SLASEW9C February   2023  – October 2023 MSPM0G1505 , MSPM0G1506 , MSPM0G1507

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Diagrams
    2. 6.2 Pin Attributes
    3. 6.3 Signal Descriptions
    4. 6.4 Connections for Unused Pins
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Supply Current Characteristics
      1. 7.5.1 RUN/SLEEP Modes
      2. 7.5.2 STOP/STANDBY Modes
      3. 7.5.3 SHUTDOWN Mode
    6. 7.6  Power Supply Sequencing
      1. 7.6.1 POR and BOR
      2. 7.6.2 Power Supply Ramp
    7. 7.7  Flash Memory Characteristics
    8. 7.8  Timing Characteristics
    9. 7.9  Clock Specifications
      1. 7.9.1 System Oscillator (SYSOSC)
        1. 7.9.1.1 SYSOSC Typical Frequency Accuracy
      2. 7.9.2 Low Frequency Oscillator (LFOSC)
      3. 7.9.3 System Phase Lock Loop (SYSPLL)
      4. 7.9.4 Low Frequency Crystal/Clock
      5. 7.9.5 High Frequency Crystal/Clock
    10. 7.10 Digital IO
      1. 7.10.1 Electrical Characteristics
      2. 7.10.2 Switching Characteristics
    11. 7.11 Analog Mux VBOOST
    12. 7.12 ADC
      1. 7.12.1 Electrical Characteristics
      2. 7.12.2 Switching Characteristics
      3. 7.12.3 Linearity Parameters
      4. 7.12.4 Typical Connection Diagram
    13. 7.13 Temperature Sensor
    14. 7.14 VREF
      1. 7.14.1 Voltage Characteristics
      2. 7.14.2 Electrical Characteristics
    15. 7.15 Comparator (COMP)
      1. 7.15.1 Comparator Electrical Characteristics
    16. 7.16 DAC
      1. 7.16.1 DAC_Supply Specifications
      2. 7.16.2 DAC Output Specifications
      3. 7.16.3 DAC Dynamic Specifications
      4. 7.16.4 DAC Linearity Specifications
      5. 7.16.5 DAC Timing Specifications
    17. 7.17 GPAMP
      1. 7.17.1 Electrical Characteristics
      2. 7.17.2 Switching Characteristics
    18. 7.18 OPA
      1. 7.18.1 Electrical Characteristics
      2. 7.18.2 Switching Characteristics
      3. 7.18.3 PGA Mode
    19. 7.19 I2C
      1. 7.19.1 I2C Characteristics
      2. 7.19.2 I2C Filter
      3. 7.19.3 I2C Timing Diagram
    20. 7.20 SPI
      1. 7.20.1 SPI
      2. 7.20.2 SPI Timing Diagram
    21. 7.21 UART
    22. 7.22 TIMx
    23. 7.23 TRNG
      1. 7.23.1 TRNG Electrical Characteristics
      2. 7.23.2 TRNG Switching Characteristics
    24. 7.24 Emulation and Debug
      1. 7.24.1 SWD Timing
  9. 8 Detailed Description
    1. 8.1  CPU
    2. 8.2  Operating Modes
      1. 8.2.1 Functionality by Operating Mode (MSPM0G150x)
    3. 8.3  Power Management Unit (PMU)
    4. 8.4  Clock Module (CKM)
    5. 8.5  DMA
    6. 8.6  Events
    7. 8.7  Memory
      1. 8.7.1 Memory Organization
      2. 8.7.2 Peripheral File Map
      3. 8.7.3 Peripheral Interrupt Vector
    8. 8.8  Flash Memory
    9. 8.9  SRAM
    10. 8.10 GPIO
    11. 8.11 IOMUX
    12. 8.12 ADC
    13. 8.13 Temperature Sensor
    14. 8.14 VREF
    15. 8.15 COMP
    16. 8.16 DAC
    17. 8.17 OPA
    18. 8.18 GPAMP
    19. 8.19 TRNG
    20. 8.20 AES
    21. 8.21 CRC
    22. 8.22 UART
    23. 8.23 I2C
    24. 8.24 SPI
    25. 8.25 WWDT
    26. 8.26 RTC
    27. 8.27 Timers (TIMx)
    28. 8.28 Device Analog Connections
    29. 8.29 Input/Output Diagrams
    30. 8.30 Serial Wire Debug Interface
    31. 8.31 Bootstrap Loader (BSL)
    32. 8.32 Device Factory Constants
    33. 8.33 Identification
  10. 9 Applications, Implementation, and Layout
    1. 9.1 Typical Application
      1. 9.1.1 Schematic
  11. 10Device and Documentation Support
    1. 10.1 Getting Started and Next Steps
    2. 10.2 Device Nomenclature
    3. 10.3 Tools and Software
    4. 10.4 Documentation Support
    5. 10.5 Support Resources
    6. 10.6 Trademarks
    7. 10.7 Electrostatic Discharge Caution
    8. 10.8 Glossary
  12. 11Mechanical, Packaging, and Orderable Information
  13. 12Revision History

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Device Comparison

The following table summarizes the features of each device that is described in this data sheet.

Table 5-1 Device Comparison
DEVICE NAME(1)(4) FLASH /SRAM (KB) QUAL(2) MATH ACCEL ADC / CHAN COMP DAC OPA GPAMP UART / I2C / SPI TIMA TIMG GPIO PACKAGE [PACKAGE SIZE] (3)
MSPM0G1505xPM 32 / 16 S Y 2 / 17 3 1 2 1 4 / 2 / 2 2 5 60 64 LQFP
[12 mm × 12 mm]
MSPM0G1506xPM 64 / 32
MSPM0G1507xPM 128 / 32
MSPM0G1505xPT 32 / 16 S Y 2 / 16 3 1 2 1 4 / 2 / 2 2 5 44 48 LQFP
[9 mm × 9 mm]
MSPM0G1506xPT 64 / 32
MSPM0G1507xPT 128 / 32
MSPM0G1505xRGZ 32 / 16 S Y 2 / 16 3 1 2 1 4 / 2 / 2 2 5 44 48 VQFN
[7 mm × 7 mm]
MSPM0G1506xRGZ 64 / 32
MSPM0G1507xRGZ 128 / 32
MSPM0G1505xRHB 32 / 16 S Y 2 / 11 3 1 2 1 4 / 2 / 2 2 5 28 32 VQFN
[5 mm × 5 mm]
MSPM0G1506xRHB 64 / 32
MSPM0G1507xRHB 128 / 32
MSPM0G1505xDGS28 32 / 16 S Y 2 / 11 3 1 2 1 4 / 2 / 2 2 5 24 28 VSSOP
[7.1 mm × 4.9 mm]
MSPM0G1506xDGS28 64 / 32
MSPM0G1507xDGS28 128 / 32
MSPM0G1505xRGE 32 / 16 S Y 2 / 9 3 1 2 1 4 / 2 / 2 2 5 20 24 VQFN
[4 mm × 4 mm]
MSPM0G1506xRGE 64 / 32
MSPM0G1507xRGE 128 / 32
(1) For the most current part, package, and ordering information for all available devices, see the Package Option Addendum in Section 11, or see the TI website.
(2) Device Qualifications:
  • S = –40°C to 125°C
(3) The package size (length × width) is a nominal value and includes pins, where applicable. For the package dimensions with tolerances, see Section 11.
(4) For more information about the device name, see Section 10.2