SLASFA2 November   2024 MSPM0G3519

ADVANCE INFORMATION  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Functional Block Diagram
  6. Device Comparison
    1. 5.1 Device Comparison Chart
  7. Pin Configuration and Functions
    1. 6.1 Pin Diagrams
    2. 6.2 Pin Attributes
      1.      11
    3. 6.3 Signal Descriptions
      1.      13
      2.      14
      3.      15
      4.      16
      5.      17
      6.      18
      7.      19
      8.      20
      9.      21
      10.      22
      11.      23
      12.      24
      13.      25
      14.      26
      15.      27
      16.      28
      17.      29
    4. 6.4 Connections for Unused Pins
  8. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Supply Current Characteristics
      1. 7.5.1 RUN/SLEEP Modes
      2. 7.5.2 STOP/STANDBY Modes
      3. 7.5.3 SHUTDOWN Mode
    6. 7.6  Power Supply Sequencing
      1. 7.6.1 Power Supply Ramp
      2. 7.6.2 POR and BOR
    7. 7.7  Flash Memory Characteristics
    8. 7.8  Timing Characteristics
    9. 7.9  Clock Specifications
      1. 7.9.1 System Oscillator (SYSOSC)
      2. 7.9.2 Low Frequency Oscillator (LFOSC)
        1. 7.9.2.1 SYSOSC Typical Frequency Accuracy
      3. 7.9.3 System Phase Lock Loop (SYSPLL)
      4. 7.9.4 Low Frequency Crystal/Clock
      5. 7.9.5 High Frequency Crystal/Clock
    10. 7.10 Digital IO
      1. 7.10.1  Electrical Characteristics
      2. 7.10.2 Switching Characteristics
    11. 7.11 Analog Mux VBOOST
    12. 7.12 ADC
      1. 7.12.1 Electrical Characteristics
      2. 7.12.2 Switching Characteristics
      3. 7.12.3 Linearity Parameters
      4. 7.12.4 Typical Connection Diagram
    13. 7.13 Temperature Sensor
    14. 7.14 VREF
      1. 7.14.1 Voltage Characteristics
      2. 7.14.2 Electrical Characteristics
    15. 7.15 Comparator (COMP)
      1. 7.15.1 Comparator Electrical Characteristics
    16. 7.16 DAC
      1. 7.16.1 DAC_Supply Specifications
      2. 7.16.2 DAC Output Specifications
      3. 7.16.3 DAC Dynamic Specifications
      4. 7.16.4 DAC Linearity Specifications
      5. 7.16.5 DAC Timing Specifications
    17. 7.17 I2C
      1. 7.17.1 I2C Characteristics
      2. 7.17.2 I2C Filter
      3. 7.17.3 I2C Timing Diagram
    18. 7.18 SPI
      1. 7.18.1 SPI
      2. 7.18.2 SPI Timing Diagram
    19. 7.19 UART
    20. 7.20 TIMx
    21. 7.21 TRNG
      1. 7.21.1 TRNG Electrical Characteristics
      2. 7.21.2 TRNG Switching Characteristics
    22. 7.22 Emulation and Debug
      1. 7.22.1 SWD Timing
  9. Detailed Description
    1. 8.1  Functional Block Diagram
    2. 8.2  CPU
    3. 8.3  Operating Modes
      1. 8.3.1 Functionality by Operating Mode (MSPM0Gx51x)
    4. 8.4  Security
    5. 8.5  Power Management Unit (PMU)
    6. 8.6  Clock Module (CKM)
    7. 8.7  DMA
    8. 8.8  Events
    9. 8.9  Memory
      1. 8.9.1 Memory Organization
      2. 8.9.2 Peripheral File Map
      3. 8.9.3 Peripheral Interrupt Vector
    10. 8.10 Flash Memory
    11. 8.11 SRAM
    12. 8.12 GPIO
    13. 8.13 IOMUX
    14. 8.14 ADC
    15. 8.15 Temperature Sensor
    16. 8.16 Low-Frequency Sub System (LFSS)
    17. 8.17 VREF
    18. 8.18 COMP
    19. 8.19 DAC
    20. 8.20 TRNG
    21. 8.21 AESADV
    22. 8.22 Keystore
    23. 8.23 CRC-P
    24. 8.24 MATHACL
    25. 8.25 UART
    26. 8.26 I2C
    27. 8.27 SPI
    28. 8.28 CAN-FD
    29. 8.29 IWDT_B
    30. 8.30 WWDT
    31. 8.31 RTC_B
    32. 8.32 Timers (TIMx)
    33. 8.33 Device Analog Connections
    34. 8.34 Input/Output Diagrams
    35. 8.35 Serial Wire Debug Interface
    36. 8.36 Boot Strap Loader (BSL)
    37. 8.37 Device Factory Constants
    38. 8.38 Identification
  10. Applications, Implementation, and Layout
    1. 9.1 Typical Application
      1. 9.1.1 Schematic
  11. 10Device and Documentation Support
    1. 10.1 Getting Started and Next Steps
    2. 10.2 Device Nomenclature
    3. 10.3 Tools and Software
    4. 10.4 Documentation Support
    5. 10.5 Support Resources
    6. 10.6 Trademarks
    7. 10.7 Electrostatic Discharge Caution
    8. 10.8 Glossary
  12. 11Mechanical, Packaging, and Orderable Information
  13. 12Revision History

