SLASF90B October   2023  – May 2024 MSPM0C1103 , MSPM0C1104

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Diagrams
    2. 6.2 Pin Attributes
    3. 6.3 Signal Descriptions
    4. 6.4 Connections for Unused Pins
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Supply Current Characteristics
      1. 7.5.1 RUN/SLEEP Modes
      2. 7.5.2 STOP/STANDBY Modes
      3. 7.5.3 SHUTDOWN Mode
    6. 7.6  Power Supply Sequencing
      1. 7.6.1 POR and BOR
      2. 7.6.2 Power Supply Ramp
    7. 7.7  Flash Memory Characteristics
    8. 7.8  Timing Characteristics
    9. 7.9  Clock Specifications
      1. 7.9.1 System Oscillator (SYSOSC)
      2. 7.9.2 Low Frequency Oscillator (LFOSC)
    10. 7.10 Digital IO
      1. 7.10.1  Electrical Characteristics
      2. 7.10.2 Switching Characteristics
    11. 7.11 ADC
      1. 7.11.1 Electrical Characteristics
      2. 7.11.2 Switching Characteristics
      3. 7.11.3 Linearity Parameters
      4. 7.11.4 Typical Connection Diagram
    12. 7.12 Temperature Sensor
    13. 7.13 VREF
      1. 7.13.1 Voltage Characteristics
      2. 7.13.2 Electrical Characteristics
    14. 7.14 I2C
      1. 7.14.1 I2C Characteristics
      2. 7.14.2 I2C Filter
      3. 7.14.3 I2C Timing Diagram
    15. 7.15 SPI
      1. 7.15.1 SPI
      2. 7.15.2 SPI Timing Diagrams
    16. 7.16 UART
    17. 7.17 TIMx
    18. 7.18 Windowed Watchdog Characteristics
    19. 7.19 Emulation and Debug
      1. 7.19.1 SWD Timing
  9. 8 Detailed Description
    1. 8.1  CPU
    2. 8.2  Operating Modes
      1. 8.2.1 Functionality by Operating Mode (MSPM0C110x)
    3. 8.3  Power Management Unit (PMU)
    4. 8.4  Clock Module (CKM)
    5. 8.5  DMA
    6. 8.6  Events
    7. 8.7  Memory
      1. 8.7.1 Memory Organization
      2. 8.7.2 Peripheral File Map
      3. 8.7.3 Peripheral Interrupt Vector
    8. 8.8  Flash Memory
    9. 8.9  SRAM
    10. 8.10 GPIO
    11. 8.11 IOMUX
    12. 8.12 ADC
    13. 8.13 Temperature Sensor
    14. 8.14 VREF
    15. 8.15 CRC
    16. 8.16 UART
    17. 8.17 SPI
    18. 8.18 I2C
    19. 8.19 WWDT
    20. 8.20 Timers (TIMx)
    21. 8.21 Device Analog Connections
    22. 8.22 Input/Output Diagrams
    23. 8.23 Serial Wire Debug Interface
    24. 8.24 Device Factory Constants
    25. 8.25 Identification
  10. 9 Applications, Implementation, and Layout
    1. 9.1 Typical Application
      1. 9.1.1 Schematic
  11. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
    2. 10.2 Tools and Software
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DYY|16
  • DDF|8
  • RUK|20
  • DGS|20
  • DSG|8
  • PW|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Device Comparison

Table 5-1 Device Comparison
DEVICE NAME (1)(3) FLASH / SRAM (KB) ADC CHANNELS UART / I2C / SPI TIMG TIMA GPIOs 5V TOLERANT IO PACKAGE
[PACKAGE SIZE](2)
MSPS003F4SPW20R 16 / 1 9 1 / 1 / 1 2 1 17 2 20 TSSOP
[6.5mm × 5.0mm]
MSPS003F3SPW20R 8 / 1
MSPM0C1104SDGS20R 16 / 1 10 1 / 1 / 1 2 1 18 2 20 VSSOP
[5.1mm × 4.9mm]
MSPM0C1103SDGS20R 8 / 1
MSPM0C1104SRUKR 16/ 1 10 1 / 1 / 1 2 1 18 2 20 WQFN
[3mm × 3mm]
MSPM0C1103SRUKR 8 / 1
MSPM0C1104SDYYR 16 /1 8 1 / 1 / 1 2 1 14 2 16 SOT
[4.2mm × 3.26mm]
MSPM0C1103SDYYR 8 / 1
MSPM0C1104SDSGR 16 / 1 3 1 / 1 / 1 2 1 6 2 8 WSON
[2mm × 2mm]
MSPM0C1103SDSGR 8 / 1
MSPM0C1104SDDFR 16 / 1 3 1 / 1 / 1 2 1 6 2 8 SOT
[2.9mm × 2.8mm]
MSPM0C1103SDDFR 8 / 1
(1) For the most current part, package, and ordering information for all available devices, see the Package Option Addendum in Section 12, or see the TI web site.
(2) The package size (length × width) is a nominal value and includes pins, where applicable. For package dimensions with tolerances, see the Mechanical Data in Section 12.
(3) For more information about the device name, see Section 10.1.