SLASFA2 November   2024 MSPM0G1519 , MSPM0G3519

ADVANCE INFORMATION  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Functional Block Diagram
  6. Device Comparison
    1. 5.1 Device Comparison Chart
  7. Pin Configuration and Functions
    1. 6.1 Pin Diagrams
    2. 6.2 Pin Attributes
      1.      11
    3. 6.3 Signal Descriptions
      1.      13
      2.      14
      3.      15
      4.      16
      5.      17
      6.      18
      7.      19
      8.      20
      9.      21
      10.      22
      11.      23
      12.      24
      13.      25
      14.      26
      15.      27
      16.      28
      17.      29
    4. 6.4 Connections for Unused Pins
  8. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Supply Current Characteristics
      1. 7.5.1 RUN/SLEEP Modes
      2. 7.5.2 STOP/STANDBY Modes
      3. 7.5.3 SHUTDOWN Mode
    6. 7.6  Power Supply Sequencing
      1. 7.6.1 Power Supply Ramp
      2. 7.6.2 POR and BOR
    7. 7.7  Flash Memory Characteristics
    8. 7.8  Timing Characteristics
    9. 7.9  Clock Specifications
      1. 7.9.1 System Oscillator (SYSOSC)
      2. 7.9.2 SYSOSC Typical Frequency Accuracy
      3. 7.9.3 Low Frequency Oscillator (LFOSC)
      4. 7.9.4 System Phase Lock Loop (SYSPLL)
      5. 7.9.5 Low Frequency Crystal/Clock
      6. 7.9.6 High Frequency Crystal/Clock
    10. 7.10 Digital IO
      1. 7.10.1  Electrical Characteristics
      2. 7.10.2 Switching Characteristics
    11. 7.11 Analog Mux VBOOST
    12. 7.12 ADC
      1. 7.12.1 Electrical Characteristics
      2. 7.12.2 Switching Characteristics
      3. 7.12.3 Linearity Parameters
      4. 7.12.4 Typical Connection Diagram
    13. 7.13 Temperature Sensor
    14. 7.14 VREF
      1. 7.14.1 Voltage Characteristics
      2. 7.14.2 Electrical Characteristics
    15. 7.15 Comparator (COMP)
      1. 7.15.1 Comparator Electrical Characteristics
    16. 7.16 DAC
      1. 7.16.1 DAC_Supply Specifications
      2. 7.16.2 DAC Output Specifications
      3. 7.16.3 DAC Dynamic Specifications
      4. 7.16.4 DAC Linearity Specifications
      5. 7.16.5 DAC Timing Specifications
    17. 7.17 I2C
      1. 7.17.1 I2C Characteristics
      2. 7.17.2 I2C Filter
      3. 7.17.3 I2C Timing Diagram
    18. 7.18 SPI
      1. 7.18.1 SPI
      2. 7.18.2 SPI Timing Diagram
    19. 7.19 UART
    20. 7.20 TIMx
    21. 7.21 TRNG
      1. 7.21.1 TRNG Electrical Characteristics
      2. 7.21.2 TRNG Switching Characteristics
    22. 7.22 Emulation and Debug
      1. 7.22.1 SWD Timing
  9. Detailed Description
    1. 8.1  Functional Block Diagram
    2. 8.2  CPU
    3. 8.3  Operating Modes
      1. 8.3.1 Functionality by Operating Mode (MSPM0Gx51x)
    4. 8.4  Security
    5. 8.5  Power Management Unit (PMU)
    6. 8.6  Clock Module (CKM)
    7. 8.7  DMA
    8. 8.8  Events
    9. 8.9  Memory
      1. 8.9.1 Memory Organization
      2. 8.9.2 Peripheral File Map
      3. 8.9.3 Peripheral Interrupt Vector
    10. 8.10 Flash Memory
    11. 8.11 SRAM
    12. 8.12 GPIO
    13. 8.13 IOMUX
    14. 8.14 ADC
    15. 8.15 Temperature Sensor
    16. 8.16 VREF
    17. 8.17 COMP
    18. 8.18 DAC
    19. 8.19 TRNG
    20. 8.20 AESADV
    21. 8.21 Keystore
    22. 8.22 CRC-P
    23. 8.23 MATHACL
    24. 8.24 UART
    25. 8.25 I2C
    26. 8.26 SPI
    27. 8.27 CAN-FD
    28. 8.28 Low-Frequency Sub System (LFSS)
    29. 8.29 RTC_B
    30. 8.30 IWDT_B
    31. 8.31 WWDT
    32. 8.32 Timers (TIMx)
    33. 8.33 Device Analog Connections
    34. 8.34 Input/Output Diagrams
    35. 8.35 Serial Wire Debug Interface
    36. 8.36 Boot Strap Loader (BSL)
    37. 8.37 Device Factory Constants
    38. 8.38 Identification
  10. Applications, Implementation, and Layout
    1. 9.1 Typical Application
      1. 9.1.1 Schematic
  11. 10Device and Documentation Support
    1. 10.1 Getting Started and Next Steps
    2. 10.2 Device Nomenclature
    3. 10.3 Tools and Software
    4. 10.4 Documentation Support
    5. 10.5 Support Resources
    6. 10.6 Trademarks
    7. 10.7 Electrostatic Discharge Caution
    8. 10.8 Glossary
  12. 11Mechanical, Packaging, and Orderable Information
  13. 12Revision History

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

SRAM

MSPM0 MCUs include a low power, high performance SRAM memory with zero wait state access across the supported CPU frequency range of the device. MSPM0 MCUs also provides up to 128KB SRAM. SRAM memory may be used for storing volatile information such as the call stack, heap, global data, and code.

The SRAM memory content is split into two banks of 64kB each. SRAM (Bank 0) provides 64kB of ECC or parity protected SRAM and is always available in run, sleep, stop, and standby operating modes. SRAM (Bank 1) provides 64kB which does not include ECC protection or parity and can be selectively enabled or disabled through BANKOFF1 bit in SRAMCFG register in SYSCTL. When enabled, SRAM (Bank 1) is available in run, sleep, and stop modes. SRAM (Bank 1) can be powered off in STOP mode by configuring the BANKSTOP1 bit in SRAMCFG register in SYSCTL. SRAM contents for both banks are lost in shutdown mode.

A write protection mechanism is provided to allow the application to prevent unintended modifications to the SRAM memory. Write protection is useful when placing executable code into SRAM as it provides a level of protection against unintentional overwrites of code by either the CPU or DMA. Placing code in SRAM can improve performance of critical loops by enabling zero wait state operation and lower power consumption.

Please note that if the DMA controller is to be configured for DMA transfers which access the SRAM, the ECC protected SRAM address region must not be used by the DMA or the CPU. In cases where the DMA must access SRAM, configure the DMA and CPU to use only the parity checked SRAM address region or the unchecked SRAM address region.