SLASF93A October   2023  – July 2024 MSPM0C1103-Q1 , MSPM0C1104-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Diagrams
    2. 6.2 Pin Attributes
    3. 6.3 Signal Descriptions
    4. 6.4 Connections for Unused Pins
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Supply Current Characteristics
      1. 7.5.1 RUN/SLEEP Modes
      2. 7.5.2 STOP/STANDBY Modes
      3. 7.5.3 SHUTDOWN Mode
    6. 7.6  Power Supply Sequencing
      1. 7.6.1 POR and BOR
      2. 7.6.2 Power Supply Ramp
    7. 7.7  Flash Memory Characteristics
    8. 7.8  Timing Characteristics
    9. 7.9  Clock Specifications
      1. 7.9.1 System Oscillator (SYSOSC)
      2. 7.9.2 Low Frequency Oscillator (LFOSC)
    10. 7.10 Digital IO
      1. 7.10.1  Electrical Characteristics
      2. 7.10.2 Switching Characteristics
    11. 7.11 ADC
      1. 7.11.1 Electrical Characteristics
      2. 7.11.2 Switching Characteristics
      3. 7.11.3 Linearity Parameters
      4. 7.11.4 Typical Connection Diagram
    12. 7.12 Temperature Sensor
    13. 7.13 VREF
      1. 7.13.1 Voltage Characteristics
      2. 7.13.2 Electrical Characteristics
    14. 7.14 I2C
      1. 7.14.1 I2C Characteristics
      2. 7.14.2 I2C Filter
      3. 7.14.3 I2C Timing Diagram
    15. 7.15 SPI
      1. 7.15.1 SPI
      2. 7.15.2 SPI Timing Diagrams
    16. 7.16 UART
    17. 7.17 TIMx
    18. 7.18 Windowed Watchdog Characteristics
    19. 7.19 Emulation and Debug
      1. 7.19.1 SWD Timing
  9. 8 Detailed Description
    1. 8.1  CPU
    2. 8.2  Operating Modes
      1. 8.2.1 Functionality by Operating Mode (MSPM0C110x)
    3. 8.3  Power Management Unit (PMU)
    4. 8.4  Clock Module (CKM)
    5. 8.5  DMA
    6. 8.6  Events
    7. 8.7  Memory
      1. 8.7.1 Memory Organization
      2. 8.7.2 Peripheral File Map
      3. 8.7.3 Peripheral Interrupt Vector
    8. 8.8  Flash Memory
    9. 8.9  SRAM
    10. 8.10 GPIO
    11. 8.11 IOMUX
    12. 8.12 ADC
    13. 8.13 Temperature Sensor
    14. 8.14 VREF
    15. 8.15 CRC
    16. 8.16 UART
    17. 8.17 SPI
    18. 8.18 I2C
    19. 8.19 WWDT
    20. 8.20 Timers (TIMx)
    21. 8.21 Device Analog Connections
    22. 8.22 Input/Output Diagrams
    23. 8.23 Serial Wire Debug Interface
    24. 8.24 Device Factory Constants
    25. 8.25 Identification
  10. 9 Applications, Implementation, and Layout
    1. 9.1 Typical Application
      1. 9.1.1 Schematic
  11. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
    2. 10.2 Tools and Software
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Thermal Information

THERMAL METRIC(1) PACKAGE VALUE UNIT
RθJA Junction-to-ambient thermal resistance VSSOP-20 (DGS20) 91.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 29.3 °C/W
RθJB Junction-to-board thermal resistance 48.3 °C/W
ΨJT Junction-to-top characterization parameter 0.7 °C/W
ΨJB Junction-to-board characterization parameter 47.9 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
RθJA Junction-to-ambient thermal resistance WQFN-20 (RUK) 52.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 55.5 °C/W
RθJB Junction-to-board thermal resistance 26.4 °C/W
ΨJT Junction-to-top characterization parameter 2.1 °C/W
ΨJB Junction-to-board characterization parameter 26.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 12.0 °C/W
RθJA Junction-to-ambient thermal resistance SOT-16 (DYY) 117.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 54.5 °C/W
RθJB Junction-to-board thermal resistance 54.6 °C/W
ΨJT Junction-to-top characterization parameter 3.0 °C/W
ΨJB Junction-to-board characterization parameter 54.5 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
RθJA Junction-to-ambient thermal resistance SOT-8 (DDF) 142.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 65.7 °C/W
RθJB Junction-to-board thermal resistance 62.7 °C/W
ΨJT Junction-to-top characterization parameter 3.2 °C/W
ΨJB Junction-to-board characterization parameter 62.5 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
RθJA Junction-to-ambient thermal resistance WSON-8 (DSG) 70.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 85.6 °C/W
RθJB Junction-to-board thermal resistance 37.5 °C/W
ΨJT Junction-to-top characterization parameter 2.7 °C/W
ΨJB Junction-to-board characterization parameter 37.5 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 12.8 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.