    XMS Experimental device that is not necessarily representative of the final device's electrical specifications and may not use production assembly flow.
    PMS Prototype device that is not necessarily the final silicon die and may not necessarily meet final electrical specifications.
    MSPProduction version of the silicon die that is fully qualified.

Experimental devices and tools are shipped against the following disclaimer:

"Developmental product is intended for internal evaluation purposes."

Production devices and development-support tools have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies.

Predictions show that prototype devices have a greater failure rate than the standard production devices. TI recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.

TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type (for example, ZAD) and the temperature range (for example, blank is the default commercial temperature range). Figure 8-1 shows a legend for reading the complete device name for the device.

For orderable part numbers of the device, see the Package Option Addendum of this document, ti.com, or contact your TI sales representative.

For additional description of the device nomenclature markings on the die, see the device-specific silicon errata.

MSP432E401Y device-nomenclature-msp432e.gif Figure 8-1 Device Nomenclature

8.3 Tools and Software

Design Kits and Evaluation Modules

    MSP432E401Y SimpleLink Microcontroller LaunchPad Development Kit The SimpleLink Ethernet MSP432E401Y microcontroller LaunchPad development kit is a low-cost evaluation platform for SimpleLink Arm Cortex-M4F-based Ethernet microcontrollers. The Ethernet LaunchPad development kit design highlights the MSP432E401Y microcontroller with its on-chip 10/100 Ethernet MAC and PHY, USB 2.0, hibernation module, motion control pulse-width modulation, and a multitude of simultaneous serial connectivity.

Software

    SimpleLink MSP432E4 Software Development Kit (SDK) The MSP432E4 SDK is a comprehensive software package that enables engineers to quickly develop highly functional applications on Texas Instruments MSP432E4 MCUs. The MSP432E4 SDK is composed of multiple compatible software components including RTOS, drivers, and middleware as well as examples of how to use these components together. In addition, examples are provided to demonstrate the use of each functional area and each supported device and as a starting point for your own projects.

Development Tools

    Arm® Keil® MDK – Free 32KB IDE The Arm Keil MDK is a complete debugger and C/C++ compiler toolchain for building and debugging embedded applications. Keil MDK supports the low-power and high-performance SimpleLink MSP432 MCU family, and includes a fully integrated debugger for source and disassembly level debugging with support for complex code and data breakpoint. For this IDE, only non-RTOS examples are supported in the SimpleLink MSP432 Software Development Kit (SDK). For more information, see the Arm® Keil® MDK for SimpleLink™ MSP432™ Microcontrollers User's Guide.
    MSP432E CMSIS Device Family Pack TI provides a CMSIS-compliant device family pack for MSP432E devices. This pack adds MSP432E device support to IAR EWArm 8.x, Keil MDK 5.x, and Atollic True Studio 7.x. In IAR EWArm, this pack is optional as the IDE supports the devices natively.
    Debuggers for MSP432 SimpleLink MSP432E MCUs are designed to work with a variety of debuggers from TI and third party vendors. MSP-FET does not support the MSP432E device family.

8.4 Documentation Support

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper-right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

The following documentation describes the MCU, related peripherals, and other technical collateral.

Errata

Application Reports

    System Design Guidelines for SimpleLink™ MSP432E4 Microcontrollers The SimpleLink MSP432E4 microcontrollers are highly-integrated system-on-chip (SOC) devices with extensive interface and processing capabilities. Consequently, there are many factors to consider when creating a schematic and designing a circuit board. By following the recommendations in this design guide, you will increase your confidence that the board will work successfully the first time it is powered it up.
    Using Feature Set of I2C Master on SimpleLink MSP432E4 Microcontrollers The inter-integrated circuit (I2C) is a multiple-master, multiple-slave, single-ended bus that is typically used for attaching lower-speed peripheral ICs to processors and microcontrollers. The type of slave devices range from nonvolatile memory to data-acquisition devices like analog-to-digital converters (ADC), sensors, and so forth. This application report demonstrates how to use the feature rich I2C master on the SimpleLink MSP432E4 microcontrollers to communicate with a host of slave devices in a system.
    Using SimpleLink MSP432E4 Microcontrollers Over JTAG Interface The IEEE Standard 1149.1-1990, IEEE Standard Test Access Port and Boundary-Scan Architecture (JTAG) is a method for verifying designs and testing printed circuit boards after assembly. It is used as the primary means for transferring data to a nonvolatile memory of an embedded system and debugging embedded software. This application report describes the physical connections for JTAG and design considerations to be taken into account for a custom board. It also shows how to use the JTAG interface on the SimpleLink MSP432E4 LaunchPad development kit for debugging the onboard microcontroller using an external debugger, or by using the onboard debugger for debugging an off-board microcontroller.

User's Guides

    Bootloader for MSP432E4 SimpleLink™ Microcontrollers User's Guide The bootloader is a small piece of code that can be programmed at the beginning of flash to act as an application loader as well as an update mechanism for applications running on a SimpleLink MSP432E4 Arm Cortex-M4-based microcontroller. The bootloader can be built to use the UART, SSI, I2C, CAN, Ethernet, or USB ports to update the code on the microcontroller. The bootloader is customizable through source code modifications, or simply deciding at compile time which routines to include. Because full source code is provided, the bootloader can be completely customized

8.5 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community The TI engineer-to-engineer (E2E) community was created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    TI Embedded Processors Wiki Established to help developers get started with Embedded Processors from Texas Instruments and to foster innovation and growth of general knowledge about the hardware and software surrounding these devices.

8.6 Trademarks

SimpleLink, LaunchPad, MSP432, E2E are trademarks of Texas Instruments.

Arm, Cortex, Thumb, Thumb-2, PrimeCell, Arm7 are registered trademarks of Arm Limited.

Bluetooth is a registered trademark of Bluetooth SIG.

Wi-Fi is a registered trademark of Wi-Fi Alliance.

All other trademarks are the property of their respective owners.

8.7 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

8.8 Export Control Notice

Recipient agrees to not knowingly export or re-export, directly or indirectly, any product or technical data (as defined by the U.S., EU, and other Export Administration Regulations) including software, or any controlled product restricted by other applicable national regulations, received from disclosing party under nondisclosure obligations (if any), or any direct product of such technology, to any destination to which such export or re-export is restricted or prohibited by U.S. or other applicable laws, without obtaining prior authorization from U.S. Department of Commerce and other competent Government authorities to the extent required by those laws.

8.9 Glossary

    TI Glossary This glossary lists and explains terms, acronyms, and definitions.