SLASF86B October   2023  – May 2024 MSPM0G3105-Q1 , MSPM0G3106-Q1 , MSPM0G3107-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Diagrams
    2. 6.2 Pin Attributes
    3. 6.3 Signal Descriptions
    4. 6.4 Connections for Unused Pins
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Supply Current Characteristics
      1. 7.5.1 RUN/SLEEP Modes
      2. 7.5.2 STOP/STANDBY Modes
      3. 7.5.3 SHUTDOWN Mode
    6. 7.6  Power Supply Ramp
      1. 7.6.1 POR and BOR
    7. 7.7  Flash Memory Characteristics
    8. 7.8  Timing Characteristics
    9. 7.9  Clock Specifications
      1. 7.9.1 System Oscillator (SYSOSC)
        1. 7.9.1.1 SYSOSC Typical Frequency Accuracy
      2. 7.9.2 Low Frequency Oscillator (LFOSC)
      3. 7.9.3 System Phase Lock Loop (SYSPLL)
      4. 7.9.4 Low Frequency Crystal/Clock
      5. 7.9.5 High Frequency Crystal/Clock
    10. 7.10 Digital IO
      1. 7.10.1 Electrical Characteristics
      2. 7.10.2 Switching Characteristics
    11. 7.11 Analog Mux VBOOST
    12. 7.12 ADC
      1. 7.12.1 Electrical Characteristics
      2. 7.12.2 Switching Characteristics
      3. 7.12.3 Linearity Parameters
    13. 7.13 Typical Connection Diagram
    14. 7.14 Temperature Sensor
    15. 7.15 VREF
      1. 7.15.1 Voltage Characteristics
      2. 7.15.2 Electrical Characteristics
    16. 7.16 GPAMP
      1. 7.16.1 Electrical Characteristics
      2. 7.16.2 Switching Characteristics
    17. 7.17 I2C
      1. 7.17.1 I2C Timing Diagram
      2. 7.17.2 I2C Characteristics
      3. 7.17.3 I2C Filter
    18. 7.18 SPI
      1. 7.18.1 SPI
      2. 7.18.2 SPI Timing Diagram
    19. 7.19 UART
    20. 7.20 TIMx
    21. 7.21 TRNG
      1. 7.21.1 TRNG Electrical Characteristics
      2. 7.21.2 TRNG Switching Characteristics
    22. 7.22 Emulation and Debug
      1. 7.22.1 SWD Timing
  9. 8 Detailed Description
    1. 8.1  CPU
    2. 8.2  Operating Modes
      1. 8.2.1 Functionality by Operating Mode (MSPM0G310x)
    3. 8.3  Power Management Unit (PMU)
    4. 8.4  Clock Module (CKM)
    5. 8.5  DMA
    6. 8.6  Events
    7. 8.7  Memory
      1. 8.7.1 Memory Organization
      2. 8.7.2 Peripheral File Map
      3. 8.7.3 Peripheral Interrupt Vector
    8. 8.8  Flash Memory
    9. 8.9  SRAM
    10. 8.10 GPIO
    11. 8.11 IOMUX
    12. 8.12 ADC
    13. 8.13 Temperature Sensor
    14. 8.14 VREF
    15. 8.15 GPAMP
    16. 8.16 TRNG
    17. 8.17 AES
    18. 8.18 CRC
    19. 8.19 UART
    20. 8.20 I2C
    21. 8.21 SPI
    22. 8.22 CAN-FD
    23. 8.23 WWDT
    24. 8.24 RTC
    25. 8.25 Timers (TIMx)
    26. 8.26 Device Analog Connections
    27. 8.27 Input/Output Diagrams
    28. 8.28 Serial Wire Debug Interface
    29. 8.29 Bootstrap Loader (BSL)
    30. 8.30 Device Factory Constants
    31. 8.31 Identification
  10. 9 Applications, Implementation, and Layout
    1. 9.1 Typical Application
      1. 9.1.1 Schematic
  11. 10Device and Documentation Support
    1. 10.1 Getting Started and Next Steps
    2. 10.2 Device Nomenclature
    3. 10.3 Tools and Software
    4. 10.4 Documentation Support
    5. 10.5 Support Resources
    6. 10.6 Trademarks
    7. 10.7 Electrostatic Discharge Caution
    8. 10.8 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DGS|28
  • PM|64
  • RGZ|48
  • RHB|32
  • DGS|32
  • PT|48
  • DGS|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Device Comparison

Table 5-1 Device Comparison
DEVICE NAME (1)(4) FLASH / SRAM (KB) QUAL(2) ADC / CHAN GPAMP UART / I2C / SPI CAN TIMA TIMG GPIO PACKAGE (PACKAGE SIZE) (3)
M0G3105QPMQ1 32 / 16 Q 2 / 17 1 4 / 2 / 2 1 2 5 60 64 LQFP
(12mm × 12mm)
M0G3106QPMQ1 64 / 32
M0G3107QPMQ1 128 / 32
M0G3105QPTQ1 32 / 16 Q 2 / 16 1 4 / 2 / 2 1

2

5

 44 48 LQFP
(9mm × 9mm)
M0G3106QPTQ1 64 / 32
M0G3107QPTQ1 128 / 32
M0G3105QRGZQ1 32 / 16 Q 2 / 16 1 4 / 2 / 2 1 2 5 44 48 VQFN
(7mm × 7mm) (5)
M0G3106QRGZQ1 64 / 32
M0G3107QRGZQ1 128 / 32
M0G3105QRHBQ1 32 / 16 Q 2 / 11 1 4 / 2 / 2 1 2 5 28 32 VQFN
(5mm × 5mm) (5)
M0G3106QRHBQ1 64 / 32
M0G3107QRHBQ1 128 / 32
M0G3105QDGS32Q1 32 / 16 Q 2/11 1 4 / 2 / 2 1 2 5 28 32 VSSOP
(8.1mm × 4.9mm)
M0G3106QDGS32Q1 64 / 32
M0G3107QDGS32Q1 128 / 32
M0G3105QDGS28Q1 32 / 16 Q 2 / 11 1 4 / 2 / 2 1 2 5 24 28 VSSOP
(7.1mm × 4.9mm)
M0G3106QDGS28Q1 64 / 32
M0G3107QDGS28Q1 128 / 32
M0G3105QDGS20Q1 32 / 16 Q 2 / 6 1 3 / 2 / 1 1 2 5 16 20 VSSOP
(5.1mm × 4.9mm)
M0G3106QDGS20Q1 64 / 32
M0G3107QDGS20Q1 128 / 32
(1) For the most current part, package, and ordering information for all available devices, see the Package Option Addendum in Section 12, or see the TI website.
(2) Device Qualifications:
  • Q = –40°C to 125°C , AEC-Q100 qualified
(3) The package size (length × width) is a nominal value and includes pins, where applicable. For the package dimensions with tolerances, see Section 12.
(4) For more information about the device name, see Section 10.2.
(5) 32- and 48 -pin VQFN package available with wettable flanks.