SLASF88B October   2023  – May 2024 MSPM0G3505-Q1 , MSPM0G3506-Q1 , MSPM0G3507-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Diagrams
    2. 6.2 Pin Attributes
    3. 6.3 Signal Descriptions
    4. 6.4 Connections for Unused Pins
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Supply Current Characteristics
      1. 7.5.1 RUN/SLEEP Modes
      2. 7.5.2 STOP/STANDBY Modes
      3. 7.5.3 SHUTDOWN Mode
    6. 7.6  Power Supply Sequencing
      1. 7.6.1 Power Supply Ramp
        1. 7.6.1.1 POR and BOR
    7. 7.7  Flash Memory Characteristics
    8. 7.8  Timing Characteristics
    9. 7.9  Clock Specifications
      1. 7.9.1 System Oscillator (SYSOSC)
      2. 7.9.2 SYSOSC Typical Frequency Accuracy
        1. 7.9.2.1 Low Frequency Oscillator (LFOSC)
      3. 7.9.3 System Phase Lock Loop (SYSPLL)
      4. 7.9.4 Low Frequency Crystal/Clock
      5. 7.9.5 High Frequency Crystal/Clock
    10. 7.10 Digital IO
      1. 7.10.1 Electrical Characteristics
      2. 7.10.2 Switching Characteristics
    11. 7.11 Analog Mux VBOOST
    12. 7.12 ADC
      1. 7.12.1 Electrical Characteristics
      2. 7.12.2 Switching Characteristics
      3. 7.12.3 Linearity Parameters
    13. 7.13 Typical Connection Diagram
    14. 7.14 Temperature Sensor
    15. 7.15 VREF
      1. 7.15.1 Voltage Characteristics
      2. 7.15.2 Electrical Characteristics
    16. 7.16 Comparator (COMP)
      1. 7.16.1 Comparator Electrical Characteristics
    17. 7.17 DAC
      1. 7.17.1 DAC_Supply Specifications
      2. 7.17.2 DAC Output Specifications
      3. 7.17.3 DAC Dynamic Specifications
      4. 7.17.4 DAC Linearity Specifications
      5. 7.17.5 DAC Timing Specifications
    18. 7.18 GPAMP
      1. 7.18.1 Electrical Characteristics
      2. 7.18.2 Switching Characteristics
    19. 7.19 OPA
      1. 7.19.1 Electrical Characteristics
      2. 7.19.2 Switching Characteristics
      3. 7.19.3 PGA Mode
    20. 7.20 I2C
      1. 7.20.1 I2C Characteristics
      2. 7.20.2 I2C Filter
        1. 7.20.2.1 I2C Timing Diagram
    21. 7.21 SPI
      1. 7.21.1 SPI
      2. 7.21.2 SPI Timing Diagram
    22. 7.22 UART
    23. 7.23 TIMx
    24. 7.24 TRNG
      1. 7.24.1 TRNG Electrical Characteristics
      2. 7.24.2 TRNG Switching Characteristics
    25. 7.25 Emulation and Debug
      1. 7.25.1 SWD Timing
  9. 8 Detailed Description
    1. 8.1  CPU
    2. 8.2  Operating Modes
      1. 8.2.1 Functionality by Operating Mode (MSPM0G350x)
    3. 8.3  Power Management Unit (PMU)
    4. 8.4  Clock Module (CKM)
    5. 8.5  DMA
    6. 8.6  Events
    7. 8.7  Memory
      1. 8.7.1 Memory Organization
      2. 8.7.2 Peripheral File Map
      3. 8.7.3 Peripheral Interrupt Vector
    8. 8.8  Flash Memory
    9. 8.9  SRAM
    10. 8.10 GPIO
    11. 8.11 IOMUX
    12. 8.12 ADC
    13. 8.13 Temperature Sensor
    14. 8.14 VREF
    15. 8.15 COMP
    16. 8.16 DAC
    17. 8.17 OPA
    18. 8.18 GPAMP
    19. 8.19 TRNG
    20. 8.20 AES
    21. 8.21 CRC
    22. 8.22 MATHACL
    23. 8.23 UART
    24. 8.24 I2C
    25. 8.25 SPI
    26. 8.26 CAN-FD
    27. 8.27 WWDT
    28. 8.28 RTC
    29. 8.29 Timers (TIMx)
    30. 8.30 Device Analog Connections
    31. 8.31 Input/Output Diagrams
    32. 8.32 Serial Wire Debug Interface
    33. 8.33 Bootstrap Loader (BSL)
    34. 8.34 Device Factory Constants
    35. 8.35 Identification
  10. 9 Applications, Implementation, and Layout
    1. 9.1 Typical Application
      1. 9.1.1 Schematic
  11. 10Device and Documentation Support
    1. 10.1 Getting Started and Next Steps
    2. 10.2 Device Nomenclature
    3. 10.3 Tools and Software
    4. 10.4 Documentation Support
    5. 10.5 Support Resources
    6. 10.6 Trademarks
    7. 10.7 Electrostatic Discharge Caution
    8. 10.8 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RHB|32
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.29 Timers (TIMx)