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Timing Characteristics

VDD=3.3V, Ta=25℃ (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Wakeup Timing
tWAKE, SLEEP1 Wakeup time from SLEEP1 to RUN (1) 1.6 us
tWAKE, SLEEP2 Wakeup time from SLEEP2 to RUN (1) 2.2 us
tWAKE, STANDBY0 Wakeup time from STANDBY0 to RUN (1) 10.4 us
tWAKE, STANDBY1 Wakeup time from STANDBY1 to RUN (1) 10.4 us
tWAKE, STOP0 Wakeup time from STOP0 to RUN (SYSOSC enabled) (1) 7.6 us
tWAKE, STOP1 Wakeup time from STOP1 to RUN (SYSOSC enabled) (1) 9.6 us
tWAKE, STOP2 Wakeup time from STOP2 to RUN (SYSOSC disabled) (1) 8.4
tWAKEUP, SHDN Wakeup time from SHUTDOWN to RUN (2) Fast boot enabled 306 us
Fast boot disabled 314
Asynchronous Fast Clock Request Timing
tDELAY, SLEEP1 Delay time from edge of asynchronous request to first 32MHz MCLK edge Mode is SLEEP1 0.34 us
tDELAY, SLEEP2 Delay time from edge of asynchronous request to first 32MHz MCLK edge Mode is SLEEP2 0.94 us
tDELAY, STANDBY0 Delay time from edge of asynchronous request to first 32MHz MCLK edge Mode is STANDBY0 3 us
tDELAY, STANDBY1 Delay time from edge of asynchronous request to first 32MHz MCLK edge Mode is STANDBY1 3.1 us
tDELAY, STOP0 Delay time from edge of asynchronous request to first 32MHz MCLK edge Mode is STOP0 0.1 us
tDELAY, STOP1 Delay time from edge of asynchronous request to first 32MHz MCLK edge Mode is STOP1 2.4 us
tDELAY, STOP2 Delay time from edge of asynchronous request to first 32MHz MCLK edge Mode is STOP2 0.9 us
Startup Timing
tSTART, RESET Device cold startup time from reset/power-up (3) Fast boot enabled 300 us
Fast boot disabled 350
NRST Timing
tRST, BOOTRST Pulse length on NRST pin to generate BOOTRST ULPCLK≥4MHz 1.5 us
ULPCLK=32kHz 29
tRST, POR Pulse length on NRST pin to generate POR 1 s
The wake-up time is measured from the edge of an external wake-up signal (GPIO wake-up event) to the time that the first instruction of the user program is executed, with glitch filter disabled (FILTEREN=0x0) and fast wake enabled (FASTWAKEONLY=1) .
The wake-up time is measured from the edge of an external wake-up signal (IOMUX wake-up event) to the time that first instruction of the user program is executed.
The start-up time is measured from the time that VDD crosses VBOR0- (cold start-up) to the time that the first instruction of the user program is executed.