5 Device Comparison

Table 5-1 Device Comparison

DEVICE NAME ⁽¹⁾⁽⁴⁾	FLASH / SRAM (KB)	QUAL⁽²⁾	ADC CH.	GPAMP	UART/I2C/SPI	TIMG	GPIOs	5-V TOL. IO	PACKAGE [BODY SIZE] ⁽³⁾
MSPM0L1106xRHB	64 / 4	T	10	1	2 / 1 / 1	4	28	2	32 VQFN [5 mm × 5 mm]
MSPM0L1105xRHB	32 / 4	T	10	1	2 / 1 / 1	4	28	2	32 VQFN [5 mm × 5 mm]
MSPM0L1106xDGS28	64 / 4	T	10	1	2 / 1 / 1	4	24	2	28 VSSOP [7.1 mm × 3 mm]
MSPM0L1105xDGS28	32 / 4	T	10	1	2 / 1 / 1	4	24	2	28 VSSOP [7.1 mm × 3 mm]
MSPM0L1106xRGE	64 / 4	T	9	1	2 / 1 / 1	4	20	2	24 VQFN [4 mm × 4 mm]
MSPM0L1105xRGE	32 / 4	T	9	1	2 / 1 / 1	4	20	2	24 VQFN [4 mm × 4 mm]
MSPM0L1106xDGS20	64 / 4	T	8	1	2 / 1 / 1	4	17	2	20 VSSOP [5.1 mm × 3 mm]
MSPM0L1105xDGS20	32 / 4	T	8	1	2 / 1 / 1	4	17	2	20 VSSOP [5.1 mm × 3 mm]
MSPM0L1106xRTR	64 / 4	T	6	1	2 / 1 / 1	4	13	2	16 WQFN [3 mm × 2 mm]
MSPM0L1105xRTR	32 / 4	T	6	1	2 / 1 / 1	4	13	2	16 WQFN [3 mm × 2 mm]
MSPM0L1106xDYY	64 / 4	T	6	1	2 / 1 / 1	4	13	2	16 SOT [4.2 mm × 2 mm]
MSPM0L1105xDYY	32 / 4	T	6	1	2 / 1 / 1	4	13	2	16 SOT [4.2 mm × 2 mm]

(1) For the most current part, package, and ordering information for all available devices, see the Package Option Addendum in Section 12, or see the TI web site.

(2) Device qualification:

T = –40°C to 105°C

(3) The sizes shown here are approximations. For the package dimensions with tolerances, see the Mechanical Data in Section 12.

(4) For more information about the device name, see Section 10.1.