SLASF93A
October 2023 – July 2024
MSPM0C1103-Q1
,
MSPM0C1104-Q1
PRODUCTION DATA
1
1
Features
2
Applications
3
Description
4
Functional Block Diagram
5
Device Comparison
6
Pin Configuration and Functions
6.1
Pin Diagrams
6.2
Pin Attributes
6.3
Signal Descriptions
6.4
Connections for Unused Pins
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
Thermal Information
7.5
Supply Current Characteristics
7.5.1
RUN/SLEEP Modes
7.5.2
STOP/STANDBY Modes
7.5.3
SHUTDOWN Mode
7.6
Power Supply Sequencing
7.6.1
POR and BOR
7.6.2
Power Supply Ramp
7.7
Flash Memory Characteristics
7.8
Timing Characteristics
7.9
Clock Specifications
7.9.1
System Oscillator (SYSOSC)
7.9.2
Low Frequency Oscillator (LFOSC)
7.10
Digital IO
7.10.1
Electrical Characteristics
7.10.2
Switching Characteristics
7.11
ADC
7.11.1
Electrical Characteristics
7.11.2
Switching Characteristics
7.11.3
Linearity Parameters
7.11.4
Typical Connection Diagram
7.12
Temperature Sensor
7.13
VREF
7.13.1
Voltage Characteristics
7.13.2
Electrical Characteristics
7.14
I2C
7.14.1
I2C Characteristics
7.14.2
I2C Filter
7.14.3
I2C Timing Diagram
7.15
SPI
7.15.1
SPI
7.15.2
SPI Timing Diagrams
7.16
UART
7.17
TIMx
7.18
Windowed Watchdog Characteristics
7.19
Emulation and Debug
7.19.1
SWD Timing
8
Detailed Description
8.1
CPU
8.2
Operating Modes
8.2.1
Functionality by Operating Mode (MSPM0C110x)
8.3
Power Management Unit (PMU)
8.4
Clock Module (CKM)
8.5
DMA
8.6
Events
8.7
Memory
8.7.1
Memory Organization
8.7.2
Peripheral File Map
8.7.3
Peripheral Interrupt Vector
8.8
Flash Memory
8.9
SRAM
8.10
GPIO
8.11
IOMUX
8.12
ADC
8.13
Temperature Sensor
8.14
VREF
8.15
CRC
8.16
UART
8.17
SPI
8.18
I2C
8.19
WWDT
8.20
Timers (TIMx)
8.21
Device Analog Connections
8.22
Input/Output Diagrams
8.23
Serial Wire Debug Interface
8.24
Device Factory Constants
8.25
Identification
9
Applications, Implementation, and Layout
9.1
Typical Application
9.1.1
Schematic
10
Device and Documentation Support
10.1
Device Nomenclature
10.2
Tools and Software
10.3
Support Resources
10.4
Trademarks
10.5
Electrostatic Discharge Caution
10.6
Glossary
11
Revision History
12
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
DYY|16
MPSS115C
DDF|8
MPDS569D
RUK|20
MPQF220D
Thermal pad, mechanical data (Package|Pins)
Orderable Information
slasf93a_oa
7.19
Emulation and Debug