SLASFA2 November   2024 MSPM0G3519

ADVANCE INFORMATION  

1.   1
2. 1 Features
3. 2 Applications
4. 3 Description
5. 4 Functional Block Diagram
6. 5 Device Comparison
   1. 5.1 Device Comparison Chart
7. 6 Pin Configuration and Functions
   1. 6.1 Pin Diagrams
   2. 6.2 Pin Attributes
      1.      11
   3. 6.3 Signal Descriptions
      1.      13
      2.      14
      3.      15
      4.      16
      5.      17
      6.      18
      7.      19
      8.      20
      9.      21
      10.      22
      11.      23
      12.      24
      13.      25
      14.      26
      15.      27
      16.      28
      17.      29
   4. 6.4 Connections for Unused Pins
8. 7 Specifications
   1. 7.1  Absolute Maximum Ratings
   2. 7.2  ESD Ratings
   3. 7.3  Recommended Operating Conditions
   4. 7.4  Thermal Information
   5. 7.5  Supply Current Characteristics
      1. 7.5.1 RUN/SLEEP Modes
      2. 7.5.2 STOP/STANDBY Modes
      3. 7.5.3 SHUTDOWN Mode
   6. 7.6  Power Supply Sequencing
      1. 7.6.1 Power Supply Ramp
      2. 7.6.2 POR and BOR
   7. 7.7  Flash Memory Characteristics
   8. 7.8  Timing Characteristics
   9. 7.9  Clock Specifications
      1. 7.9.1 System Oscillator (SYSOSC)
      2. 7.9.2 Low Frequency Oscillator (LFOSC)
         1. 7.9.2.1 SYSOSC Typical Frequency Accuracy
      3. 7.9.3 System Phase Lock Loop (SYSPLL)
      4. 7.9.4 Low Frequency Crystal/Clock
      5. 7.9.5 High Frequency Crystal/Clock
   10. 7.10 Digital IO
       1. 7.10.1  Electrical Characteristics
       2. 7.10.2 Switching Characteristics
   11. 7.11 Analog Mux VBOOST
   12. 7.12 ADC
       1. 7.12.1 Electrical Characteristics
       2. 7.12.2 Switching Characteristics
       3. 7.12.3 Linearity Parameters
       4. 7.12.4 Typical Connection Diagram
   13. 7.13 Temperature Sensor
   14. 7.14 VREF
       1. 7.14.1 Voltage Characteristics
       2. 7.14.2 Electrical Characteristics
   15. 7.15 Comparator (COMP)
       1. 7.15.1 Comparator Electrical Characteristics
   16. 7.16 DAC
       1. 7.16.1 DAC_Supply Specifications
       2. 7.16.2 DAC Output Specifications
       3. 7.16.3 DAC Dynamic Specifications
       4. 7.16.4 DAC Linearity Specifications
       5. 7.16.5 DAC Timing Specifications
   17. 7.17 I2C
       1. 7.17.1 I2C Characteristics
       2. 7.17.2 I2C Filter
       3. 7.17.3 I2C Timing Diagram
   18. 7.18 SPI
       1. 7.18.1 SPI
       2. 7.18.2 SPI Timing Diagram
   19. 7.19 UART
   20. 7.20 TIMx
   21. 7.21 TRNG
       1. 7.21.1 TRNG Electrical Characteristics
       2. 7.21.2 TRNG Switching Characteristics
   22. 7.22 Emulation and Debug
       1. 7.22.1 SWD Timing
9. 8 Detailed Description
   1. 8.1  Functional Block Diagram
   2. 8.2  CPU
   3. 8.3  Operating Modes
      1. 8.3.1 Functionality by Operating Mode (MSPM0Gx51x)
   4. 8.4  Security
   5. 8.5  Power Management Unit (PMU)
   6. 8.6  Clock Module (CKM)
   7. 8.7  DMA
   8. 8.8  Events
   9. 8.9  Memory
      1. 8.9.1 Memory Organization
      2. 8.9.2 Peripheral File Map
      3. 8.9.3 Peripheral Interrupt Vector
   10. 8.10 Flash Memory
   11. 8.11 SRAM
   12. 8.12 GPIO
   13. 8.13 IOMUX
   14. 8.14 ADC
   15. 8.15 Temperature Sensor
   16. 8.16 Low-Frequency Sub System (LFSS)
   17. 8.17 VREF
   18. 8.18 COMP
   19. 8.19 DAC
   20. 8.20 TRNG
   21. 8.21 AESADV
   22. 8.22 Keystore
   23. 8.23 CRC-P
   24. 8.24 MATHACL
   25. 8.25 UART
   26. 8.26 I2C
   27. 8.27 SPI
   28. 8.28 CAN-FD
   29. 8.29 IWDT_B
   30. 8.30 WWDT
   31. 8.31 RTC_B
   32. 8.32 Timers (TIMx)
   33. 8.33 Device Analog Connections
   34. 8.34 Input/Output Diagrams
   35. 8.35 Serial Wire Debug Interface
   36. 8.36 Boot Strap Loader (BSL)
   37. 8.37 Device Factory Constants
   38. 8.38 Identification
10. 9 Applications, Implementation, and Layout
    1. 9.1 Typical Application
       1. 9.1.1 Schematic
11. 10Device and Documentation Support
    1. 10.1 Getting Started and Next Steps
    2. 10.2 Device Nomenclature
    3. 10.3 Tools and Software
    4. 10.4 Documentation Support
    5. 10.5 Support Resources
    6. 10.6 Trademarks
    7. 10.7 Electrostatic Discharge Caution
    8. 10.8 Glossary
12. 11Mechanical, Packaging, and Orderable Information
13. 12Revision History