SLASF88B October   2023  – May 2024 MSPM0G3505-Q1 , MSPM0G3506-Q1 , MSPM0G3507-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Diagrams
    2. 6.2 Pin Attributes
    3. 6.3 Signal Descriptions
    4. 6.4 Connections for Unused Pins
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Supply Current Characteristics
      1. 7.5.1 RUN/SLEEP Modes
      2. 7.5.2 STOP/STANDBY Modes
      3. 7.5.3 SHUTDOWN Mode
    6. 7.6  Power Supply Sequencing
      1. 7.6.1 Power Supply Ramp
        1. 7.6.1.1 POR and BOR
    7. 7.7  Flash Memory Characteristics
    8. 7.8  Timing Characteristics
    9. 7.9  Clock Specifications
      1. 7.9.1 System Oscillator (SYSOSC)
      2. 7.9.2 SYSOSC Typical Frequency Accuracy
        1. 7.9.2.1 Low Frequency Oscillator (LFOSC)
      3. 7.9.3 System Phase Lock Loop (SYSPLL)
      4. 7.9.4 Low Frequency Crystal/Clock
      5. 7.9.5 High Frequency Crystal/Clock
    10. 7.10 Digital IO
      1. 7.10.1 Electrical Characteristics
      2. 7.10.2 Switching Characteristics
    11. 7.11 Analog Mux VBOOST
    12. 7.12 ADC
      1. 7.12.1 Electrical Characteristics
      2. 7.12.2 Switching Characteristics
      3. 7.12.3 Linearity Parameters
    13. 7.13 Typical Connection Diagram
    14. 7.14 Temperature Sensor
    15. 7.15 VREF
      1. 7.15.1 Voltage Characteristics
      2. 7.15.2 Electrical Characteristics
    16. 7.16 Comparator (COMP)
      1. 7.16.1 Comparator Electrical Characteristics
    17. 7.17 DAC
      1. 7.17.1 DAC_Supply Specifications
      2. 7.17.2 DAC Output Specifications
      3. 7.17.3 DAC Dynamic Specifications
      4. 7.17.4 DAC Linearity Specifications
      5. 7.17.5 DAC Timing Specifications
    18. 7.18 GPAMP
      1. 7.18.1 Electrical Characteristics
      2. 7.18.2 Switching Characteristics
    19. 7.19 OPA
      1. 7.19.1 Electrical Characteristics
      2. 7.19.2 Switching Characteristics
      3. 7.19.3 PGA Mode
    20. 7.20 I2C
      1. 7.20.1 I2C Characteristics
      2. 7.20.2 I2C Filter
        1. 7.20.2.1 I2C Timing Diagram
    21. 7.21 SPI
      1. 7.21.1 SPI
      2. 7.21.2 SPI Timing Diagram
    22. 7.22 UART
    23. 7.23 TIMx
    24. 7.24 TRNG
      1. 7.24.1 TRNG Electrical Characteristics
      2. 7.24.2 TRNG Switching Characteristics
    25. 7.25 Emulation and Debug
      1. 7.25.1 SWD Timing
  9. 8 Detailed Description
    1. 8.1  CPU
    2. 8.2  Operating Modes
      1. 8.2.1 Functionality by Operating Mode (MSPM0G350x)
    3. 8.3  Power Management Unit (PMU)
    4. 8.4  Clock Module (CKM)
    5. 8.5  DMA
    6. 8.6  Events
    7. 8.7  Memory
      1. 8.7.1 Memory Organization
      2. 8.7.2 Peripheral File Map
      3. 8.7.3 Peripheral Interrupt Vector
    8. 8.8  Flash Memory
    9. 8.9  SRAM
    10. 8.10 GPIO
    11. 8.11 IOMUX
    12. 8.12 ADC
    13. 8.13 Temperature Sensor
    14. 8.14 VREF
    15. 8.15 COMP
    16. 8.16 DAC
    17. 8.17 OPA
    18. 8.18 GPAMP
    19. 8.19 TRNG
    20. 8.20 AES
    21. 8.21 CRC
    22. 8.22 MATHACL
    23. 8.23 UART
    24. 8.24 I2C
    25. 8.25 SPI
    26. 8.26 CAN-FD
    27. 8.27 WWDT
    28. 8.28 RTC
    29. 8.29 Timers (TIMx)
    30. 8.30 Device Analog Connections
    31. 8.31 Input/Output Diagrams
    32. 8.32 Serial Wire Debug Interface
    33. 8.33 Bootstrap Loader (BSL)
    34. 8.34 Device Factory Constants
    35. 8.35 Identification
  10. 9 Applications, Implementation, and Layout
    1. 9.1 Typical Application
      1. 9.1.1 Schematic
  11. 10Device and Documentation Support
    1. 10.1 Getting Started and Next Steps
    2. 10.2 Device Nomenclature
    3. 10.3 Tools and Software
    4. 10.4 Documentation Support
    5. 10.5 Support Resources
    6. 10.6 Trademarks
    7. 10.7 Electrostatic Discharge Caution
    8. 10.8 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RHB|32
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Device Comparison

The following table summarizes the features of each device that is described in this data sheet.

Table 5-1 Device Comparison
DEVICE NAME (1)(4) FLASH /SRAM (KB) QUAL(2) MATH ACCEL ADC / CHAN COMP DAC OPA GPAMP UART/I2C/SPI CAN TIMA TIMG GPIO PACKAGE [PACKAGE SIZE] (3)
M0G3505QPMQ1 32 / 16 Q Y 2 / 17 3 1 2 1 4 / 2 / 2 1 2

5

 60 64 LQFP
[12mm × 12mm]
M0G3506QPMQ1 64 / 32
M0G3507QPMQ1 128 / 32
M0G3505QPTQ1 32 / 16 Q Y 2 / 16 3 1 2 1 4 / 2 / 2 1

2

5

 44 48 LQFP
[9mm × 9mm]
M0G3506QPTQ1 64 / 32
M0G3507QPTQ1 128 / 32
M0G3505QRGZQ1 32 / 16 Q Y 2 / 16 3 1 2 1 4 / 2 / 2 1 2

5

 44 48 VQFN
[7mm × 7mm](5)
M0G3506QRGZQ1 64 / 32
M0G3507QRGZQ1 128 / 32
M0G3505QRHBQ1 32 / 16 Q Y 2 / 11 3 1 2 1 4 / 2 / 2 1

2

 5 28 32 VQFN
[5mm × 5mm](5)
M0G3506QRHBQ1 64 / 32
M0G3507QRHBQ1 128 / 32
M0G3505QDGS32Q1 32 / 16 Q Y 2 / 11 3 1 2 1 4 / 2 / 2 1 2 5 28 32 VSSOP
[8.1mm × 3mm]
M0G3506QDGS32Q1 64 / 32
M0G3507QDGS32Q1 128 / 32
M0G3505QDGS28Q1 32 / 16 Q Y 2 / 11 3 1 2 1 4 / 2 / 2 1 2 5 24 28 VSSOP
[7.1mm × 3mm]
M0G3506QDGS28Q1 64 / 32
M0G3507QDGS28Q1 128 / 32
(1) For the most current part, package, and ordering information for all available devices, see the Package Option Addendum in Section 12, or see the TI website.
(2) Device Qualifications:
  • Q = –40°C to 125°C, AEC-Q100 qualified
(3) The package size (length × width) is a nominal value and includes pins, where applicable. For the package dimensions with tolerances, see Section 12.
(4) For more information about the device name, see Section 10.2
(5) 32-pin and 48-pin VQFN packages are available with wettable flanks.