SLASFA2 November   2024 MSPM0G3519

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
    1. 5.1 Device Comparison Chart
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Diagrams
    2. 6.2 Pin Attributes
      1.      11
    3. 6.3 Signal Descriptions
      1.      13
      2.      14
      3.      15
      4.      16
      5.      17
      6.      18
      7.      19
      8.      20
      9.      21
      10.      22
      11.      23
      12.      24
      13.      25
      14.      26
      15.      27
      16.      28
      17.      29
    4. 6.4 Connections for Unused Pins
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Supply Current Characteristics
      1. 7.5.1 RUN/SLEEP Modes
      2. 7.5.2 STOP/STANDBY Modes
      3. 7.5.3 SHUTDOWN Mode
    6. 7.6  Power Supply Sequencing
      1. 7.6.1 Power Supply Ramp
      2. 7.6.2 POR and BOR
    7. 7.7  Flash Memory Characteristics
    8. 7.8  Timing Characteristics
    9. 7.9  Clock Specifications
      1. 7.9.1 System Oscillator (SYSOSC)
      2. 7.9.2 Low Frequency Oscillator (LFOSC)
        1. 7.9.2.1 SYSOSC Typical Frequency Accuracy
      3. 7.9.3 System Phase Lock Loop (SYSPLL)
      4. 7.9.4 Low Frequency Crystal/Clock
      5. 7.9.5 High Frequency Crystal/Clock
    10. 7.10 Digital IO
      1. 7.10.1  Electrical Characteristics
      2. 7.10.2 Switching Characteristics
    11. 7.11 Analog Mux VBOOST
    12. 7.12 ADC
      1. 7.12.1 Electrical Characteristics
      2. 7.12.2 Switching Characteristics
      3. 7.12.3 Linearity Parameters
      4. 7.12.4 Typical Connection Diagram
    13. 7.13 Temperature Sensor
    14. 7.14 VREF
      1. 7.14.1 Voltage Characteristics
      2. 7.14.2 Electrical Characteristics
    15. 7.15 Comparator (COMP)
      1. 7.15.1 Comparator Electrical Characteristics
    16. 7.16 DAC
      1. 7.16.1 DAC_Supply Specifications
      2. 7.16.2 DAC Output Specifications
      3. 7.16.3 DAC Dynamic Specifications
      4. 7.16.4 DAC Linearity Specifications
      5. 7.16.5 DAC Timing Specifications
    17. 7.17 I2C
      1. 7.17.1 I2C Characteristics
      2. 7.17.2 I2C Filter
      3. 7.17.3 I2C Timing Diagram
    18. 7.18 SPI
      1. 7.18.1 SPI
      2. 7.18.2 SPI Timing Diagram
    19. 7.19 UART
    20. 7.20 TIMx
    21. 7.21 TRNG
      1. 7.21.1 TRNG Electrical Characteristics
      2. 7.21.2 TRNG Switching Characteristics
    22. 7.22 Emulation and Debug
      1. 7.22.1 SWD Timing
  9. 8 Detailed Description
    1. 8.1  Functional Block Diagram
    2. 8.2  CPU
    3. 8.3  Operating Modes
      1. 8.3.1 Functionality by Operating Mode (MSPM0Gx51x)
    4. 8.4  Security
    5. 8.5  Power Management Unit (PMU)
    6. 8.6  Clock Module (CKM)
    7. 8.7  DMA
    8. 8.8  Events
    9. 8.9  Memory
      1. 8.9.1 Memory Organization
      2. 8.9.2 Peripheral File Map
      3. 8.9.3 Peripheral Interrupt Vector
    10. 8.10 Flash Memory
    11. 8.11 SRAM
    12. 8.12 GPIO
    13. 8.13 IOMUX
    14. 8.14 ADC
    15. 8.15 Temperature Sensor
    16. 8.16 Low-Frequency Sub System (LFSS)
    17. 8.17 VREF
    18. 8.18 COMP
    19. 8.19 DAC
    20. 8.20 TRNG
    21. 8.21 AESADV
    22. 8.22 Keystore
    23. 8.23 CRC-P
    24. 8.24 MATHACL
    25. 8.25 UART
    26. 8.26 I2C
    27. 8.27 SPI
    28. 8.28 CAN-FD
    29. 8.29 IWDT_B
    30. 8.30 WWDT
    31. 8.31 RTC_B
    32. 8.32 Timers (TIMx)
    33. 8.33 Device Analog Connections
    34. 8.34 Input/Output Diagrams
    35. 8.35 Serial Wire Debug Interface
    36. 8.36 Boot Strap Loader (BSL)
    37. 8.37 Device Factory Constants
    38. 8.38 Identification
  10. 9 Applications, Implementation, and Layout
    1. 9.1 Typical Application
      1. 9.1.1 Schematic
  11. 10Device and Documentation Support
    1. 10.1 Getting Started and Next Steps
    2. 10.2 Device Nomenclature
    3. 10.3 Tools and Software
    4. 10.4 Documentation Support
    5. 10.5 Support Resources
    6. 10.6 Trademarks
    7. 10.7 Electrostatic Discharge Caution
    8. 10.8 Glossary
  12. 11Mechanical, Packaging, and Orderable Information
  13. 12Revision History

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Thermal Information

THERMAL METRIC(1) PACKAGE VALUE UNIT
RθJA Junction-to-ambient thermal resistance LQFP-100 (PZ) TBD °C/W
RθJC(top) Junction-to-case (top) thermal resistance TBD °C/W
RθJB Junction-to-board thermal resistance TBD °C/W
ΨJT Junction-to-top characterization parameter TBD °C/W
ΨJB Junction-to-board characterization parameter TBD °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance TBD °C/W
RθJA Junction-to-ambient thermal resistance LQFP-80 (PN) TBD °C/W
RθJC(top) Junction-to-case (top) thermal resistance TBD °C/W
RθJB Junction-to-board thermal resistance TBD °C/W
ΨJT Junction-to-top characterization parameter TBD °C/W
ΨJB Junction-to-board characterization parameter TBD °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance TBD °C/W
RθJA Junction-to-ambient thermal resistance LQFP-64 (PM) 44.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 38.1 °C/W
RθJB Junction-to-board thermal resistance 21.9 °C/W
ΨJT Junction-to-top characterization parameter 1.1 °C/W
ΨJB Junction-to-board characterization parameter 21.9 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 7.1 °C/W
RθJA Junction-to-ambient thermal resistance LQFP-48 (PT) 69.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 27.4 °C/W
RθJB Junction-to-board thermal resistance 32.6 °C/W
ΨJT Junction-to-top characterization parameter 2.6 °C/W
ΨJB Junction-to-board characterization parameter 32.3 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
RθJA Junction-to-ambient thermal resistance VQFN-48 (RGZ) 30.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 20.7 °C/W
RθJB Junction-to-board thermal resistance 12.5 °C/W
ΨJT Junction-to-top characterization parameter 0.3 °C/W
ΨJB Junction-to-board characterization parameter 12.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 4.2 °C/W
RθJA Junction-to-ambient thermal resistance VQFN-32 (RHB) 32.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 23.6 °C/W
RθJB Junction-to-board thermal resistance 13.0 °C/W
ΨJT Junction-to-top characterization parameter 0.3 °C/W
ΨJB Junction-to-board characterization parameter 13.0 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 3.3 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.