SLASFB5 May   2024 MSPM0L1228-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
    1. 5.1 Device Comparison Chart
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Diagrams
    2. 6.2 Pin Attributes
      1.      11
    3. 6.3 Signal Descriptions
      1.      13
      2.      14
      3.      15
      4.      16
      5.      17
      6.      18
      7.      19
      8.      20
      9.      21
      10.      22
      11.      23
      12.      24
      13.      25
      14.      26
      15.      27
      16.      28
      17.      29
    4. 6.4 Connections for Unused Pins
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Supply Current Characteristics
      1. 7.5.1 RUN/SLEEP Modes
      2. 7.5.2 STOP/STANDBY Modes
      3. 7.5.3 SHUTDOWN Mode
    6. 7.6  Power Supply Sequencing
      1. 7.6.1 Power Supply Ramp
      2. 7.6.2 POR and BOR
    7. 7.7  VBat Characteristics
    8. 7.8  Flash Memory Characteristics
    9. 7.9  Timing Characteristics
    10. 7.10 Clock Specifications
      1. 7.10.1 System Oscillator (SYSOSC)
      2. 7.10.2 Low Frequency Oscillator (LFOSC)
      3. 7.10.3 High Frequency Crystal/Clock
      4. 7.10.4 Low Frequency Crystal/Clock
    11. 7.11 Digital IO
      1. 7.11.1 Electrical Characteristics
      2. 7.11.2 Switching Characteristics
    12. 7.12 Analog Mux VBOOST
    13. 7.13 ADC
      1. 7.13.1 Electrical Characteristics
      2. 7.13.2 Switching Characteristics
      3. 7.13.3 Linearity Parameters
      4. 7.13.4 Typical Connection Diagram
    14. 7.14 Temperature Sensor
    15. 7.15 VREF
      1. 7.15.1 Electrical Characteristics ADC
      2. 7.15.2 Electrical Characteristics (Comparator)
      3. 7.15.3 Voltage Characteristics (ADC)
      4. 7.15.4 Voltage Characteristics (Comparator)
    16. 7.16 Comparator (COMP)
      1. 7.16.1 Comparator Electrical Characteristics
    17. 7.17 LCD
    18. 7.18 I2C
      1. 7.18.1 I2C Characteristics
      2. 7.18.2 I2C Filter
      3. 7.18.3 I2C Timing Diagram
    19. 7.19 SPI
      1. 7.19.1 SPI
      2. 7.19.2 SPI Timing Diagram
    20. 7.20 UART
    21. 7.21 TIMx
    22. 7.22 TRNG
      1. 7.22.1 TRNG Electrical Characteristics
      2. 7.22.2 TRNG Switching Characteristics
    23. 7.23 Emulation and Debug
      1. 7.23.1 SWD Timing
  9. 8 Detailed Description
    1. 8.1  CPU
    2. 8.2  Operating Modes
      1. 8.2.1 Functionality by Operating Mode (MSPM0Lx22x)
    3. 8.3  Security
    4. 8.4  Power Management Unit (PMU)
    5. 8.5  Clock Module (CKM)
    6. 8.6  DMA
    7. 8.7  Events
    8. 8.8  Memory
      1. 8.8.1 Memory Organization
      2. 8.8.2 Peripheral File Map
      3. 8.8.3 Peripheral Interrupt Vector
    9. 8.9  Flash Memory
    10. 8.10 SRAM
    11. 8.11 GPIO
    12. 8.12 IOMUX
    13. 8.13 ADC
    14. 8.14 Temperature Sensor
    15. 8.15 LFSS
    16. 8.16 VREF
    17. 8.17 COMP
    18. 8.18 TRNG
    19. 8.19 AESADV
    20. 8.20 Keystore
    21. 8.21 CRC
    22. 8.22 UART
    23. 8.23 I2C
    24. 8.24 SPI
    25. 8.25 IWDT
    26. 8.26 WWDT
    27. 8.27 RTC_A
    28. 8.28 Timers (TIMx)
    29. 8.29 LCD
    30. 8.30 Device Analog Connections
    31. 8.31 Input/Output Diagrams
    32. 8.32 Serial Wire Debug Interface
    33. 8.33 Bootstrap Loader (BSL)
    34. 8.34 Device Factory Constants
    35. 8.35 Identification
  10. 9 Applications, Implementation, and Layout
    1. 9.1 Typical Application
      1. 9.1.1 Schematic
  11. 10Device and Documentation Support
    1. 10.1 Getting Started and Next Steps
    2. 10.2 Device Nomenclature
    3. 10.3 Tools and Software
    4. 10.4 Documentation Support
    5. 10.5 Support Resources
    6. 10.6 Trademarks
    7. 10.7 Electrostatic Discharge Caution
