SLASF88B October   2023  – May 2024 MSPM0G3505-Q1 , MSPM0G3506-Q1 , MSPM0G3507-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Diagrams
    2. 6.2 Pin Attributes
    3. 6.3 Signal Descriptions
    4. 6.4 Connections for Unused Pins
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Supply Current Characteristics
      1. 7.5.1 RUN/SLEEP Modes
      2. 7.5.2 STOP/STANDBY Modes
      3. 7.5.3 SHUTDOWN Mode
    6. 7.6  Power Supply Sequencing
      1. 7.6.1 Power Supply Ramp
        1. 7.6.1.1 POR and BOR
    7. 7.7  Flash Memory Characteristics
    8. 7.8  Timing Characteristics
    9. 7.9  Clock Specifications
      1. 7.9.1 System Oscillator (SYSOSC)
      2. 7.9.2 SYSOSC Typical Frequency Accuracy
        1. 7.9.2.1 Low Frequency Oscillator (LFOSC)
      3. 7.9.3 System Phase Lock Loop (SYSPLL)
      4. 7.9.4 Low Frequency Crystal/Clock
      5. 7.9.5 High Frequency Crystal/Clock
    10. 7.10 Digital IO
      1. 7.10.1 Electrical Characteristics
      2. 7.10.2 Switching Characteristics
    11. 7.11 Analog Mux VBOOST
    12. 7.12 ADC
      1. 7.12.1 Electrical Characteristics
      2. 7.12.2 Switching Characteristics
      3. 7.12.3 Linearity Parameters
    13. 7.13 Typical Connection Diagram
    14. 7.14 Temperature Sensor
    15. 7.15 VREF
      1. 7.15.1 Voltage Characteristics
      2. 7.15.2 Electrical Characteristics
    16. 7.16 Comparator (COMP)
      1. 7.16.1 Comparator Electrical Characteristics
    17. 7.17 DAC
      1. 7.17.1 DAC_Supply Specifications
      2. 7.17.2 DAC Output Specifications
      3. 7.17.3 DAC Dynamic Specifications
      4. 7.17.4 DAC Linearity Specifications
      5. 7.17.5 DAC Timing Specifications
    18. 7.18 GPAMP
      1. 7.18.1 Electrical Characteristics
      2. 7.18.2 Switching Characteristics
    19. 7.19 OPA
      1. 7.19.1 Electrical Characteristics
      2. 7.19.2 Switching Characteristics
      3. 7.19.3 PGA Mode
    20. 7.20 I2C
      1. 7.20.1 I2C Characteristics
      2. 7.20.2 I2C Filter
        1. 7.20.2.1 I2C Timing Diagram
    21. 7.21 SPI
      1. 7.21.1 SPI
      2. 7.21.2 SPI Timing Diagram
    22. 7.22 UART
    23. 7.23 TIMx
    24. 7.24 TRNG
      1. 7.24.1 TRNG Electrical Characteristics
      2. 7.24.2 TRNG Switching Characteristics
    25. 7.25 Emulation and Debug
      1. 7.25.1 SWD Timing
  9. 8 Detailed Description
    1. 8.1  CPU
    2. 8.2  Operating Modes
      1. 8.2.1 Functionality by Operating Mode (MSPM0G350x)
    3. 8.3  Power Management Unit (PMU)
    4. 8.4  Clock Module (CKM)
    5. 8.5  DMA
    6. 8.6  Events
    7. 8.7  Memory
      1. 8.7.1 Memory Organization
      2. 8.7.2 Peripheral File Map
      3. 8.7.3 Peripheral Interrupt Vector
    8. 8.8  Flash Memory
    9. 8.9  SRAM
    10. 8.10 GPIO
    11. 8.11 IOMUX
    12. 8.12 ADC
    13. 8.13 Temperature Sensor
    14. 8.14 VREF
    15. 8.15 COMP
    16. 8.16 DAC
    17. 8.17 OPA
    18. 8.18 GPAMP
    19. 8.19 TRNG
    20. 8.20 AES
    21. 8.21 CRC
    22. 8.22 MATHACL
    23. 8.23 UART
    24. 8.24 I2C
    25. 8.25 SPI
    26. 8.26 CAN-FD
    27. 8.27 WWDT
    28. 8.28 RTC
    29. 8.29 Timers (TIMx)
    30. 8.30 Device Analog Connections
    31. 8.31 Input/Output Diagrams
    32. 8.32 Serial Wire Debug Interface
    33. 8.33 Bootstrap Loader (BSL)
    34. 8.34 Device Factory Constants
    35. 8.35 Identification
  10. 9 Applications, Implementation, and Layout
    1. 9.1 Typical Application
      1. 9.1.1 Schematic
  11. 10Device and Documentation Support
    1. 10.1 Getting Started and Next Steps
    2. 10.2 Device Nomenclature
    3. 10.3 Tools and Software
    4. 10.4 Documentation Support
    5. 10.5 Support Resources
    6. 10.6 Trademarks
    7. 10.7 Electrostatic Discharge Caution
    8. 10.8 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DGS|28
  • PM|64
  • RGZ|48
  • RHB|32
  • DGS|32
  • PT|48
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Thermal Information

THERMAL METRIC(1) PACKAGE VALUE UNIT
RθJA Junction-to-ambient thermal resistance LQFP-64 (PM) 63.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 23.8 °C/W
RθJB Junction-to-board thermal resistance 35.3 °C/W
ΨJT Junction-to-top characterization parameter 2.2 °C/W
ΨJB Junction-to-board characterization parameter 35 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
RθJA Junction-to-ambient thermal resistance VQFN-48 (RGZ) 30.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 20.7 °C/W
RθJB Junction-to-board thermal resistance 12.5 °C/W
ΨJT Junction-to-top characterization parameter 0.3 °C/W
ΨJB Junction-to-board characterization parameter 12.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 4.2 °C/W
RθJA Junction-to-ambient thermal resistance LQFP-48 (PT) 69.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 27.4 °C/W
RθJB Junction-to-board thermal resistance 32.6 °C/W
ΨJT Junction-to-top characterization parameter 2.6 °C/W
ΨJB Junction-to-board characterization parameter 32.3 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
RθJA Junction-to-ambient thermal resistance VQFN-32 (RHB) 32.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 23.6 °C/W
RθJB Junction-to-board thermal resistance 13.0 °C/W
ΨJT Junction-to-top characterization parameter 0.3 °C/W
ΨJB Junction-to-board characterization parameter 13.0 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 3.3 °C/W
RθJA Junction-to-ambient thermal resistance VSSOP-32(DGS32) 69.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 24.5 °C/W
RθJB Junction-to-board thermal resistance 33.4 °C/W
ΨJT Junction-to-top characterization parameter 0.7 °C/W
ΨJB Junction-to-board characterization parameter 33.2 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
RθJA Junction-to-ambient thermal resistance VSSOP-28 (DGS28) 78.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 38.6 °C/W
RθJB Junction-to-board thermal resistance 41.3 °C/W
ΨJT Junction-to-top characterization parameter 3.4 °C/W
ΨJB Junction-to-board characterization parameter 41.0 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.