SLASEW9C February   2023  – October 2023 MSPM0G1505 , MSPM0G1506 , MSPM0G1507

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Diagrams
    2. 6.2 Pin Attributes
    3. 6.3 Signal Descriptions
    4. 6.4 Connections for Unused Pins
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Supply Current Characteristics
      1. 7.5.1 RUN/SLEEP Modes
      2. 7.5.2 STOP/STANDBY Modes
      3. 7.5.3 SHUTDOWN Mode
    6. 7.6  Power Supply Sequencing
      1. 7.6.1 POR and BOR
      2. 7.6.2 Power Supply Ramp
    7. 7.7  Flash Memory Characteristics
    8. 7.8  Timing Characteristics
    9. 7.9  Clock Specifications
      1. 7.9.1 System Oscillator (SYSOSC)
        1. 7.9.1.1 SYSOSC Typical Frequency Accuracy
      2. 7.9.2 Low Frequency Oscillator (LFOSC)
      3. 7.9.3 System Phase Lock Loop (SYSPLL)
      4. 7.9.4 Low Frequency Crystal/Clock
      5. 7.9.5 High Frequency Crystal/Clock
    10. 7.10 Digital IO
      1. 7.10.1 Electrical Characteristics
      2. 7.10.2 Switching Characteristics
    11. 7.11 Analog Mux VBOOST
    12. 7.12 ADC
      1. 7.12.1 Electrical Characteristics
      2. 7.12.2 Switching Characteristics
      3. 7.12.3 Linearity Parameters
      4. 7.12.4 Typical Connection Diagram
    13. 7.13 Temperature Sensor
    14. 7.14 VREF
      1. 7.14.1 Voltage Characteristics
      2. 7.14.2 Electrical Characteristics
    15. 7.15 Comparator (COMP)
      1. 7.15.1 Comparator Electrical Characteristics
    16. 7.16 DAC
      1. 7.16.1 DAC_Supply Specifications
      2. 7.16.2 DAC Output Specifications
      3. 7.16.3 DAC Dynamic Specifications
      4. 7.16.4 DAC Linearity Specifications
      5. 7.16.5 DAC Timing Specifications
    17. 7.17 GPAMP
      1. 7.17.1 Electrical Characteristics
      2. 7.17.2 Switching Characteristics
    18. 7.18 OPA
      1. 7.18.1 Electrical Characteristics
      2. 7.18.2 Switching Characteristics
      3. 7.18.3 PGA Mode
    19. 7.19 I2C
      1. 7.19.1 I2C Characteristics
      2. 7.19.2 I2C Filter
      3. 7.19.3 I2C Timing Diagram
    20. 7.20 SPI
      1. 7.20.1 SPI
      2. 7.20.2 SPI Timing Diagram
    21. 7.21 UART
    22. 7.22 TIMx
    23. 7.23 TRNG
      1. 7.23.1 TRNG Electrical Characteristics
      2. 7.23.2 TRNG Switching Characteristics
    24. 7.24 Emulation and Debug
      1. 7.24.1 SWD Timing
  9. 8 Detailed Description
    1. 8.1  CPU
    2. 8.2  Operating Modes
      1. 8.2.1 Functionality by Operating Mode (MSPM0G150x)
    3. 8.3  Power Management Unit (PMU)
    4. 8.4  Clock Module (CKM)
    5. 8.5  DMA
    6. 8.6  Events
    7. 8.7  Memory
      1. 8.7.1 Memory Organization
      2. 8.7.2 Peripheral File Map
      3. 8.7.3 Peripheral Interrupt Vector
    8. 8.8  Flash Memory
    9. 8.9  SRAM
    10. 8.10 GPIO
    11. 8.11 IOMUX
    12. 8.12 ADC
    13. 8.13 Temperature Sensor
    14. 8.14 VREF
    15. 8.15 COMP
    16. 8.16 DAC
    17. 8.17 OPA
    18. 8.18 GPAMP
    19. 8.19 TRNG
    20. 8.20 AES
    21. 8.21 CRC
    22. 8.22 UART
    23. 8.23 I2C
    24. 8.24 SPI
    25. 8.25 WWDT
    26. 8.26 RTC
    27. 8.27 Timers (TIMx)
    28. 8.28 Device Analog Connections
    29. 8.29 Input/Output Diagrams
    30. 8.30 Serial Wire Debug Interface
    31. 8.31 Bootstrap Loader (BSL)
    32. 8.32 Device Factory Constants
    33. 8.33 Identification
  10. 9 Applications, Implementation, and Layout
    1. 9.1 Typical Application
      1. 9.1.1 Schematic
  11. 10Device and Documentation Support
    1. 10.1 Getting Started and Next Steps
    2. 10.2 Device Nomenclature
    3. 10.3 Tools and Software
    4. 10.4 Documentation Support
    5. 10.5 Support Resources
    6. 10.6 Trademarks
    7. 10.7 Electrostatic Discharge Caution
    8. 10.8 Glossary
  12. 11Mechanical, Packaging, and Orderable Information
  13. 12Revision History