    8. 10.8 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • AEC-Q100 Grade 1 qualified for automotive applications
  • Core
    • Arm® 32-bit Cortex®-M0+ CPU with memory protection unit, frequency up to 32MHz
  • PSA-L1 Certified
  • Operating characteristics
    • Extended temperature: –40°C up to 125°C
    • Wide supply voltage range: 1.62V to 3.6V
  • Memories
    • Up to 256KB of flash memory with ECC
      • Dual-bank with address swap with OTA updates
    • 32KB of SRAM with ECC or parity
    • 32B backup memory(1)
  • High-performance analog peripherals
    • 12-bit 1.68Msps analog-to-digital converter (ADC), up to 26 external channels
    • Configurable 1.4V or 2.5V internal shared voltage reference (VREF)
    • Comparator (COMP) with 8-bit reference DAC
    • Integrated temperature sensor
  • User interface
    • Ultra-low power segmented LCD controller supporting up to 8×51 and 4×55 LCD displays(2)
    Optimized low-power modes
    • RUN:105µA/MHz (CoreMark)
    • STOP: 60µA at 32kHz
    • STANDBY 1.2µA (VDD), 1.1µA (VBAT) with 32kHz, LFXT, RTC, and SRAM and registers fully retained
    • SHUTDOWN: 80nA (VDD), 1.1µA (VBAT) with 32kHz, LFXT, RTC, and I/O wake-up
  • Intelligent digital peripherals
    • 7-channel DMA controller
    • 15-channel event fabric signaling system
    • Six timers supporting up to 18 PWM outputs, all operational down to STANDBY mode
      • One 16-bit advanced timer with deadband
      • One 32-bit general-purpose timer
      • Four 16-bit general-purpose timers
    • Window-watchdog timer (WWDT)
    • Independent watchdog timer (IWDT) residing in the VBAT island
  • Communication interfaces
    • Five UART modules, with two supporting LIN, IrDA, DALI, smart card, Manchester
    • Three I2C modules supporting SMBus/PMBus and wakeup from STOP mode, with two supporting up to FM+ (1Mbps)

    • Two SPI modules supporting up to 16Mbps

  • Clock system
    • Internal 4MHz to 32MHz oscillator with up to ±1.2% accuracy (SYSOSC)
    • Internal 32kHz oscillator (LFOSC) with ±3% accuracy 1
    • External 4MHz to 32MHz crystal oscillator (HFXT)
    • External 32kHz crystal oscillator (LFXT)1
    • External LF1 and HF digital clock inputs
    • Digital clock output
  • Data integrity and encryption
    • AES accelerator with support for GCM/GMAC, CCM/CBC-MAC, CBC, CTR
    • Secure Key Storage for up to four AES keys
    • Flexible firewalls for protecting code and data
    • True random number generator (TRNG)
    • Cyclic redundancy checker (CRC-16, CRC-32)
  • VBAT island (auxiliary supply)1
    • Independent supply with dedicated VBAT pin
    • Real-time clock (RTC)
    • Tamper detection with timestamp
    • Independent watchdog timer (IWDT)
    • Scratch Pad Memory (SPM)
  • Flexible I/O features
    • Up to 73 total GPIOs
    • Up to 5 GPIOs supplied by VBAT pin1
  • Support for FuSa
    • ISO26262 ASIL B
  • Development support
    • 2-pin serial wire debug (SWD)
  • Package options
    • 80-pin LQFP (0.5mm and 0.4mm pitch options)
    • 64-pin LQFP (0.5mm and 0.4mm pitch options)
    • 48-pin LQFP, VQFN(3)
    • 32-pin VQFN3
    • 24-pin VQFN3
  • Family members (also see Device Comparison)
    • MSPM0L2228: 256KB flash, LCD
    • MSPM0L2227: 128KB flash, LCD
    • MSPM0L1228: 256KB flash
    • MSPM0L1227: 128KB flash
  • Development kits and software (also see Tools and Software)
    • LP-MSPM0L2228 LaunchPad™ development kit
    • MSP Software Development Kit (SDK)
1. Part of the LFSS (Low Frequency Subsystem) supplied by the VBAT pin residing in the VBAT island
2. MSPM0L222x devices only
3. VQFN packages have wettable flanks.