The timer peripherals in these devices support the following key features, for specific configuration see Table 8-15:

Specific features for the general-purpose timer (TIMGx) include:

  • 16-bit and 32-bit timers with up, down or up-down counting modes, with repeat-reload mode
  • Selectable and configurable clock source
  • 8-bit programmable prescaler to divide the counter clock frequency
  • Two independent CC channels for
    • Output compare
    • Input capture
    • PWM output
    • One-shot mode
  • Shadow CC register available in TIMG6, TIMG7 and TIMG12
  • Shadow load register available in TIMG6, TIMG7
  • Support quadrature encoder interface (QEI) for positioning and movement sensing available in TIMG8
  • Support synchronization and cross trigger among different TIMx instances in the same power domain
  • Support interrupt/DMA trigger generation and cross peripherals (such as ADC) trigger capability
  • Cross trigger event logic for Hall sensor inputs (TIMG8)

Specific features for the advanced timer (TIMAx) include:

  • 16-bit timer with up, down or up-down counting modes, with repeat-reload mode
  • Selectable and configurable clock source
  • 8-bit programmable prescaler to divide the counter clock frequency
  • Repeat counter to generate an interrupt or event only after a given number of cycles of the counter
  • Up to four independent CC channels for
    • Output compare
    • Input capture
    • PWM output
    • One-shot mode
  • Internal fifth and sixth internal CC channel for capture/compare events
  • Shadow register for load and CC register available in both TIMA0 and TIMA1
  • Complementary output PWM
  • Asymmetric PWM with programmable dead band insertion
  • Fault handling mechanism to ensure the output signals in a safe user-defined state when a fault condition is encountered
  • Support synchronization and cross trigger among different TIMx instances in the same power domain
  • Support interrupt and DMA trigger generation and cross peripherals (such as ADC) trigger capability
  • Two additional capture/compare channels for internal events
Table 8-15 TIMx Configurations
TIMER NAME POWER DOMAIN RESOLUTION PRESCALER REPEAT COUNTER CAPTURE / COMPARE CHANNELS PHASE LOAD SHADOW LOAD SHADOW CC DEADBAND FAULT QEI
TIMG0 PD0 16-bit 8-bit – 2 – – – – – –
TIMG6 PD1 16-bit 8-bit – 2 –

Yes

Yes

 – – –
TIMG7 PD1 16-bit 8-bit – 2 – Yes Yes – – –
TIMG8 PD0 16-bit 8-bit – 2 – – – – – Yes
TIMG12 PD1 32-bit – – 2 – – Yes – – –
TIMA0 PD1 16-bit 8-bit 8-bit 4 Yes Yes Yes Yes Yes –
TIMA1 PD1 16-bit 8-bit 8-bit 2 Yes Yes Yes Yes Yes –
Table 8-16 TIMx Cross Trigger Map (PD1)
TSEL.ETSEL Selection TIMA0 TIMA1 TIMG6 TIMG7 TIMG12
0 TIMA0.TRIG0 TIMA0.TRIG0 TIMA0.TRIG0 TIMA0.TRIG0 TIMA0.TRIG0
1 TIMA1.TRIG0 TIMA1.TRIG0 TIMA1.TRIG0 TIMA1.TRIG0 TIMA1.TRIG0
2 TIMG6.TRIG0 TIMG6.TRIG0 TIMG6.TRIG0 TIMG6.TRIG0 TIMG6.TRIG0
3 TIMG7.TRIG0 TIMG7.TRIG0 TIMG7.TRIG0 TIMG7.TRIG0 TIMG7.TRIG0
4 TIMG12.TRIG0 TIMG12.TRIG0 TIMG12.TRIG0 TIMG12.TRIG0 TIMG12.TRIG0
5 TIMG8.TRIG0 TIMG8.TRIG0 TIMG8.TRIG0 TIMG8.TRIG0 TIMG8.TRIG0
6 to 15 Reserved
16 Event Subscriber Port 0 (FSUB0)
17 Event Subscriber Port 1 (FSUB1)
18-31 Reserved
Table 8-17 TIMx Cross Trigger Map (PD0)
TSEL.ETSEL SELECTION TIMG0 TIMG8
0 TIMG0.TRIG0 TIMG0.TRIG0
1 TIMG8.TRIG0 TIMG8.TRIG0
2 to 15 Reserved
16 Event Subscriber Port 0 (FSUB0)
17 Event Subscriber Port 1 (FSUB1)
18-31 Reserved

For more details, see the TIMx chapter of the MSPM0 G-Series 80MHz Microcontrollers Technical Reference Manual.