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.17 OPA

The zero-drift op amps (OPAs) in these devices, OPA0 and OPA1, are chopper stabilized operational amplifiers with rail-to-rail input/output and a programmable gain stage feedback loop.

The OPA peripherals support the following key features:

  • Software-selectable zero-drift chopper stabilization for improved accuracy and drift performance
  • Factory trimming to remove offset error
  • Burnout current source (BCS) integrated to monitor sensor health
  • Programmable gain amplifier (PGA) up to 32x

The OPA features configurable input muxes P-MUX, N-MUX, and M-MUX to support various analog signal chain amplifier configurations that include general purpose, inverting, noninverting, unity gain, cascade, noninverting cascade, difference, and more. The following tables list the input channel mapping for each OPA.

Table 8-12 OPA0 Input Channel Mapping
PSEL P-MUX INPUTS NSEL N-MUX INPUTS MSEL M-MUX INPUTS
0x0 Open 0x0 Open 0x0 Open
0x1 OPA0_IN0+ 0x1 OPA0_IN0- 0x1 OPA0_IN1-
0x2 OPA0_IN1+ 0x2 OPA0_IN1- 0x2 GND
0x3 DAC_OUT / OPA0_IN2+(1) 0x3 OPA1_RBOT 0x3 DAC_OUT / OPA0_IN2+(1)
0x4 DAC8.0_OUT 0x4 RTAP 0x4 OPA1_RTOP
0x5 VREF 0x5 RTOP
0x6 OPA1_RTOP
0x7 GPAMP Output
0x8 GROUND
Table 8-13 OPA1 Input Channel Mapping
PSEL P-MUX INPUTS NSEL N-MUX INPUTS MSEL M-MUX INPUTS
0x0 Open 0x0 Open 0x0 Open
0x1 OPA1_IN0+ 0x1 OPA1_IN0- 0x1 OPA1_IN1-
0x2 OPA1_IN1+ 0x2 OPA1_IN1- 0x2 GND
0x3 DAC_OUT / OPA1_IN2+(1) 0x3 OPA0_RBOT 0x3 DAC_OUT / OPA1_IN2+(1)
0x4 DAC8.1_OUT 0x4 RTAP 0x4 OPA0_RTOP
0x5 VREF 0x5 RTOP
0x6 OPA0_RTOP
0x7 GPAMP Output
0x8 GROUND
(1) The connection to OPA and DAC_OUT connects using the PA15 pin. When connecting DAC_OUT to OPA, avoid using external circuitry on the PA15 pin.

For more information about device analog connections, see Section 8.28

For more details, see the OPA chapter of the MSPM0 L-Series 32-MHz Microcontrollers Technical Reference Manual.